Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2008
06/25/2008CN101207103A Semiconductor encapsulated element and method of manufacture thereof
06/25/2008CN101207100A Semiconductor component and manufacturing method thereof
06/25/2008CN101207098A Soldering pad structure in semiconductor apparatus and related method
06/25/2008CN101207093A SiGe relaxation backing material and method for preparing the same
06/25/2008CN101207092A 液晶显示器件及其制造方法 The liquid crystal display device and manufacturing method thereof
06/25/2008CN101207091A Method manufactruing of flash memory device
06/25/2008CN101207090A Method for fabricating flash memory device
06/25/2008CN101207089A Method for making non-volatile memory
06/25/2008CN101207088A Method for manufacturing bore field extension structure of non-volatile memory
06/25/2008CN101207087A Method for making flash memory
06/25/2008CN101207086A Method for forming a semiconductor structure
06/25/2008CN101207085A Manufacture method of semiconductor device
06/25/2008CN101207084A Semiconductor device and method for fabricating the same
06/25/2008CN101207083A CMOS image sensor and method of manufacturing the same
06/25/2008CN101207082A Method for manufacturing image sensor
06/25/2008CN101207081A CMOS image sensor and fabricating method thereof
06/25/2008CN101207080A Image sensor and method of manufacturing the same
06/25/2008CN101207079A Integrated circuit, semiconductor device and manufacturing method thereof
06/25/2008CN101207078A Inverted metamorphic solar cell with bypass diode
06/25/2008CN101207077A Image sensor and manufacturing method thereof
06/25/2008CN101207076A Method for manufacturing image sensor
06/25/2008CN101207075A Organic electroluminescent device and method for manufacturing the same
06/25/2008CN101207074A Integrated circuit having a metal element
06/25/2008CN101207073A Method of formation of a damascene structure utilizing a protective film
06/25/2008CN101207072A Method for forming dual damascene pattern
06/25/2008CN101207071A Method for manufacturing metal interconnection line and dielectric layer among metal
06/25/2008CN101207070A Method for forming of integrated circuit device self-alignment contact
06/25/2008CN101207069A Method for forming of via hole
06/25/2008CN101207068A Method for manufacturing of semiconductor device metal connecting hole and semiconductor device
06/25/2008CN101207067A Method for manufacturing inlaid structure
06/25/2008CN101207066A Method for forming through hole
06/25/2008CN101207065A Method for manufacturing isolation structure and non-volatile memory with the isolation structure
06/25/2008CN101207064A Method for forming device isolation region
06/25/2008CN101207063A Method for forming shallow trench isolation
06/25/2008CN101207062A Method for manufacturing substrate mounting table
06/25/2008CN101207061A Substrate mounting table and method for manufacturing same, substrate processing apparatus, and fluid supply mechanism
06/25/2008CN101207060A Wafer back part positioning device and method of use thereof
06/25/2008CN101207059A Container transport system and measurement container
06/25/2008CN101207058A Chip measuring device and laser processing machine
06/25/2008CN101207057A Semiconductor device testing apparatus, testing method and method for manufacturing the testing apparatus
06/25/2008CN101207056A Method for measuring loading effect and percentage of coverage for thin membrane stairway
06/25/2008CN101207055A Gestapelte halbleiterbausteine
06/25/2008CN101207054A Method for fabricating a circuit
06/25/2008CN101207053A Semiconductor device manufacturing method
06/25/2008CN101207052A Screen printing apparatus and heave forming method
06/25/2008CN101207051A Flip chip mounting method by no-flow underfill
06/25/2008CN101207050A Light emitting device package and method for manufacturing the same
06/25/2008CN101207049A Tin paste printing apparatus and CSP, BGA chip repairing method using the same
06/25/2008CN101207048A Method for manufacturing tin solder projection
06/25/2008CN101207047A Method for making tin solder bump
06/25/2008CN101207046A Bump formation method
06/25/2008CN101207045A Heat dissipation type semiconductor package part and method for making the same
06/25/2008CN101207044A Heat dissipation type semiconductor package part and method for making the same
06/25/2008CN101207043A Process for combined making optical lens and chip
06/25/2008CN101207042A Semiconductor device
06/25/2008CN101207041A Method for forming a most device with reduced transient enhanced diffusion
06/25/2008CN101207040A Method for forming thermal stabilization metallic silicide
06/25/2008CN101207039A Method for manufacturing MOS transistor with high-precision threshold voltage
06/25/2008CN101207038A Method for etching tungsten-silicide silicon-die
06/25/2008CN101207037A Method for forming a pattern in the same with double exposure technology
06/25/2008CN101207036A Method for etching throughhole
06/25/2008CN101207035A Flash memory and method of fabricating the same
06/25/2008CN101207034A Chamber top cover and reaction chamber containing said top cover
06/25/2008CN101207033A Method for etching polysilicon
06/25/2008CN101207032A 半导体器件 Semiconductor devices
06/25/2008CN101207031A Method for fabricating floating gates structures with reduced and more uniform forward tunneling voltages
06/25/2008CN101207030A Method for manufacturing floating grid and memory
06/25/2008CN101207029A Method for manufacturing floating grid and memory
06/25/2008CN101207028A Method for manufacturing metal-oxide-semiconductor device and semiconductor device
06/25/2008CN101207027A Method for forming semiconductor device grids
06/25/2008CN101207026A Method for forming semiconductor device grids
06/25/2008CN101207025A Method for preparing and regulating semiconductor element grids
06/25/2008CN101207024A Semiconductor memory and forming method thereof
06/25/2008CN101207023A Method for improving discharging sharp-angle in manufacturing technique of SST type flash memory
06/25/2008CN101207022A Method for epitaxial generation of gallium antimonide on gallium arsenide substrate
06/25/2008CN101207021A Double plasma utbox
06/25/2008CN101207020A Method for forming ultra-shallow junction
06/25/2008CN101207019A Method of forming a metal-insulator-metal capacitor
06/25/2008CN101207018A Method for forming anti-reflecting layer and method for manufacturing dual mosaic structure
06/25/2008CN101207017A Method for cleaning semiconductor device
06/25/2008CN101207016A Semiconductor heterostructure
06/25/2008CN101207015A Two-fluid nozzle, substrate processing apparatus, and substrate processing method
06/25/2008CN101207014A Method and apparatus for preventing arcing at ports exposed to a plasma in plasma processing chambers
06/25/2008CN101207013A Method and apparatus for heating a substrate
06/25/2008CN101207012A Method and apparatus for heating a substrate
06/25/2008CN101207011A Manufacture of semiconductor device
06/25/2008CN101207010A A substrate processing apparatus
06/25/2008CN101207009A Method for manufacturing an SOI substrate
06/25/2008CN101207008A Method for manufacturing semiconductor device
06/25/2008CN101207007A Substrate cleaning apparatus, substrate cleaning method, and computer-readable storage medium
06/25/2008CN101207006A Vertical type heat processing apparatus and vertical type heating method
06/25/2008CN101207005A Method for interfering and calibrating light detection device
06/25/2008CN101207004A Method for controlling semiconductor silicon dies etching technique
06/25/2008CN101207003A Inner lining of wafer processing chamber and wafer processing chamber containing said inner lining
06/25/2008CN101207002A Method for processing surface of parts in semiconductor etching equipment
06/25/2008CN101207001A Exhaust device and reaction chamber containing the same
06/25/2008CN101207000A Method for monitoring technique condition in reaction chamber
06/25/2008CN101206999A Inner lining and reaction chamber containing the same
06/25/2008CN101206998A Method for monitoring low temperature rapid hot technics
06/25/2008CN101206997A Method for controlling defect in non-deposition manufacture process
1 ... 2566 2567 2568 2569 2570 2571 2572 2573 2574 2575 2576 2577 2578 2579 2580 2581 2582 2583 2584 2585 2586 ... 6590