Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/25/2008CN101206996A Method for improving and monitoring crystal round utilization ratio
06/25/2008CN101206995A Method for monitoring crystal round pallet obliteration performance
06/25/2008CN101206994A Method for preparing groove
06/25/2008CN101206993A Method for reutilization of BD control retaining plate
06/25/2008CN101206992A Even glue developing process process capable of economizing time and equipment improved structure
06/25/2008CN101206990A Method for detecting plasma distribution density in responses chamber
06/25/2008CN101206412A Decompression drying device
06/25/2008CN101206407A Method of photolithographic exposure
06/25/2008CN101206401A Radiation sensitive resin composition, interlayer dielectric and microlens, and method for producing thereof
06/25/2008CN101206394A Exposure mask and method for fabricating semiconductor device using the same
06/25/2008CN101206393A Optical mask employed for manufacturing array substrate, array substrate and method for manufacturing the same
06/25/2008CN101206364A Display apparatus including signal lines arranged for curing a seal line
06/25/2008CN101206361A Liquid crystal display device and method of fabricating the same
06/25/2008CN101206331A Liquid crystal display device and method for manufacturing the same
06/25/2008CN101206325A Liquid crystal display device with photosensor and method of fabricating the same
06/25/2008CN101206243A Method for measuring intrinsic capacity of metal oxide semiconductor component
06/25/2008CN101206238A Error covering analysis method
06/25/2008CN101206181A Device and method for testing edge-washing effect of crystal round fringes
06/25/2008CN101206179A Light emission microscope sample
06/25/2008CN101206158A System for supplying a thermal agent to a testing machine for testing objects under thermally hard circumstances
06/25/2008CN101206157A System for testing the durability of objects under thermally hard circumstances
06/25/2008CN101205606A Lift pin, apparatus for processing a substrate and method of processing a substrate
06/25/2008CN101205442A Ruthenium-barrier layer polishing slurry
06/25/2008CN101205291A Hard mask composition, process for forming material layer, and semiconductor integrated circuit device
06/25/2008CN101204795A Chemical mechanical polishing pad
06/25/2008CN101204792A Washing liquid distribution device
06/25/2008CN101204708A Recovery cup cleaning method and substrate treatment apparatus
06/25/2008CN101204706A Cleaning method of quartz material parts
06/25/2008CN101204705A Method of cleaning chamber with silicon chip erosion
06/25/2008CN101204704A Method of cleaning hangover on wafer surface
06/25/2008CN100397963C Electronic circuit device and its manufacturing method
06/25/2008CN100397742C Voltage limiting protection for high frequency power device
06/25/2008CN100397674C Magnetic controlled resistance storage device with magnetic field attenuation layer
06/25/2008CN100397670C Gallium nitride-based iii-v group compound semiconductor device
06/25/2008CN100397669C LED light source packaging structure for low-temperature coburning ceramic by thermoelectric separating design
06/25/2008CN100397661C Metal inducement single direction transverse crystallization thin film transistor device and its preparing method
06/25/2008CN100397660C A method for manufacturing a thin film transistor using poly silicon
06/25/2008CN100397659C Strained transistor with hybrid-strain inducing layer and method of forming the same
06/25/2008CN100397657C Semiconductor device
06/25/2008CN100397656C Thin film transistor of multi-grid structure and manufacturing method thereof
06/25/2008CN100397655C Structure of improving gallium nitride base high electronic mobility transistor property and producing method
06/25/2008CN100397649C Method for manufacturing single transistor dram cell with reduced current leakage
06/25/2008CN100397648C MOS type semiconductor device having electrostatic discharge protection arrangement
06/25/2008CN100397647C Semiconductor structure and method for ESD protection circuit
06/25/2008CN100397646C Integrated circuit structure having multi-version circuit selection
06/25/2008CN100397644C Capacitor of a semiconductor device and memory device using the same
06/25/2008CN100397643C Semiconductor device with partial SOI structure and its manufacturing method
06/25/2008CN100397642C Semiconductor equipment and its manufacturing method
06/25/2008CN100397641C 电路装置及其制造方法 Circuit device and manufacturing method thereof
06/25/2008CN100397640C Circuit component built-in module and method for manufacturing the same
06/25/2008CN100397639C Structure and method for forming multiple lead line frame semiconductor device
06/25/2008CN100397637C Semiconductor device
06/25/2008CN100397636C Semiconductor device and its making method
06/25/2008CN100397635C Wiring pad with edge reinforcing structure for integrated circuit
06/25/2008CN100397634C Semiconductor package including redistribution pattern and method of manufacturing the same
06/25/2008CN100397633C Wiring structure for a pad section in a semiconductor device
06/25/2008CN100397629C Semiconductor device and method of manufacturing the same
06/25/2008CN100397628C Electrical or electronic component and method of producing same
06/25/2008CN100397627C 电路装置及其制造方法 Circuit device and manufacturing method thereof
06/25/2008CN100397626C Resin encapsulated electronic component unit and method of manufacturing the same
06/25/2008CN100397625C 半导体装置 Semiconductor device
06/25/2008CN100397624C Wiring circuit board
06/25/2008CN100397623C 半导体芯片侧接触方法 The semiconductor chip side contact method
06/25/2008CN100397622C Manufacturing method of driving components array substrate
06/25/2008CN100397621C Operation method of silion nitride read-only memory element
06/25/2008CN100397620C Production of memory
06/25/2008CN100397619C Integrated circuit structure and its producing method and integrated circuit memory element
06/25/2008CN100397618C Method for forming semiconductor assembly and semiconductor storage element
06/25/2008CN100397617C Method for producing high-density capacitors
06/25/2008CN100397616C Body silicon MEMS and CMOS circuit integrating method capable of removing residual silicon
06/25/2008CN100397615C Memory cell and producing method thereof, semiconductor elements and memory cell
06/25/2008CN100397614C Method for fabricating metal line in semiconductor device
06/25/2008CN100397613C Multiple thickness semiconductor interconnect and method for manufacturing the same
06/25/2008CN100397612C Use of conductive electrolessly deposited etch stop layers, liner layers, and via plugs in interconnect structures
06/25/2008CN100397611C Method for forming conductive structure in low dielectric material layer
06/25/2008CN100397610C Semiconductor device and method of manufacturing the same
06/25/2008CN100397609C Focusing ion beam modifying integrated circuit method and integrated circuit
06/25/2008CN100397608C Transfer device and semiconductor processing system
06/25/2008CN100397607C Overhead transferring flange for hanging substrate carrier and supporting piece
06/25/2008CN100397606C Method for detecting IC on-line defect and making process monitor circuit structure
06/25/2008CN100397605C Manufacturing method for semiconductor device
06/25/2008CN100397604C Method and apparatus for connecting the conductor convex to the corresponding cushion of the chip
06/25/2008CN100397603C Method for mounting electronic element, method for producing electronic device, circuit board, and electronic instrument
06/25/2008CN100397602C Semiconductor copper bond pad surface protection
06/25/2008CN100397601C Method for manufacturing semiconductor device and semiconductor device
06/25/2008CN100397600C Transistor modular assembling method and its equipment
06/25/2008CN100397599C Lead frame making method, semiconductor device making method and semiconductor device
06/25/2008CN100397598C Method for manufacturing power MOSFET
06/25/2008CN100397597C Method for producing metal-oxide semiconductor electric crystal and memory body elements
06/25/2008CN100397596C Method for preparing lateral channel of field effect transistor, and field effect transistor
06/25/2008CN100397595C Method for manufacturing silicon wafer
06/25/2008CN100397594C Semiconductor device and manufacturing method thereof
06/25/2008CN100397593C Method for the production of structured layers on substrates
06/25/2008CN100397592C Semiconductor making process and inner layer dielectric layer manufacturing method
06/25/2008CN100397591C Method for producing low dielectric constant material layer
06/25/2008CN100397590C Gate etching process
06/25/2008CN100397589C Plasma etching chamber and plasma etching system using same
06/25/2008CN100397588C Plasma processing device
06/25/2008CN100397587C Silicon gate etching process capable of avoiding microtrench phenomenon
06/25/2008CN100397586C Polycrystalline silicon pulse etching process for improving anisotropy