Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/19/2008US20080146031 Method for forming a semiconductor structure
06/19/2008US20080146030 System and method for direct etching
06/19/2008US20080146029 Method of forming an interconnect structure
06/19/2008US20080146028 Method of depositing copper using physical vapor deposition
06/19/2008US20080146027 Method of forming wiring of a semiconductor memory device
06/19/2008US20080146026 Method for manufacturing semiconductor device capable of reducing parasitic bit line capacitance
06/19/2008US20080146025 Methods and systems for barrier layer surface passivation
06/19/2008US20080146024 Method for forming a metal structure
06/19/2008US20080146023 Method of forming metal wire in semiconductor device
06/19/2008US20080146022 Methods of Forming Conductive Interconnects
06/19/2008US20080146021 Method of fabricating metal interconnects and inter-metal dielectric layer thereof
06/19/2008US20080146020 Top layers of metal for high performance IC's
06/19/2008US20080146019 Chip structure and process for forming the same
06/19/2008US20080146018 Chip structure and method for fabrication the same
06/19/2008US20080146017 Method for manufacturing semiconductor device
06/19/2008US20080146016 Method for Forming a Structure
06/19/2008US20080146015 Method of fabricating semiconductor device
06/19/2008US20080146014 Self aligned contact
06/19/2008US20080146013 Method for manufacturing semiconductor device
06/19/2008US20080146012 Novel method to adjust work function by plasma assisted metal incorporated dielectric
06/19/2008US20080146011 Method of forming self-assembled monolayer on ito film
06/19/2008US20080146010 Semiconductor component comprising a semiconductor chip and method for producing the same
06/19/2008US20080146009 Method for Introducing Impurities
06/19/2008US20080146008 Ultra-Thin High-Quality Germanium on Silicon By Low-Temperature Epitaxy and Insulator-Capped Annealing
06/19/2008US20080146007 Method to increase the compressive stress of pecvd dielectric films
06/19/2008US20080146006 Crystal imprinting methods for fabricating substrates with thin active silicon layers
06/19/2008US20080146005 Methods for creating a densified group iv semiconductor nanoparticle thin film
06/19/2008US20080146004 Silicon carbide devices and method of making
06/19/2008US20080146003 Method and device for separating silicon wafers
06/19/2008US20080146002 Method of manufacturing semiconductor device having buried gate
06/19/2008US20080146001 Pre-STI nitride descum step for increased margin against STI seam voids
06/19/2008US20080146000 Method of forming isolation structure of flash memory device
06/19/2008US20080145999 Method for manufacturing a semiconductor device
06/19/2008US20080145998 Method of forming a low-k dual damascene interconnect structure
06/19/2008US20080145997 Method of forming a metal-insulator-metal capacitor
06/19/2008US20080145996 Method for Manufacturing Dielectric Thin Film Capacitor
06/19/2008US20080145995 Methods for Forming Process Test Capacitors for Testing Embedded Passives During Embedment into a Printed Wiring Board
06/19/2008US20080145994 Method for isotropic doping of a non-planar surface exposed in a void
06/19/2008US20080145993 Electrostatic discharge protection device and method of fabricating same
06/19/2008US20080145992 Method of Manufacturing a Semiconductor Device Having Reduced N/P or P/N Junction Crystal Disorder
06/19/2008US20080145991 Slim spacer implementation to improve drive current
06/19/2008US20080145990 Method and structure for fabricating mos devices with a salicided gate and source/drain combined with a non-silicide source drain regions
06/19/2008US20080145989 SEMICONDUCTOR DEVICE HAVING PARTIALLY INSULATED FIELD EFFECT TRANSISTOR (PiFET) AND METHOD OF FABRICATING THE SAME
06/19/2008US20080145988 Method for Fabricating Semiconductor Device
06/19/2008US20080145987 Manufacture of semiconductor device
06/19/2008US20080145986 STRUCTURE AND METHOD FOR IMPROVED STRESS AND YIELD IN pFETS WITH EMBEDDED SiGe SOURCE/DRAIN REGIONS
06/19/2008US20080145985 Embedded semiconductor memory devices and methods for fabricating the same
06/19/2008US20080145984 Dual metal silicides for lowering contact resistance
06/19/2008US20080145983 Semiconductor device and process for fabricating the same
06/19/2008US20080145982 Isolation spacer for thin soi devices
06/19/2008US20080145981 Method of manufacturing thin film transistor having lightly doped drain regions
06/19/2008US20080145980 Contact portion of semiconductor device, and thin film transistor array panel for display device including the contact portion
06/19/2008US20080145979 Method for changing characteristic of thin film transistor by strain technology
06/19/2008US20080145978 Deposition of silicon germanium nitrogen precursors for strain engineering
06/19/2008US20080145977 Increasing the resistance of a high frequency input/output power delivery decoupling path
06/19/2008US20080145976 Packaging of Micro Devices
06/19/2008US20080145975 Method for fabricating circuit board structure with embedded semiconductor chip
06/19/2008US20080145974 Forming a seed layer; forming a heat spreader layer on the seed layer to increase the thermal conductivity of the heat spreader layer; heat spreader layer of Aluminum Nitride is grown on the seed layer of NiTa or Alumina
06/19/2008US20080145973 Method of manufacturing wafer level chip size package
06/19/2008US20080145972 Paste printer and method of printing with paste
06/19/2008US20080145971 Semiconductor package, manufacturing method thereof and IC chip
06/19/2008US20080145970 Stack structure and method of manufacturing the same
06/19/2008US20080145969 Semiconductor package and method for manufacturing the same
06/19/2008US20080145968 Manufacturing Method For Micro-SD Flash Memory Card
06/19/2008US20080145967 Semiconductor package and manufacturing method thereof
06/19/2008US20080145965 Via Wave Guide With Curved Light Concentrator For Image Sensing Devices
06/19/2008US20080145963 Method for fabricating pixel cell of cmos image sensor
06/19/2008US20080145961 Semiconductor Light Emitting Device and Manufacturing Method Thereof
06/19/2008US20080145960 Super thin LED package for the backlighting applications and fabrication method
06/19/2008US20080145959 Substrate with transparent electrodes and devices incorporating it
06/19/2008US20080145958 Monitoring of electrostatic discharge (esd) events during semiconductor manufacture using esd sensitive resistors
06/19/2008US20080145957 Wafer transferring robot in semiconductor device fabrication equipmentand method of detecting wafer warpage using the same
06/19/2008US20080145956 Method for manufacturing magnetic sensor apparatus
06/19/2008US20080145955 Varactors and methods of manufacture and use
06/19/2008US20080145954 Manufacturing method for ferroelectric memory device
06/19/2008US20080145953 Manufacturing method for ferroelectric memory device
06/19/2008US20080145952 MgO-Based Tunnel Spin Injectors
06/19/2008US20080145951 High density spin torque three dimensional (3D) memory arrays addressed with microwave current
06/19/2008US20080145799 Substrate developing method, substrate processing method and developing solution supply nozzle
06/19/2008US20080145798 Method of processing substrate and chemical used in the same
06/19/2008US20080145797 Transfer wafer into single wafer wet clean module directly coupled to transfer chamber; clean with acoustic energy applied in a direction normal to wafer backside while frontside is kept dry; filter amine and ammonia vapors from transfer chamber; atmospheric and sub-atmospheric processing
06/19/2008US20080145769 Entry acceptance unit takes measured dimension of transfer pattern; calculations of triaxial vector components at every position; flare electric field vector by polarization ratio of exposure tool; light intensity by adding electric field vector and flare, calculate sum of squares of triaxial components
06/19/2008US20080145768 Form a mixing-generation resist film on mask; bake film to form mixing layer at interface between mask and film; developer solution of tetramethylammonium hydroxide; fine resist pattern by shrinking technique; suppress spot-like defects at low cost; semiconductor device
06/19/2008US20080145677 Coating composition for insulating film production, preparation method of insulation film by using the same, insulation film for semi-conductor device prepared therefrom, and semi-conductor device comprising the same
06/19/2008US20080145650 Double plasma utbox
06/19/2008US20080145607 Semiconductor apparatus and manufacturing method of semiconductor apparatus
06/19/2008US20080145539 Reducing the spacing between adjacent photoresist patterns, by heating to shrink the overcoatings, control pattern dimensions; semiconductors, photolithographic
06/19/2008US20080145194 Sensor arrangements for wafer center finding
06/19/2008US20080145193 Vacuum Processing Apparatus
06/19/2008US20080145192 Semiconductor manufacturing process modules
06/19/2008US20080145191 Actively chilled substrate transport module
06/19/2008US20080144818 Semiconductor device including encryption section, semiconductor device including external interface, and content reproduction method
06/19/2008US20080144691 Optical semiconductor device having diffraction grating disposed on both sides of waveguide and its manufacture method
06/19/2008US20080144377 Nonvolatile Semiconductor Storage Unit and Production Method Therefor
06/19/2008US20080144374 Nonvolatile Memory
06/19/2008US20080144364 Multi-bit electro-mechanical memory device and method of manufacturing the same
06/19/2008US20080144355 Dielectric Antifuse for Electro-Thermally Programmable Device
06/19/2008US20080144354 Resistive memory array using P-I-N diode select device and methods of fabrication thereof
06/19/2008US20080144352 Ferroelectric memory device and method of manufacturing the same
06/19/2008US20080144298 Printed circuit board and method of manufacturing printed circuit board
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