Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/17/2008US7387936 Semiconductor device and method of fabricating the same
06/17/2008US7387935 Memory cell unit, nonvolatile semiconductor storage device including memory cell unit, and memory cell array driving method
06/17/2008US7387934 Nonvolatile semiconductor memory and manufacturing method for the same
06/17/2008US7387933 EEPROM device and method of fabricating the same
06/17/2008US7387931 Semiconductor memory device with vertical channel transistor and method of fabricating the same
06/17/2008US7387930 Method of fabricating a bottle trench and a bottle trench capacitor
06/17/2008US7387929 Capacitor in semiconductor device and method of manufacturing the same
06/17/2008US7387928 Device and method for making air, gas or vacuum capacitors and other microwave components
06/17/2008US7387927 Reducing oxidation under a high K gate dielectric
06/17/2008US7387926 Method for manufacturing CMOS image sensor
06/17/2008US7387925 Integration of strained Ge into advanced CMOS technology
06/17/2008US7387924 Polycrystalline SiGe junctions for advanced devices
06/17/2008US7387923 ISFET using PbTiO3 as sensing film
06/17/2008US7387922 Laser irradiation method, method for manufacturing semiconductor device, and laser irradiation system
06/17/2008US7387921 Method of manufacturing semiconductor device
06/17/2008US7387920 Method of manufacturing thin film transistor array panel
06/17/2008US7387919 Methods of fabricating a semiconductor device having a node contact structure of a CMOS inverter
06/17/2008US7387918 Method of forming a silicon controlled rectifier structure with improved punch through resistance
06/17/2008US7387917 BGA package substrate and method of fabricating same
06/17/2008US7387916 Sharp corner lead frame
06/17/2008US7387915 Method for manufacturing heat sink of semiconductor device
06/17/2008US7387914 Semiconductor device and process for fabrication thereof
06/17/2008US7387913 3D optoelectronic micro system
06/17/2008US7387912 Packaging of electronic chips with air-bridge structures
06/17/2008US7387911 Application of a thermally conductive thin film to a wafer backside prior to dicing to prevent chipping and cracking
06/17/2008US7387910 Method of bonding solder pads of flip-chip package
06/17/2008US7387909 Methods of forming assemblies displaying differential negative resistance
06/17/2008US7387908 CMOS imager with enhanced transfer of charge and low voltage operation and method of formation
06/17/2008US7387907 Image sensor with optical guard ring and fabrication method thereof
06/17/2008US7387906 Multi-wavelength surface emitting laser and method for manufacturing the same
06/17/2008US7387904 Light emitting element and manufacturing method thereof, and light emitting device using the light emitting element
06/17/2008US7387903 Method for manufacturing layer pattern, method for manufacturing wiring, and method for manufacturing electronic equipment
06/17/2008US7387902 Methods for packaging image sensitive electronic devices
06/17/2008US7387869 Method of forming pattern for semiconductor device
06/17/2008US7387868 Treatment of a dielectric layer using supercritical CO2
06/17/2008US7387867 Manufacturing method of semiconductor integrated circuit device
06/17/2008US7387866 Photolithography process using multiple anti-reflective coatings
06/17/2008US7387865 mixture of sulfonium or iodonium acid generators and nonionic surfactants, used to form analysis apparatus on solid substrates
06/17/2008US7387859 Method for measuring overlay shift
06/17/2008US7387854 first mask is an isolated line pattern and dummy patterns, second pattern is positioned to completely cover the isolated line pattern on the wafer; remove the dummy patterns
06/17/2008US7387835 Silicon carbide-coated carbonaceous material and carbonaceous material to be coated with silicon carbide
06/17/2008US7387816 Scratch resistant coated glass article including layer(s) resistant to fluoride-based etchant(s), and method of making article using combustion CVD
06/17/2008US7387743 ashing the resist film covers hard mask containing sio2, which lays on top of silicon oxide film, a Si3N4 film laminate with SiO2 film, oxidizing surface of hard mask with o2 plasma, main etching Si3N4 film using patterned har mask as mask, selective overetching Si3N4 to suppress exposure of SiO2 film
06/17/2008US7387741 Power module member manufactured by wet treatment, and wet treatment method and wet treatment equipment thereof
06/17/2008US7387739 Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrument
06/17/2008US7387738 Providing a substrate, electrodes that reside within a target area; passing a gas mixture comprising a reducing gas through the target area; supplying an amount of energy toand/or electrodes to generate electrons; contacting substrate with negatively charged reducing gas to reduce metal oxides
06/17/2008US7387717 Method of performing electrolytic treatment on a conductive layer of a substrate
06/17/2008US7387701 Etchant fume exhaust apparatus
06/17/2008US7387689 Methods for drying semiconductor wafer surfaces using a plurality of inlets and outlets held in close proximity to the wafer surfaces
06/17/2008US7387687 Support system for a treatment apparatus
06/17/2008US7387686 Film formation apparatus
06/17/2008US7387685 Apparatus and method for depositing materials onto microelectronic workpieces
06/17/2008US7387683 Discharging unit for discharging a photosensitive material, coater having the discharging unit, and apparatus for coating a photosensitive material having the coater
06/17/2008US7387679 Silicon carbide single crystal and method and apparatus for producing the same
06/17/2008US7387678 GaN substrate and method of fabricating the same, nitride semiconductor device and method of fabricating the same
06/17/2008US7387677 Substrate for epitaxy and method of preparing the same
06/17/2008US7387455 Substrate processing device, substrate processing method, and developing device
06/17/2008US7387395 Optical units
06/17/2008US7387259 Hybrid card
06/17/2008US7387229 Method of forming bumps on a wafer utilizing a post-heating operation, and an apparatus therefore
06/17/2008US7387132 Apparatus for treating wafer
06/17/2008US7387131 Processing apparatus and substrate processing method
06/17/2008US7387119 Dicing saw with variable indexing capability
06/17/2008US7387081 Plasma reactor including helical electrodes
06/17/2008US7386944 Method and apparatus for drying a wafer, and an apparatus for cleaning and drying a wafer
06/17/2008US7386934 Double layer patterning and technique for milling patterns for a servo recording head
06/12/2008WO2008070748A2 Method and system for providing a metal oxide semiconductor device having a drift enhanced channel
06/12/2008WO2008070632A1 Phosphorus-stabilized transition metal oxide diffusion barrier
06/12/2008WO2008070624A1 Inert barrier region for source/drain regions of sonos memory devices
06/12/2008WO2008070528A2 Precision printing electroplating through plating mask on a solar cell substrate
06/12/2008WO2008070523A2 Dual crystal orientation and interface passivation in semiconductor device and method
06/12/2008WO2008070491A2 Structure and method for forming a planar schottky contact
06/12/2008WO2008070429A1 Method and system for fabricating semiconductor components with through interconnects and back side redistribution conductors
06/12/2008WO2008070266A2 Methods for manufacturing three-dimensional thin-film solar cells
06/12/2008WO2008070188A1 Methods and apparatus for multi-exposure patterning
06/12/2008WO2008070115A2 Substrates with slotted metals and related methods
06/12/2008WO2008070004A2 High throughput wafer notch aligner
06/12/2008WO2008069805A1 Process for coating a bumped semiconductor wafer
06/12/2008WO2008069781A1 Planarization composition for metal surfaces comprising an alumina hydrate abrasive
06/12/2008WO2008069765A1 A stacked silicon-germanium nanowire structure and a method of forming the same
06/12/2008WO2008069606A1 Method of manufacturing integrated circuit having stacked structure and the integrated circuit
06/12/2008WO2008069513A1 Process control method using apparatus for measuring substrate warpage, recording medium in which program for executing the process method is recorded and process apparatus for performing the process method
06/12/2008WO2008069485A1 The electronic devices using carbon nanotubes having vertical structure and the manufacturing method thereof
06/12/2008WO2008069432A1 Mask pattern for selective area growth of semiconductor layer and selective area growth method using the mask pattern for semiconductor layer
06/12/2008WO2008069325A1 Semiconductor storage device and semiconductor device
06/12/2008WO2008069307A1 Method and apparatus for modifying integrated circuit by laser
06/12/2008WO2008069305A1 Exposure apparatus and conveyance apparatus
06/12/2008WO2008069277A1 Sram device
06/12/2008WO2008069259A1 Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device
06/12/2008WO2008069214A1 Cu ALLOY WIRING FILM, FLAT PANEL DISPLAY TFT ELEMENT USING THE Cu ALLOY WIRING FILM, AND Cu ALLOY SPUTTERING TARGET FOR MANUFACTURING THE Cu ALLOY WIRING FILM
06/12/2008WO2008069212A1 Semiconductor wafer, and semiconductor device manufacturing method using the wafer
06/12/2008WO2008069211A1 Cleaning liquid, cleaning method, liquid generating apparatus, exposure apparatus and device manufacturing method
06/12/2008WO2008069203A1 Substrate processing apparatus and substrate processing method
06/12/2008WO2008069179A1 Sealing material and mounting method using the sealing material
06/12/2008WO2008069178A1 Sealing material and mounting method using the sealing material
06/12/2008WO2008069157A1 Apparatus and method for plasma processing
06/12/2008WO2008069151A1 Exposure apparatus, exposure method, and device production method
06/12/2008WO2008069145A1 Insulating-gate fet and its manufacturing method
06/12/2008WO2008069136A1 Method for purifying chemical added with chelating agent
06/12/2008WO2008069135A1 Ic chip mounting package