| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/26/2008 | US20080149272 Surface Microstructuring Device |
| 06/26/2008 | US20080149177 Apparatus and Method for Optimizing the Efficiency of Germanium Junctions in Multi-Junction Solar Cells |
| 06/26/2008 | US20080149029 Apparatus and method of crystallizing amorphous silicon |
| 06/26/2008 | US20080148861 Semiconductor Sensor Component Comprising Protected Feeders, and Method for the Production Thereof |
| 06/26/2008 | US20080148849 Motion sensor and method of manufacturing the same |
| 06/26/2008 | US20080148563 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board |
| 06/26/2008 | US20080148540 Singulation metal mold and method for producing semiconductor device |
| 06/26/2008 | DE19812583B4 Verfahren zur Herstellung eines Bauelementes A method for producing a component |
| 06/26/2008 | DE19720275B4 Substrat für eine Halbleiteranordnung, Herstellungsverfahren für dasselbe und eine das Substrat verwendende stapelbare Halbleiteranordnung Substrate for a semiconductor device manufacturing method thereof, and a stackable semiconductor device, the substrate used |
| 06/26/2008 | DE19717380B4 Verfahren zur Anbringung eines Schmelztiegels auf einer Halterung einer Einkristall-Ziehvorrichtung, sowie dabei verwendete Vorrichtung zum Zusammenfügen der Halterung und dabei verwendete Halterung A method of mounting a crucible on a support of a single crystal pulling apparatus, and thereby apparatus used for assembling the bracket and bracket used therein |
| 06/26/2008 | DE112006002145T5 Chip-Wendevorrichtung und Chip-Wendeverfahren sowie Chip-Montagevorrichtung und Chip-Montageverfahren Chip reversing device and chip reversing method and chip mounting apparatus and chip mounting method |
| 06/26/2008 | DE112006002027T5 Verfahren zum Herstellen von Halbleitervorrichtungen und System zum Herstellen von Halbleitervorrichtungen A method for the manufacture of semiconductor devices and system for producing semiconductor devices |
| 06/26/2008 | DE112005000747T5 Polymer-Dielektrika zur Speicherelement-Array-Verbindung Polymer dielectrics for memory element array connection |
| 06/26/2008 | DE112005000637T5 Leuchtstoff und Leuchtdiode Fluorescent and LED |
| 06/26/2008 | DE112004000753B4 Speicherarray mit schwebendem Gate und Verfahren zu dessen Herstellung Floating gate memory array and method of manufacturing the |
| 06/26/2008 | DE10392819T5 Temperaturregelungsablauf von Bädern zur stromlosen Beschichtung Temperature control sequence of baths for electroless plating |
| 06/26/2008 | DE10335102B4 Verfahren zur Herstellung einer epitaxialen Schicht für erhöhte Drain- und Sourcegebiete durch Entfernen von Kontaminationsstoffen A process for producing an epitaxial layer for increased drain and source regions by removing contaminants |
| 06/26/2008 | DE10297788B4 Deposition apparatus for manufacturing semiconductor device, e.g. Schottky barrier metal oxide semiconductor field effect transistor, comprises first and second chambers, pumping portions, gas injecting portions, and connecting portion |
| 06/26/2008 | DE10250899B4 Verfahren zum Entfernen von Seitenwandabstandselementen eines Halbleiterelements unter Anwendung eines verbesserten Ätzprozesses A process for removing sidewall spacers of a semiconductor element using an improved etch process |
| 06/26/2008 | DE102007062208A1 Method for manufacturing silicon carbide semiconductor component, involves forming trenches by dry etching and thermal treatment is executed in gas atmosphere at increased temperature |
| 06/26/2008 | DE102007061248A1 Measuring instrument for measuring the thickness and the height of a semiconductor wafer comprises a laser beam oscillator, a capacitor, a light receiving unit, a light collecting point changing unit and a control device |
| 06/26/2008 | DE102007059608A1 Rutheniumbarriere-Polieraufschlämmung Rutheniumbarriere-polishing |
| 06/26/2008 | DE102007058698A1 Verbessertes Kugelrasterarraygehäuse Improved ball grid array housing |
| 06/26/2008 | DE102007058676A1 Rauschreduzierung in Halbleitereinrichtungen Noise reduction in semiconductor devices |
| 06/26/2008 | DE102007058455A1 Verfahren zum Herstellen eines Halbleiter-Elements und Halbleiter-Element A method of manufacturing a semiconductor element and semiconductor element |
| 06/26/2008 | DE102007057815A1 Kontaktiervorrichtung für eine Berührungskontaktierung eines elektrischen Prüflings sowie entsprechendes Verfahren Contactor for a touch contacting an electrical device under test and corresponding method |
| 06/26/2008 | DE102007057370A1 Elektronisches Bauelement Electronic component |
| 06/26/2008 | DE102007053532A1 Flash-Speicher-Baustein Flash memory module |
| 06/26/2008 | DE102007034402A1 Halbleiterpackung und Herstellungsverfahren dafür A semiconductor package and fabrication method thereof |
| 06/26/2008 | DE102007019122B3 Method for processing semiconductor wafer by epitaxial step, involves forming slot structure in evacuated surface of semiconductor wafer before epitaxial step, where slot structure has recessed test structure |
| 06/26/2008 | DE102007017229A1 Monitoring etching of semiconductor substrate, for use in semiconductor devices, by measuring time-dependent concentration pattern for representative etching chemical |
| 06/26/2008 | DE102006062674A1 Speicherbauelement und Verfahren zum Herstellen eines Speicherbauelements Memory device and method of manufacturing a memory device |
| 06/26/2008 | DE102006061435A1 Verfahren und Vorrichtung zum Aufspritzen insbesondere einer Leiterbahn, elektrisches Bauteil mit einer Leiterbahn sowie Dosiervorrichtung Method and apparatus for spraying, in particular a conductor track, electrical component to a conductor track as well as metering |
| 06/26/2008 | DE102006060801A1 Chip card module manufacturing involves providing paper carrier with two sides, where structured starter layer with conductive particles is applied on one side of carrier |
| 06/26/2008 | DE102006060629A1 Elektrisches Bauelement Electrical component |
| 06/26/2008 | DE102006060533A1 Verfahren zur Herstellung einer ersten Schicht mit einer elektrischen Leitung und Anordnung mit einer Kontaktschicht A process for preparing a first layer with an electrical line and arrangement with a contact layer |
| 06/26/2008 | DE102006060484A1 Halbleiterbauelement mit einem Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip and method for producing |
| 06/26/2008 | DE102006060195A1 Kantenverrundung von Wafern Edge rounding of wafers |
| 06/26/2008 | DE102006059526A1 Semiconductor component for utilities, has substrate, which has upper side and lower side, and semiconductor chip that is mounted on substrate, with front side and back side |
| 06/26/2008 | DE102006059411A1 Method for producing optical sensor for mounting on carrier substrate, involves providing optical transparent plate with lateral dimensions larger than sensor chip |
| 06/26/2008 | DE102006058819A1 Separating method for multiple disks of workpiece, involves fixing pre-wearing bar on opposite side of peripheral area of workpiece, which is guided from saw wire into workpiece by wire gate |
| 06/26/2008 | DE102006058010A1 Halbleiterbauelement mit Hohlraumstruktur und Herstellungsverfahren A semiconductor device structure and manufacturing method with cavity |
| 06/26/2008 | DE102006001601B4 Verfahren zur Herstellung eines Halbleiterwafers mit Rückseitenidentifizierung A method for producing a semiconductor wafer having back identification |
| 06/26/2008 | DE102005024945B4 Integrierte Halbleiterschaltungsanordnung sowie Verfahren zu deren Herstellung A semiconductor integrated circuit device and to methods for their preparation |
| 06/26/2008 | DE102004026149B4 Verfahren zum Erzeugen eines Halbleiterbauelements mit Transistorelementen mit spannungsinduzierenden Ätzstoppschichten A method for producing a semiconductor device having transistor elements with stress inducing etch stop layers |
| 06/26/2008 | CA2673227A1 Lateral junction field-effect transistor |
| 06/25/2008 | EP1937043A1 Method for producing high dielectric sheet |
| 06/25/2008 | EP1936953A2 A tdi detecting device, a feed-through equipment, an electron beam apparatus using these device and equipment, and a semiconductor device manufacturing method using the same electron beam apparatus |
| 06/25/2008 | EP1936697A2 A field effect transistor device, and methods of production thereof |
| 06/25/2008 | EP1936696A1 A field effect transistor device and methods of production thereof |
| 06/25/2008 | EP1936695A1 Silicon carbide semiconductor device |
| 06/25/2008 | EP1936691A1 Memorisation device with multi-level structure |
| 06/25/2008 | EP1936690A2 Semiconductor device |
| 06/25/2008 | EP1936689A1 Deep sub-micron MOS preamplifier with thick-oxide input stage transistor |
| 06/25/2008 | EP1936686A2 Semiconductor Device, Method for Manufacturing the same, and Method for Mounting the same |
| 06/25/2008 | EP1936681A1 Non-volatile memory device and method of operating the same |
| 06/25/2008 | EP1936680A2 Interconnection element based on carbon nanotubes |
| 06/25/2008 | EP1936679A1 Method for manufacturing an SOI substrate |
| 06/25/2008 | EP1936678A2 A method for bonding and releasing a die or substrate to/from a carrier and corresponding intermediate product |
| 06/25/2008 | EP1936677A2 Wiring structure of printed wiring board and method for manufacturing the same |
| 06/25/2008 | EP1936676A2 Method of mounting electronic components, method of manufacturing an electronic component-embedded substrate, and electronic component-embedded substrate |
| 06/25/2008 | EP1936675A2 Collective mounting method of electronic components and manufacturing method of electronic component-embedded substrate |
| 06/25/2008 | EP1936674A2 Method and slurry for tuning low-k versus copper removal rates during chemical mechanical polishing |
| 06/25/2008 | EP1936673A1 Polishing solution for cmp and method of polishing |
| 06/25/2008 | EP1936672A1 Electron blocking layers for gate stacks of nonvolatile memory devices |
| 06/25/2008 | EP1936671A1 Substrate processing apparatus and substrate processing method |
| 06/25/2008 | EP1936670A2 Method to improve the Selective Epitaxial Growth (SEG) Process |
| 06/25/2008 | EP1936669A1 Method of manufacturing an SOI substrate combining silicon-based areas and GaAs-based areas |
| 06/25/2008 | EP1936668A2 Nitride semiconductor substrate and manufacturing method thereof |
| 06/25/2008 | EP1936667A1 Double plasma processing for achieving a structure having an ultra thin buried oxyde |
| 06/25/2008 | EP1936666A1 Doping of nanostructures |
| 06/25/2008 | EP1936664A1 Method for producing bonded wafer |
| 06/25/2008 | EP1936663A2 System for testing the durability of objects under thermally hard circumstances |
| 06/25/2008 | EP1936662A2 System for supplying a termal agent to a testing machine for testing objects under thermally hard circumstances |
| 06/25/2008 | EP1936658A2 Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
| 06/25/2008 | EP1936657A2 Method for shaping a magnetic field in a magnetic field-enhanced plasma reactor |
| 06/25/2008 | EP1936655A2 Methods and apparatus for alignment of ion beam systems using beam current sensors |
| 06/25/2008 | EP1936005A1 HIGH-PURITY Ru ALLOY TARGET, PROCESS FOR PRODUCING THE SAME AND SPUTTERED FILM |
| 06/25/2008 | EP1935954A1 Compositions for chemical mechanical planarization of copper |
| 06/25/2008 | EP1935566A2 Substrate holding apparatus |
| 06/25/2008 | EP1935514A1 Apparatus and process for cleaning objects, in particular of thin discs |
| 06/25/2008 | EP1935035A2 Production of self-organized pin-type nanostructures, and the rather extensive applications thereof |
| 06/25/2008 | EP1935026A1 Insulated gate field-effet transistor having a dummy gate |
| 06/25/2008 | EP1935024A2 A method for fabricating a high performance pin focal plane structure using three handle wafers |
| 06/25/2008 | EP1935023A2 Semiconductor device with a bipolar transistor and method of manufacturing such a device |
| 06/25/2008 | EP1935022A2 Microelectronic assembly and method for forming the same |
| 06/25/2008 | EP1935020A2 DENSE CHEVRON finFET AND METHOD OF MANUFACTURING SAME |
| 06/25/2008 | EP1935019A1 A cmos device with zero soft error rate |
| 06/25/2008 | EP1935016A1 Single-poly eprom device and method of manufacturing |
| 06/25/2008 | EP1935015A1 Semiconductor device |
| 06/25/2008 | EP1935014A2 METHOD FOR ENHANCING GROWTH OF SEMI-POLAR (Al, In,Ga,B)N VIA METALORGANIC CHEMICAL VAPOR DEPOSITION |
| 06/25/2008 | EP1935013A1 Electropolishing electrolyte and method for planarizing a metal layer using the same |
| 06/25/2008 | EP1935012A2 Transistor formed with self-aligned contacts |
| 06/25/2008 | EP1935011A1 Methods of fabricating oxide layers on silicon carbide layers utilizing atomic oxygen |
| 06/25/2008 | EP1935010A2 Self-organized pin-type nanostructures, and production thereof on silicon |
| 06/25/2008 | EP1935009A1 Method for accelerating etching of silicon |
| 06/25/2008 | EP1935008A2 Microelectronic assembly and method for forming the same |
| 06/25/2008 | EP1935007A1 Methods of processing semiconductor wafers having silicon carbide power devices thereon |
| 06/25/2008 | EP1935006A2 Semiconductor stacked die/wafer configuration and packaging and method thereof |
| 06/25/2008 | EP1935005A1 Positive displacement pumping chamber |