| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 06/05/2008 | US20080127487 Method for placing a component on a substrate, as well as such a device |
| 06/05/2008 | US20080127467 Semiconductor Manufacturing Apparatus and Manufacturing of a Semiconductor Device |
| 06/05/2008 | DE19804748B4 Anordnung und Verfahren der Isolierung gegen mechanische Spannung bei der Befestigung von Halbleiterchips Arrangement and method of the insulation against mechanical stress at the mounting of semiconductor chips |
| 06/05/2008 | DE112006000717T5 Chip-Scale-Packung Chip-scale package |
| 06/05/2008 | DE112005003638T5 Verfahren zur Erstellung von Fotomaskenstrukturdaten, mittels der Fotomaskenstrukturdaten erstellte Fotomaske und Verfahren zur Herstellung einer Halbleitervorrichtung mittels der Fotomaske Method for creating photo mask pattern data generated by the photo mask pattern data photomask and method for manufacturing a semiconductor device using the photomask |
| 06/05/2008 | DE112005003629T5 IC-Baugruppe und Verfahren zur Herstellung einer IC-Baugruppe IC package and method for manufacturing an IC module |
| 06/05/2008 | DE10351014B4 Diodenstruktur und integrale Leistungsschaltanordnung mit Low-Leakage-Diode Diode structure and integral power switching device with low leakage diode |
| 06/05/2008 | DE10335100B4 Verfahren zur Herstellung verkürzter Seitenwandabstandselemente für eine Polysiliziumleitung und Verfahren zur Herstellung eines Feldeffekttransistors A process for producing a shortened sidewall spacers for a polysilicon line and method of manufacturing a field effect transistor |
| 06/05/2008 | DE10312662B4 Halbleitereinrichtungsherstellungsanordnung und Halbleitereinrichtungsherstellungsverfahren zum Bilden von Halbleiterchips durch Teilen von Halbleiterwafern A semiconductor device manufacturing apparatus and semiconductor device manufacturing method for forming semiconductor chips by dividing the semiconductor wafers |
| 06/05/2008 | DE10227342B4 Verfahren zur Verbindung einer integrierten Schaltung mit einem Substrat und entsprechende Schaltungsanordnung A method for bonding an integrated circuit having a substrate and corresponding circuit arrangement |
| 06/05/2008 | DE102007056741A1 Spannungsmodulierter Transistor Modulated voltage transistor |
| 06/05/2008 | DE102007056590A1 Semiconductor device i.e. power transistor, for use as switch, has floating gate to control current flow between source and drain areas based on programmed or erased state of gate, and tunneling gate programming and/or erasing floating gate |
| 06/05/2008 | DE102007056242A1 Pattern e.g. mask, writing device for use on target workpiece, has deflection plate to deflect electron beam with charged particles based on electron beam irradiation time, and aperture to block deflection of electron beam by plate |
| 06/05/2008 | DE102007054866A1 Halbleitermodul und Verfahren zur Herstellung desselben Semiconductor module and method of manufacturing the same |
| 06/05/2008 | DE102007040792A1 Device e.g. semiconductor circuit, manufacturing method, involves dicing devices from substrate e.g. silicon substrate, cleaning surface of volatile protective agent e.g. octamethylcyclotetrasiloxane, and evaporating protective agent |
| 06/05/2008 | DE102007023666A1 Semiconductor component e.g. silicon chip, has passivation layer extended on contact distributor layer and comprising opening that is arranged on section of contact distributor layer, and connection contact arranged on opening |
| 06/05/2008 | DE102006057718A1 Semiconductor component e.g. semiconductor laser diode, has relaxation layer arranged between functional layer and solder and/or between solder and carrier substrate, where relaxation layer has thickness of micrometers, and is made of gold |
| 06/05/2008 | DE102006057385A1 Magnetic field sensor's measuring accuracy verifying method, involves positioning chip at field coil that is supplied with current, and adjusting current using measuring coil based on magnetic flow density based measured value |
| 06/05/2008 | DE102006057075A1 Chucking surface 's shape measuring method for wafer-chuck, involves reproducing mechanical contact requirements arising in chemical mechanical polishing process between wafer-chuck, backing film, wafer, polishing pad and polishing table |
| 06/05/2008 | DE102006056626A1 Conductive barrier layer producing method for manufacturing integrated circuit, involves depositing layer on exposed surfaces by self-restricted deposition technique, and providing surface with characteristics at reduced deposition rate |
| 06/05/2008 | DE102006056625A1 Lithography process's focus parameter adjustment evaluating method for forming and manufacturing of microstructure unit i.e. integrated circuit, involves evaluating specified focusing adjustment based on two measuring data |
| 06/05/2008 | DE102006056624A1 Forming an adjusted copper compound in the copper-containing metal surface comprises applying a precursor material on the surface, forming a semiconductor component in a first dielectric layer and activating a chemical reaction of nitrogen |
| 06/05/2008 | DE102006056621A1 Substrates transporting and handling method for forming application specific integrated circuits, involves transporting substrate in transport container between two manufacturing sites, where substrate has front side and back side |
| 06/05/2008 | DE102006056620A1 Semiconductor structure forming method for use in e.g. memory device, involves providing semiconductor substrate comprising layer of dielectric material, where recess is provided in layer of dielectric material |
| 06/05/2008 | DE102006056598A1 Microstructure feature e.g. microprocessor manufacturing method, involves forming protection layer on back side of substrate e.g. silicon-on-insulator substrates, using silicon carbide material |
| 06/05/2008 | DE102006056597A1 Tool controller for use in process tool system e.g. deposition tool, has job management unit interrupting currently processed job when one process priority for currently processed job is lower than process priority for job to be processed |
| 06/05/2008 | DE102006056560A1 Parameter's e.g. reference voltage, target value determining method for e.g. dynamic RAM, involves determining target values for parameter to be trimmed for respective temperatures, where values and temperatures differ from each other |
| 06/05/2008 | DE102006056361A1 Modul mit polymerhaltigem elektrischen Verbindungselement Polymer-module with electrical connection element |
| 06/05/2008 | DE102006049354B3 Verfahren zur Herstellung eines Anschlusskontakts auf einem Halbleiterkörper A method for producing a connection contact on a semiconductor body |
| 06/05/2008 | DE102006045688B3 Trench capacitor's memory electrode and selection transistor i.e. self-locking n-channel-FET, connecting structure, has connecting material with barrier layer utilized as diffusion barrier, made of silicon nitride and having small thickness |
| 06/05/2008 | DE10111200B4 Integrierte Halbleiterschaltung A semiconductor integrated circuit |
| 06/05/2008 | CA2669949A1 Method of manufacturing silicon carbide semiconductor device |
| 06/04/2008 | EP1928021A1 Method of manufacturing a semiconductor device with dual fully silicided gate |
| 06/04/2008 | EP1928020A1 Method of manufacturing a semiconductor heterostructure |
| 06/04/2008 | EP1928019A2 Power supply apparatus and deposition method using the power supply apparatus |
| 06/04/2008 | EP1928018A2 Method for attaching and peeling pressure-sensitive adhesive sheet, and attaching apparatus of pressure-sensitive adhesive sheet and peeling apparatus of pressure-sensitive adhesive sheet |
| 06/04/2008 | EP1928017A1 Plasma reactor substrate mounting surface texturing |
| 06/04/2008 | EP1928016A1 Silicon wafer and method for manufacturing the same |
| 06/04/2008 | EP1928015A2 Organosilane compounds for modifying etch properties of silicon oxide and silicon nitride films |
| 06/04/2008 | EP1928014A2 Charge trap layer for a charge trap semiconductor memory device and method of manufacturing the same |
| 06/04/2008 | EP1928013A2 Formation and treatment of epitaxial layer containing silicon and carbon |
| 06/04/2008 | EP1928012A2 Semiconductor device and method of its manufacture |
| 06/04/2008 | EP1928011A2 Manufacturing method of capacitor electrode, manufacturing system of capacitor electrode, and storage medium |
| 06/04/2008 | EP1927605A1 Polymer material, foam obtained from same, and polishing pad using those |
| 06/04/2008 | EP1927592A1 Oxetane-containing compound, photoresist composition having the same, method of preparing pattern using the photoresist composition, and inkjet print head including polymerization products of the oxetane-containing compound |
| 06/04/2008 | EP1927434A1 CMP conditioner |
| 06/04/2008 | EP1927433A1 Device for separating two disc-shaped elements positioned one above the other when removing one |
| 06/04/2008 | EP1927138A1 Semiconductor device |
| 06/04/2008 | EP1927137A1 Method for cutting solid-state image pickup device |
| 06/04/2008 | EP1927136A2 Method of manufacturing semiconductor device with different metallic gates |
| 06/04/2008 | EP1927135A2 Method of manufacturing semiconductor device with different metallic gates |
| 06/04/2008 | EP1927134A2 A structure for a semiconductor device and a method of manufacturing the same |
| 06/04/2008 | EP1927133A2 Method of manufacturing a semiconductor device with an isolation region and a device manufactured by the method |
| 06/04/2008 | EP1927132A2 Power semiconductor module and a method for the production thereof |
| 06/04/2008 | EP1927131A2 Improved, higher selectivity, method for passivating short circuit current paths in semiconductor devices |
| 06/04/2008 | EP1927130A1 A method of and an apparatus for processing a substrate |
| 06/04/2008 | EP1927129A2 Electroplating method for coating a substrate surface with a metal |
| 06/04/2008 | EP1927128A2 Multiple low and high k gate oxides on single gate for lower miller capacitance and improved drive current |
| 06/04/2008 | EP1927127A2 High throughput crystallization of thin films |
| 06/04/2008 | EP1927117A1 A trimmable film resistor and a method for forming and trimming a film resistor |
| 06/04/2008 | EP1926843A1 Doping of particulate semiconductor materials |
| 06/04/2008 | EP1926580A1 Reduction of attraction forces between silicon wafers |
| 06/04/2008 | EP1738407A4 Arrayed ultrasonic transducer |
| 06/04/2008 | EP1695379A4 Contoured insulator layer of silicon-on-onsulator wafers and process of manufacture |
| 06/04/2008 | EP1552549A4 Method of fabricating a self-aligned non-volatile memory cell |
| 06/04/2008 | EP1435098B1 Mram bit line word line architecture |
| 06/04/2008 | EP1297385B1 Material and method for making an electroconductive pattern |
| 06/04/2008 | EP1153739B1 Aerogel substrate and method for preparing the same |
| 06/04/2008 | EP1141439A4 Distributed control system architecture and method for a material transport system |
| 06/04/2008 | EP1082757B1 Semiconductor device with transparent link area for silicide applications and fabrication thereof |
| 06/04/2008 | EP1033750B1 Vacuum processing device |
| 06/04/2008 | CN201069767Y Supporting hook for silicon sheet plating film |
| 06/04/2008 | CN201069448Y Vertical probe interface plate |
| 06/04/2008 | CN101194547A Electronic component thermo-compression tool, and electronic component mounting apparatus and mounting method |
| 06/04/2008 | CN101194364A Semiconductor device including a superlattice and adjacent semiconductor layer with doped regions defining a semiconductor junction |
| 06/04/2008 | CN101194359A Sub-mount and its manufacturing method |
| 06/04/2008 | CN101194358A Semiconductor integrated circuit |
| 06/04/2008 | CN101194357A 半导体集成电路装置 The semiconductor integrated circuit device |
| 06/04/2008 | CN101194356A Technique for forming copper-containing lines embedded in low-k dielectric by providing a stiffening layer |
| 06/04/2008 | CN101194355A Multi-bit nanocrystal memory |
| 06/04/2008 | CN101194354A Aligner |
| 06/04/2008 | CN101194353A Method for classifying semiconductor device |
| 06/04/2008 | CN101194352A Semiconductor package pickup apparatus |
| 06/04/2008 | CN101194351A Method for chemical vapor deposition in high aspect ratio spaces |
| 06/04/2008 | CN101194350A Raised source and drain process with disposable spacers |
| 06/04/2008 | CN101194349A Technique for reducing silicide non-uniformities by adapting a vertical dopant profile |
| 06/04/2008 | CN101194348A Method of fabricating a heterojunction bipolar transistor |
| 06/04/2008 | CN101194347A Methods of etching nickel silicide and cobalt silicide and methods of forming conductive lines |
| 06/04/2008 | CN101194346A Improved recessed drain extensions in transistor device |
| 06/04/2008 | CN101194345A Plasma nitriding method, method for manufacturing semiconductor device and plasma processing apparatus |
| 06/04/2008 | CN101194344A UV curing process for spin-on dielectric materials used in pre-metal and/or shallow trench isolation applications |
| 06/04/2008 | CN101194276A Semiconductor device |
| 06/04/2008 | CN101194214A Stage apparatus |
| 06/04/2008 | CN101194210A Exposing method and device |
| 06/04/2008 | CN101194052A Low basal plane dislocation bulk grown SiC wafers |
| 06/04/2008 | CN101194040A Rotating substrate support and methods of use |
| 06/04/2008 | CN101193811A Substrate transfer apparatus |
| 06/04/2008 | CN101193732A Device and method for positioning and blocking thin substrates on a cut substrate block |
| 06/04/2008 | CN101193728A Advanced chemical mechanical polishing system with smart endpoint detection |
| 06/04/2008 | CN101193724A Method and apparatus for forming a low profile wire loop |