Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/12/2008US20080138950 Method To Increase Charge Retention Of Non-Volatile Memory Manufactured In A Single-Gate Logic Process
06/12/2008US20080138949 Semiconductor device with amorphous silicon monos memory cell structure and method for manufacturing thereof
06/12/2008US20080138948 Methods of etching into silicon oxide-containing material, methods of forming container capacitors, and methods of forming DRAM arrays
06/12/2008US20080138947 Method and resulting structure for dram cell and peripheral transistor
06/12/2008US20080138945 Method for fabricating trench MOSFET
06/12/2008US20080138944 Manufacturing method of semiconductor device
06/12/2008US20080138943 Semiconductor device, method of manufacturing the same, and method of designing the same
06/12/2008US20080138942 Thin film transistor array panel and method for manufacturing the same
06/12/2008US20080138941 Method for fabricating soi device
06/12/2008US20080138940 Method of manufacturing thin film transistor and method of manufacturing liquid crystal display device using the same
06/12/2008US20080138939 Formation of in-situ phosphorus doped epitaxial layer containing silicon and carbon
06/12/2008US20080138938 Die positioning for packaged integrated circuits
06/12/2008US20080138937 Semiconductor device and fabrication method thereof
06/12/2008US20080138936 Method for laminating substrate and apparatus using the method
06/12/2008US20080138935 Chip scale package structure and method for fabricating the same
06/12/2008US20080138934 Method of manufacturing multi-stack package
06/12/2008US20080138933 Method of making semiconductor device
06/12/2008US20080138932 Semiconductor device and method of manufacturing semiconductor device
06/12/2008US20080138927 Systems and Methods for Fabricating Crystalline Thin Structures Using Meniscal Growth Techniques
06/12/2008US20080138926 Two epitaxial layers to reduce crosstalk in an image sensor
06/12/2008US20080138925 Drop generator
06/12/2008US20080138924 Method of fabricating electric field sensor having electric field shield
06/12/2008US20080138923 Method of forming suspended structure
06/12/2008US20080138922 Micro-electro mechanical device made from mono-crystalline silicon and method of manufacture therefore
06/12/2008US20080138920 Display employing organic material
06/12/2008US20080138917 Method and apparatus for processing a wafer
06/12/2008US20080138916 Pattern shape evaluation method, program, and semiconductor device manufacturing method
06/12/2008US20080138915 Method of fabricating semiconductor device
06/12/2008US20080138745 Polyamic acids; spin coating, etching; heat resistance; photoresists
06/12/2008US20080138744 Lithography; photoresists; semiconductors
06/12/2008US20080138722 Exposure mask, its manufacture method, pattern transfer method, pattern forming method, and SRAM manufacture method
06/12/2008US20080138571 Fabrication of Semiconductor Metamaterials
06/12/2008US20080138501 Forming active material of copper/indium/gallium/selenium or sulfur as ink for solar cells by reacting a solution of non-oxide compounds and capping agent; annealing to form nanoparticles 1-500nm diameter; narrow size distribution; close packing; uniformity; polycrystalline; quality; high quality films
06/12/2008US20080138456 Solar Cell Fabrication Using Extruded Dopant-Bearing Materials
06/12/2008US20080138180 Vacuum processing apparatus and semiconductor manufacturing line using the same
06/12/2008US20080138179 Method and apparatus for a cleanspace fabricator
06/12/2008US20080138178 High throughput serial wafer handling end station
06/12/2008US20080138177 Load lock and method for transferring objects
06/12/2008US20080138176 Apparatus for manufacturing semiconductor device
06/12/2008US20080138175 High throughput wafer notch aligner
06/12/2008US20080137884 Condenser microphone having flexure hinge diaphragm and method of manufacturing the same
06/12/2008US20080137700 Semiconductor Laser Device and Method for Manufacturing Same
06/12/2008US20080137439 Configurable Inputs and Outputs for Memory Stacking System and Method
06/12/2008US20080137406 Magnetic domain information storage device and method of manufacturing the same
06/12/2008US20080137405 Current Injection Magnetic Domain Wall Moving Element
06/12/2008US20080137404 Memory device and method of manufacturing a memory device
06/12/2008US20080137400 Phase Change Memory Cell with Thermal Barrier and Method for Fabricating the Same
06/12/2008US20080137397 Non-volatile switching and memory devices using vertical nanotubes
06/12/2008US20080137263 Method of fabricating a microelectronic device includling embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method
06/12/2008US20080137183 8-Mirror microlithography projection objective
06/12/2008US20080137083 Process monitoring system, process monitoring method, and method for manufacturing semiconductor device
06/12/2008US20080137064 Sample observation method, microscope, and solid immersion lens; optical contact liquid used in the method
06/12/2008US20080137049 Lithographic apparatus, device manufacturing methods, mask and method of characterizing a mask and/or pellicle
06/12/2008US20080137015 Multilayer Substrate
06/12/2008US20080136988 Liquid crystal display for enhancing reflection and method of manufacturing the same
06/12/2008US20080136751 Organic Light Emitting Diode Display on a Flexible Substrate
06/12/2008US20080136508 Semiconductor integrated circuit device
06/12/2008US20080136502 Semiconductor integrated circuit
06/12/2008US20080136499 Selective coupling of voltage feeds for body bias voltage in an integrated circuit device
06/12/2008US20080136464 Method of fabricating bipolar transistors and high-speed lvds driver with the bipolar transistors
06/12/2008US20080136454 Ballistic deflection transistor and logic circuits based on same
06/12/2008US20080136430 Broken die detect sensor
06/12/2008US20080136428 Contacting component, method of producing the same, and test tool having the contacting component
06/12/2008US20080136323 Organic electroluminescent display device
06/12/2008US20080136177 Tube device, and piping system including the tube device
06/12/2008US20080136049 Method of improving overlay performance in semiconductor manufacture
06/12/2008US20080136046 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
06/12/2008US20080136045 Stacked die in die BGA package
06/12/2008US20080136044 Semiconductor package and method of manufacturing the same
06/12/2008US20080136043 Multilayer Wiring Structure, Semiconductor Device, Pattern Transfer Mask and Method for Manufacturing Multilayer Wiring Structure
06/12/2008US20080136042 Metal Wiring of Semiconductor Device and Forming Method Thereof
06/12/2008US20080136041 Structure and method of making interconnect element having metal traces embedded in surface of dielectric
06/12/2008US20080136040 Methods of Forming Electrical Interconnects Using Non-Uniformly Nitrified Metal Layers and Interconnects Formed Thereby
06/12/2008US20080136039 Interconnect assemblies, and methods of forming interconnects
06/12/2008US20080136038 Integrated circuits with conductive features in through holes passing through other conductive features and through a semiconductor substrate
06/12/2008US20080136037 Method for manufacturing semiconductor device and semiconductor device
06/12/2008US20080136035 polyimide or polynorbornene columns coated with copper such that the Cu attaches to a portion of the anchoring elements( epoxies) formed on the outer surfaces so that a plurality of nano interconnections are formed; reduced stresses at the interfaces, superior reliability as IC-package nano interconnect
06/12/2008US20080136034 Chip structure and process for forming the same
06/12/2008US20080136032 Method for filling a contact hole and integrated circuit arrangement with contact hole
06/12/2008US20080136031 Metal line pattern of semiconductor device and method of forming the same
06/12/2008US20080136030 Semiconductor device comprising a doped metal comprising main electrode
06/12/2008US20080136029 Germanium-containing dielectric barrier for low-k process
06/12/2008US20080136028 Semiconductor constructions comprising a layer of metal over a substrate
06/12/2008US20080136027 Method of bonding wire of semiconductor package
06/12/2008US20080136023 Method for manufacturing semiconductor device and semiconductor device
06/12/2008US20080136022 Direct via wire bonding and method of assembling the same
06/12/2008US20080136021 Method of manufacturing hybrid structure of multi-layer substrates and hybrid structure thereof
06/12/2008US20080136020 Semiconductor device and method of manufacturing the same
06/12/2008US20080136018 Function Element and Manufacturing Method Thereof, and Function Element Mounting Structure
06/12/2008US20080136017 Semiconductor device, method for manufacturing the same, and semiconductor device mounting structure
06/12/2008US20080136016 Packaged integrated circuit with enhanced thermal dissipation
06/12/2008US20080136015 High power semiconductor device
06/12/2008US20080136009 Semiconductor device with hollow structure
06/12/2008US20080136007 Stacked integrated circuit package-in-package system
06/12/2008US20080136005 Stackable integrated circuit package system
06/12/2008US20080136004 Multi-chip package structure and method of forming the same
06/12/2008US20080136003 Multi-layer semiconductor package
06/12/2008US20080136000 Micromechanical Component Having Multiple Caverns, and Manufacturing Method
06/12/2008US20080135998 Method For Encapsulating A Device In A Microcavity
06/12/2008US20080135997 Wire bond interconnection
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