Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/18/2008EP1933215A1 Manufacturing system, manufacturing method, management device, managing method, and program
06/18/2008EP1932403A1 Method for generation of metal surface structures and apparatus therefor
06/18/2008EP1932186A1 Composite host-seed substrate for growing an iii-v light-emitting device
06/18/2008EP1932183A1 Transistor element, display device and these manufacturing methods
06/18/2008EP1932174A1 Oxidizing aqueous cleaner for the removal of post-etch residues
06/18/2008EP1932173A2 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
06/18/2008EP1932172A1 Double gate non-volatile memory device and method of manufacturing
06/18/2008EP1932171A1 Finfet-based non-volatile memory device
06/18/2008EP1932170A2 Systems and methods for determination of endpoint of chamber cleaning processes
06/18/2008EP1931975A1 Measuring method, arrangement and software product
06/18/2008EP1931597A1 Cerium oxide powder for one-component cmp slurry, preparation method thereof, one-component cmp slurry composition comprising the same, and method of shallow trench isolation using the slurry
06/18/2008EP1869696B1 Process for the formation of miniaturized getter deposits and getterdeposits so obtained
06/18/2008EP1829104B1 Thermally controlled fluidic self-assembly
06/18/2008EP1809716B1 Nanotube-based directionally-conductive adhesive
06/18/2008EP1738410B1 Method for fabricating strained silicon-on-insulator structures and strained silicon-on -insulator structures formed thereby
06/18/2008EP1702357B1 Substrate with determinate thermal expansion coefficient
06/18/2008EP1561236B1 System of transporting and storing containers of semiconductor wafers
06/18/2008EP1546221A4 PHOTORESISTS, FLUORINATED POLYMERS AND PROCESSES FOR 157 nm MICROLITHOGRAPHY
06/18/2008EP1540725B1 Method of manufacture of a semi-conductor component with condensators buried in the substrate and insulated component layer thereof
06/18/2008EP1474724A4 Halogenated anti-reflective coatings
06/18/2008EP1467839A4 Method and apparatus for applying downward force on wafer during cmp
06/18/2008EP1375689B1 Member having separation structure and method for manufacture thereof
06/18/2008EP1116099B1 Prealigner and planarity teaching station
06/18/2008EP1060443B1 Improved modulator design for pattern generator
06/18/2008EP0959498B1 Semiconductor device, semiconductor chip mounting substrate, methods of manufacturing the device and substrate, adhesive, and adhesive double coated film
06/18/2008CN201075384Y Wafer holder for thermal treatment
06/18/2008CN201075383Y Support
06/18/2008CN201075382Y Wafer direction detecting apparatus of wafer back face marking machine
06/18/2008CN201075381Y Resin conveying device of integrated circuit automatic packaging system
06/18/2008CN201075380Y Plastic package die
06/18/2008CN201075379Y Wafer marking flat base apparatus of wafer back face marking machine
06/18/2008CN101203955A 电子控制单元及其制造方法 The method of manufacturing an electronic control unit and
06/18/2008CN101203954A Semiconductor device and method for making the same
06/18/2008CN101203953A Semiconductor device and method for making the same
06/18/2008CN101203952A Interface between conveyor and semiconductor process tool load port
06/18/2008CN101203951A Layout modification to eliminate line bending caused by line material shrinkage
06/18/2008CN101203950A Organic semiconductor film forming method, organic semiconductor film and organic thin film transistor
06/18/2008CN101203949A Method for organic semiconductor material thin film formation and process for producing organic thin film transistor
06/18/2008CN101203948A Method of preparing zinc oxide nanorods on a substrate by chemical spray pyrolysis
06/18/2008CN101203947A Complementary metal oxide semiconductor integrated circuit using raised source drain and replacement metal gate
06/18/2008CN101203946A Semiconductor device
06/18/2008CN101203945A Method of forming a high dielectric constant film and method of forming a semiconductor device
06/18/2008CN101203944A Vapor phase treatment of dielectric materials
06/18/2008CN101203943A Method for producing dislocation-free strained crystalline films
06/18/2008CN101203942A Narrow semiconductor trench structure
06/18/2008CN101203941A CVD apparatus which has rotation type heater and the control method
06/18/2008CN101203940A Method for production of silicon carbide layer, gallium nitride semiconductor device and silicon substrate
06/18/2008CN101203939A Diamond medical devices
06/18/2008CN101203938A Chemical method of die cutting
06/18/2008CN101203937A Equipment for cleaning down circuit substrate
06/18/2008CN101203802A 2-dimensional image display device, illumination light source, and exposure illumination device
06/18/2008CN101203626A Method for forming a dielectric film and novel precursors for implementing said method
06/18/2008CN101203445A Work transfer system
06/18/2008CN101203354A Translating/turning 2-degree-of-freedom stage device and 3-degree-of-freedom stage device using the same
06/18/2008CN101203089A Multilayer printed circuit board
06/18/2008CN101203087A Plasma treatment device
06/18/2008CN101203086A Plasma treatment device
06/18/2008CN101202328A Electronic device and method of manufacturing the same
06/18/2008CN101202322A Method for determining the thickness of phosphor layer and method for manufacturing light emitting apparatus
06/18/2008CN101202314A ZnO diode and method of forming the same
06/18/2008CN101202312A Read-only memory and its manufacture method
06/18/2008CN101202311A Floating gate flash memory device structure and method for making floating gate
06/18/2008CN101202307A Floating gate flash memory device and method for making floating gate
06/18/2008CN101202306A Thin film transistor substrate and its producing method
06/18/2008CN101202305A Semiconductor device with improved source and drain and method of manufacturing the same
06/18/2008CN101202301A Gate conductor structure and method of forming
06/18/2008CN101202300A Semiconductor device and method of manufacturing the same
06/18/2008CN101202299A Organic light emitting diode display device and method of manufacturing the same
06/18/2008CN101202296A Thin film transistor device, image display device and manufacturing method thereof
06/18/2008CN101202293A Image sensor and method of manufacture
06/18/2008CN101202290A Pixel structure and method for repairing thereof
06/18/2008CN101202289A Thin film transistor substrate and liquid crystal display apparatus having the same
06/18/2008CN101202288A Semiconductor device and manufacturing method thereof
06/18/2008CN101202287A Array substrate, method of manufacturing the same, and method of repairing line in the same
06/18/2008CN101202286A Array substrate, display device, and method for manufacturing the array substrate
06/18/2008CN101202285A Semiconductor and producing method thereof
06/18/2008CN101202283A Polysilicon capacitance coupling OTP device and method of manufacture
06/18/2008CN101202282A Semiconductor device and method for manufacturing the same
06/18/2008CN101202274A Multi-chip electronic circuit module and a method of manufacturing
06/18/2008CN101202272A Sealing structure for MEMS devices and method of the same
06/18/2008CN101202271A Light source component and method for making
06/18/2008CN101202270A LED module set and method of manufacture
06/18/2008CN101202269A Pixel structure having concave-convex line structures and method for making the same
06/18/2008CN101202268A Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method
06/18/2008CN101202266A Chip scale package for power devices and method for making the same
06/18/2008CN101202263A Encapsulation structure and method for forming the same
06/18/2008CN101202262A Semiconductor device and method for manufacturing the same
06/18/2008CN101202261A Element mounting structure and element mounting method
06/18/2008CN101202260A Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
06/18/2008CN101202259A Chip stack encapsulation structure, inner embedded type chip packaging structure and method of manufacture
06/18/2008CN101202257A Semiconductor device and method for manufacturing the same
06/18/2008CN101202256A Power amplifier
06/18/2008CN101202254A Semiconductor device and method for manufacturing the same
06/18/2008CN101202253A Wafer level package with good coefficient of thermal expansion efficiency performance and method of the same
06/18/2008CN101202252A Glue film and chip encapsulation manufacture process using the glue film
06/18/2008CN101202251A Method for etching silicon groove on insulator
06/18/2008CN101202250A Semiconductor memory and method for forming same
06/18/2008CN101202249A Semiconductor memory device and method of manufacturing the same
06/18/2008CN101202248A Image sensor and fabricating method thereof
06/18/2008CN101202247A MOS device structure and method of manufacture