Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/05/2008US20080132003 Semiconductor chip package and method for fabricating the same
06/05/2008US20080132002 Semiconductor Package and Production Method Thereof, and Semiconductor Device
06/05/2008US20080132001 Electronic part and method for manufacturing the same
06/05/2008US20080132000 Chip scale package and method for marking chip scale packages
06/05/2008US20080131999 Method of die stacking using insulated wire bonds
06/05/2008US20080131998 Method of fabricating a film-on-wire bond semiconductor device
06/05/2008US20080131997 Integrated circuit package with chip-side signal connections
06/05/2008US20080131996 Reverse build-up process for fine bump pitch approach
06/05/2008US20080131995 Memory device and mehtod of manufacturing the device by simulataneously conditioning transition metal oxide layers in a plurality of memory cells
06/05/2008US20080131989 Method of producing acceleration sensor chip package
06/05/2008US20080131988 Nitride semiconductor light emitting device and method of manufacturing the same
06/05/2008US20080131986 Organic thin film transistor array and manufacturing method thereof
06/05/2008US20080131985 Method of manufacturing a thin film transistor array panel
06/05/2008US20080131983 Method for forming post passivation Au layer with clean surface
06/05/2008US20080131982 Method Of Trimming Semiconductor Elements With Electrical Resistance Feedback
06/05/2008US20080131981 Method for forming Au-bump with clean surface
06/05/2008US20080131980 Method of adjusting buried resistor resistance
06/05/2008US20080131979 Vapor-Phase Growth System and Vapor-Phase Growth Method
06/05/2008US20080131821 Dual layer workpiece masking and manufacturing process
06/05/2008US20080131818 Method for fabrication liquid crystal display device and diffraction mask therefor
06/05/2008US20080131817 monitoring substrate comprising single-crystalline silicon, polycrystalline silicon, amorphous silicon or silicon oxide and a conditioning layer comprising hexamethyldisilazane, used with pattern-transferring system to transfer of the photomask's pattern to the photoresist layers; semiconductor
06/05/2008US20080131791 patterns comprising moldings formed on the flexible substrates and adjustment markings having a refractive index, formed on the moldings
06/05/2008US20080131710 Charge trap layer for a charge trap semiconductor memory device and method of manufacturing the same
06/05/2008US20080131702 Epoxy resin composition and semiconductor package including the same
06/05/2008US20080131679 Silicon Wafer And Method For Manufacturing The Same
06/05/2008US20080131663 Method of manufacturing semiconductor device
06/05/2008US20080131605 Method For Producing Epitaxial Silicon Wafer
06/05/2008US20080131550 Mold and Molding Apparatus Using the Same
06/05/2008US20080131238 Particle-Reducing Load Lock Seal
06/05/2008US20080131237 Batch Wafer Alignment
06/05/2008US20080131165 Electrophotographic photosensitive drum, electrophotographic image forming apparatus, and method of manufacturing electrophotographic photosensitive drum
06/05/2008US20080130982 Pattern inspection apparatus and method
06/05/2008US20080130935 Microphone package
06/05/2008US20080130710 P-N junction based thermal detector
06/05/2008US20080130372 Trench memory structures and operation
06/05/2008US20080130359 Multiple use memory chip
06/05/2008US20080130197 Multi-layer capacitor and method of manufacturing same
06/05/2008US20080130089 METHOD OF FABRICATING MEMS DEVICES (SUCH AS IMod) COMPRISING USING A GAS PHASE ETCHANT TO REMOVE A LAYER
06/05/2008US20080130081 Manufacturing method for stress compensated x-y gimbaled mems mirror array
06/05/2008US20080129970 Immersion Exposure System, and Recycle Method and Supply Method of Liquid for Immersion Exposure
06/05/2008US20080129968 Coating and developing system, coating and developing method and storage medium
06/05/2008US20080129911 Lcos display unit and method for forming the same
06/05/2008US20080129910 Thin film transistor, liquid crystal display apparatus, manufacturing method of thin film transistor, and manufacturing method of liquid crystal display apparatus
06/05/2008US20080129908 Liquid crystal display device and method for manufacturing the same
06/05/2008US20080129852 Image sensor, method of manufacturing the same, and camera module having the same
06/05/2008US20080129455 Method for forming rfid tags
06/05/2008US20080129394 Assembly comprising a support element and a chip, support element, method for shielding, and method for protecting
06/05/2008US20080129371 Semiconductor device and trimming method
06/05/2008US20080129317 Input device and method of manufacturing the same
06/05/2008US20080129177 System and method for limiting arc effects in field emitter arrays
06/05/2008US20080128969 Substrate Supporting/Transferring Tray
06/05/2008US20080128953 Workpiece dividing method utilizing laser beam
06/05/2008US20080128945 Mold and Molding Apparatus Using the Same
06/05/2008US20080128924 Semiconductor Device Having In-Chip Critical Dimension and Focus Patterns
06/05/2008US20080128921 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
06/05/2008US20080128920 Resin-sealed electronic device and method of manufacturing the same
06/05/2008US20080128919 Wire bond integrated circuit package for high speed i/o
06/05/2008US20080128917 Semiconductor device and manufacturing method therefor
06/05/2008US20080128915 Semiconductor package and method for manufacturing the same
06/05/2008US20080128914 Semiconductor device and method of manufacturing the same
06/05/2008US20080128913 Tungsten interconnect super structure for semiconductor power devices
06/05/2008US20080128912 Protective coating comprising a water dispersed binder of formaldehyde-free polyurethanes and/or acrylic latex, a non-formaldehyde polycarbodiimide cross-linker, ammonium zirconium carbonate and a microbiocide; pH of7-9; urability, wear resistance, antisoilants and waterproofing; "green" fabrics
06/05/2008US20080128911 Semiconductor package and method for manufacturing the same
06/05/2008US20080128907 Semiconductor structure with liner
06/05/2008US20080128906 Semiconductor device and manufacturing method thereof
06/05/2008US20080128905 Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
06/05/2008US20080128904 Semiconductor device and method of manufacturing semiconductor device
06/05/2008US20080128903 Semiconductor module, method for manufacturing semiconductor modules and mobile device
06/05/2008US20080128901 Micro-electro-mechanical systems device and integrated circuit device integrated in a three-dimensional semiconductor structure
06/05/2008US20080128900 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
06/05/2008US20080128899 System for clamping heat sink
06/05/2008US20080128896 Semiconductor apparatus and manufacturing method thereof
06/05/2008US20080128895 Wafer applied thermal-mechanical interface
06/05/2008US20080128894 Support body for semiconductor element, method for manufacturing the same and semiconductor device
06/05/2008US20080128891 Semiconductor package substrate and methods for forming same, In particular for mems devices
06/05/2008US20080128890 Chip package and fabricating process thereof
06/05/2008US20080128889 Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof
06/05/2008US20080128888 System-in-package (SiP) and method of manufacturing the same
06/05/2008US20080128886 Substrate for a flexible microelectronic assembly and a method of fabricating thereof
06/05/2008US20080128882 Chip stack package and method of manufacturing the same
06/05/2008US20080128876 Chip on leads
06/05/2008US20080128875 Integrated circuit with on-chip memory and method for fabricating the same
06/05/2008US20080128872 Semiconductor device and method for producing a semiconductor device
06/05/2008US20080128871 Apparatus and Process for Producing Thin Films and Devices
06/05/2008US20080128870 Semiconductor Constructions
06/05/2008US20080128869 Novel contact etch stop film
06/05/2008US20080128868 Method of Transferring a Circuit Onto a Ground Plane
06/05/2008US20080128867 Method for forming micro-pattern in a semiconductor device
06/05/2008US20080128865 Carrier structure embedded with semiconductor chip and method for fabricating thereof
06/05/2008US20080128864 Semiconductor chip and method of producing the same
06/05/2008US20080128863 Fabrication method of semiconductor device and semiconductor device
06/05/2008US20080128862 Semiconductor Devices And Method Of Manufacturing Them
06/05/2008US20080128858 Semiconductor device and manufacturing method thereof
06/05/2008US20080128856 Semiconductor device having metal-insulator-metal capacitor and method of fabricating the same
06/05/2008US20080128855 semiconductor integrated circuit device and a method of manufacturing the same
06/05/2008US20080128853 Non-Volatile Memory Devices with Discrete Resistive Memory Material Regions and Methods of Fabricating the Same
06/05/2008US20080128851 Method Of Manufacturing Soi Wafer And Thus-Manufactured Soi Wafer
06/05/2008US20080128850 Semiconductor Device And Method For Manufacturing Same
06/05/2008US20080128849 Low-noise semiconductor photodetectors
06/05/2008US20080128848 Solid-state imaging device
1 ... 2588 2589 2590 2591 2592 2593 2594 2595 2596 2597 2598 2599 2600 2601 2602 2603 2604 2605 2606 2607 2608 ... 6590