Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/12/2008WO2008069130A1 Robot device, treatment device with the robot device, ashing device, and ashing method
06/12/2008WO2008069088A1 Laser dicing sheet and method for manufacturing chip body
06/12/2008WO2008069074A1 Semiconductor device and method for manufacturing semiconductor device
06/12/2008WO2008069025A1 Semiconductor device
06/12/2008WO2008069014A1 Surface modifier for resist and method for the formation of resist patterns with the same
06/12/2008WO2008068979A1 Ultraviolet irradiation apparatus and ultraviolet irradiation method
06/12/2008WO2008068971A1 Positive resist composition for liquid immersion exposure and method of forming resist pattern
06/12/2008WO2008068967A1 Magnetic random access memory, and its manufacturing method
06/12/2008WO2008068943A1 Submerged wafer separating method, and submerged wafer separating apparatus
06/12/2008WO2008068903A1 Copolymer for semiconductor lithography and process for producing the same
06/12/2008WO2008068895A1 Defect detecting device, defect detecting method, information processing device, information processing method, and program therefor
06/12/2008WO2008068894A1 Defect detecting device, defect detecting method, information processing device, information processing method and program
06/12/2008WO2008068880A1 Apparatus for liquid treatment of treatment object
06/12/2008WO2008068864A1 Program, design method employing the program and semiconductor integrated circuit device
06/12/2008WO2008068859A1 Conveying equipment
06/12/2008WO2008068845A1 Pallet conveyance device and substrate inspection device
06/12/2008WO2008068815A1 Electron beam exposure device
06/12/2008WO2008068805A1 Semiconductor device, manufacturing method for semiconductor device, and designing method for multilayer wiring
06/12/2008WO2008068804A1 Semiconductor device and method for manufacturing same
06/12/2008WO2008068340A1 Complementary bipolar semiconductor device
06/12/2008WO2008067731A1 The application of non-ionic polymers in production of polishing liquid of self-etch-stop of polysilicon and usage of the same
06/12/2008WO2008046754A3 Mechanical stopper and method for transporting substrates in automatic placement machines
06/12/2008WO2008045886A3 Protection for the epitaxial structure of metal devices
06/12/2008WO2008042591A3 Local channel-boosting control implant for nand memory
06/12/2008WO2008039687A3 Method for manufacturing a gate sidewall spacer using an energy beam treatment
06/12/2008WO2008036810A3 Bi-layer capping of low-k dielectric films
06/12/2008WO2008036806A3 Method for forming a pre-metal dielectric layer using an energy beam treatment
06/12/2008WO2008024792B1 Low-k damage avoidance during bevel etch processing
06/12/2008WO2008017449A3 Composite structure for microlithography and optical arrangement
06/12/2008WO2008008411A3 Robotic die sorter with optical inspection system
06/12/2008WO2007127739A3 Three-dimensional packaging scheme for package types utilizing a sacrificail metal base
06/12/2008WO2007109682A3 Improved system and method for manufacturing laminated circuit boards
06/12/2008WO2007108964A3 Gaas integrated circuit device and method of attaching same
06/12/2008WO2007056682A3 Low voltage nanovolatile memory cell with electrically transparent control gate
06/12/2008WO2007042521A3 Production of self-organized pin-type nanostructures, and the rather extensive applications thereof
06/12/2008US20080141202 Semiconductor integrated circuit and method of designing the same
06/12/2008US20080140365 Simulation method, simulation system, and method of modifying mask pattern
06/12/2008US20080140330 Semiconductor device yield prediction system and method
06/12/2008US20080140229 Method for optimizing an industrial product, system for optimizing an industrial product and method for manufacturing an industrial product
06/12/2008US20080139855 comprising a chainlike perfluoroalkyne having 5 or 6 carbon atoms, preferably perfluoro-2-pentyne. This plasma reaction gas is suitable for dry etching for formation of a fine pattern, for plasma CVD for formation of a thin film, and for plasma ashing.
06/12/2008US20080139094 Polishing pad, method for processing polishing pad and method for producing substrate using it
06/12/2008US20080139090 Grinding machine having grinder head and method of manufacturing semiconductor device by using the grinding machine
06/12/2008US20080139089 Method of polishing hard crystal substrate and polishing oil slurry therefor
06/12/2008US20080139087 Substrate Polishing Apparatus And Substrate Polishing Method
06/12/2008US20080139075 Deposition Repair Apparatus And Methods
06/12/2008US20080139017 Electric connector and electrical connecting apparatus using the same
06/12/2008US20080139004 Light emission from silicon-based nanocrystals by sequential thermal annealing approaches
06/12/2008US20080139003 Barrier coating deposition for thin film devices using plasma enhanced chemical vapor deposition process
06/12/2008US20080139002 Liquid chemical supply apparatus for supplying liquid chemical onto substrate, and semiconductor device fabrication method using liquid chemical supply apparatus
06/12/2008US20080139001 Method for processing polysilazane film
06/12/2008US20080139000 Radical Processing of a Sub-Nanometer Insulation Film
06/12/2008US20080138999 Solar Cell Fabrication Using Extrusion Mask
06/12/2008US20080138998 Methods for manufacturing memory and logic devices using the same process without the need for additional masks
06/12/2008US20080138997 Two step etching of a bottom anti-reflective coating layer in dual damascene application
06/12/2008US20080138996 Etching Method and Etching Apparatus
06/12/2008US20080138995 Manufacturing Method of Semiconductor Device
06/12/2008US20080138994 Substrate Processing Method and Substrate Processing Apparatus
06/12/2008US20080138993 Plasma Processing Apparatus
06/12/2008US20080138992 Wide area radio frequency plasma apparatus for processing multiple substrates
06/12/2008US20080138991 Method of manufacturing a transistor
06/12/2008US20080138990 Polishing Composition and Polishing Method
06/12/2008US20080138989 Method to recover patterned semiconductor wafers for rework
06/12/2008US20080138988 Detection of clearance of polysilicon residue
06/12/2008US20080138987 Edge removal of silicon-on-insulator transfer wafer
06/12/2008US20080138986 Mask layer trim method using charged particle beam exposure
06/12/2008US20080138985 Method for improved formation of nickel silicide contacts in semiconductor devices
06/12/2008US20080138984 Organometallic Precursor Compounds
06/12/2008US20080138983 Method of forming tensile stress films for NFET performance enhancement
06/12/2008US20080138982 Semiconductor device
06/12/2008US20080138981 System and method for manufacturing contact
06/12/2008US20080138980 Method for manufacturing a metal pattern of a semiconductor device
06/12/2008US20080138979 Semiconductor integrated circuit device and manufacturing method of semiconductor integrated circuit device
06/12/2008US20080138978 Post passivation interconnection schemes on top of the ic chips
06/12/2008US20080138977 Semiconductor device and method of manufacturing the same
06/12/2008US20080138976 Semiconductor chip and production process therefor
06/12/2008US20080138975 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
06/12/2008US20080138974 Method of sputtering a nickel silicon alloy, especially useful for forming a solder bump barrier
06/12/2008US20080138973 Microelectronic devices and methods for forming interconnects in microelectronic devices
06/12/2008US20080138972 Via permeating supercritical carbon dioxide therein; etching; semiconductors
06/12/2008US20080138971 Manufacturing method of semiconductor device
06/12/2008US20080138970 Gate structure and method for fabricating the same, and method for fabricating memory and cmos transistor layout
06/12/2008US20080138969 Method of Manufacturing Semiconductor Device
06/12/2008US20080138968 Plasma immersed ion implantation process using balanced etch-deposition process
06/12/2008US20080138967 Plasma immersed ion implantation process
06/12/2008US20080138966 Method of fabricating a densified nanoparticle thin film with a set of occluded pores
06/12/2008US20080138965 Amorphous Si/Au eutectic wafer bonding structure
06/12/2008US20080138964 Formation of Epitaxial Layer Containing Silicon and Carbon
06/12/2008US20080138963 Method of manufacturing a semiconductor device
06/12/2008US20080138962 Manufacturing Method of Semiconductor Device
06/12/2008US20080138961 Wafer Bonding Method of System in Package
06/12/2008US20080138960 Method of manufacturing a stack-type semiconductor device
06/12/2008US20080138959 Method For Producing Semiconductor Wafer
06/12/2008US20080138958 Method for manufacturing device isolation film of semiconductor device
06/12/2008US20080138957 Triple alignment substrate method and structure for packaging devices
06/12/2008US20080138956 Manufacturing method of semiconductor device
06/12/2008US20080138955 Formation of epitaxial layer containing silicon
06/12/2008US20080138954 High voltage ldmos
06/12/2008US20080138953 Methods of Making Power Semiconductor Devices with Thick Bottom Oxide Layer
06/12/2008US20080138952 Recess channel transistor for preventing deterioration of device characteristics due to misalignment of gate layers and method of forming the same
06/12/2008US20080138951 Method for fabricating nonvolatile memory device