Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/24/2008US20080176374 Methods of forming semiconductor devices using self-aligned metal shunts
07/24/2008US20080176373 Semiconductor device and manufacturing method for the same
07/24/2008US20080176372 Method of manufacturing a mosfet structure
07/24/2008US20080176371 Method of making a non-volatile memory device
07/24/2008US20080176370 Method for fabricating semiconductor device
07/24/2008US20080176369 Method of manufacturing semiconductor device including insulated-gate field-effect transistors
07/24/2008US20080176368 Semiconductor Device
07/24/2008US20080176367 Field effect transistor and fabrication thereof, semiconductor device and fabrication thereof, logic circuit including the semiconductor device, and semiconductor substrate
07/24/2008US20080176366 Method for fabricating AIGaN/GaN-HEMT using selective regrowth
07/24/2008US20080176365 Method of making double-gated self-aligned finFET having gates of different lengths
07/24/2008US20080176363 Virtual body-contacted trigate
07/24/2008US20080176362 Stress free package and laminate-based isolator package
07/24/2008US20080176361 Manufacturing method of electronic device
07/24/2008US20080176360 Method for sawing a wafer and method for manufacturing a semiconductor package by using a multiple tape
07/24/2008US20080176359 Method For Manufacturing Of Electronics Package
07/24/2008US20080176358 Fabrication method of multichip stacking structure
07/24/2008US20080176357 Doping; heterojunctions; crystallising by pulsed electronic beam; vapor deposition
07/24/2008US20080176354 Method of uniform current distribution using current modified layer
07/24/2008US20080176353 Semiconductor Light Emitting Element and Method for Manufacturing the Same
07/24/2008US20080176352 Semiconductor laser device
07/24/2008US20080176351 Manufacturing method of display device
07/24/2008US20080176350 Method and apparatus providing CMOS imager device pixel with transistor having lower threshold voltage than other imager device transistors
07/24/2008US20080176349 TFT, flat panel display device having the same, method of manufacturing TFT, method of manufacturing flat panel display device, and method of manufacturing donor sheet
07/24/2008US20080176348 Array substrate of liquid crystal display and fabrication method thereof
07/24/2008US20080176347 Method for manufacturing wiring, thin film transistor, light emitting device and liquid crystal display device, and droplet discharge apparatus for forming the same
07/24/2008US20080176345 Ebeam inspection for detecting gate dielectric punch through and/or incomplete silicidation or metallization events for transistors having metal gate electrodes
07/24/2008US20080176344 Feature Dimension Control in a Manufacturing Process
07/24/2008US20080176343 Method For Smart Dummy Insertion To Reduce Run Time And Dummy Count
07/24/2008US20080176172 Suction; rotation; sealing
07/24/2008US20080176170 For forming pattern that prevents contamination within the exposure apparatus; lithography
07/24/2008US20080176152 Mask Patterns for Semiconductor Device Fabrication and Related Methods and Structures
07/24/2008US20080176150 Exposure mask and method of forming pattern
07/24/2008US20080176145 Method for manufacturing holographic recording medium and method for manufacturing semiconductor device
07/24/2008US20080176002 Substrate treatment method, coating film removing apparatus, and substrate treatment system
07/24/2008US20080175694 Unit and method for transferring substrates and apparatus and method for treating substrates with the unit
07/24/2008US20080175693 Position correcting apparatus, vacuum processing equipment and position correcting method
07/24/2008US20080175530 Photoelectronic wired flexible printed circuit board using optical fiber
07/24/2008US20080175467 System for accumulating exposure energy information of wafer and management method of mask for exposure utilizing exposure energy information of wafer accumulated with the system
07/24/2008US20080175466 Inspection apparatus and inspection method
07/24/2008US20080175292 Laser amplifier and method of making the same
07/24/2008US20080175290 Semiconductor device and method for fabricating the same
07/24/2008US20080175053 Silicon on insulator and thin film transistor bandgap engineered split gate memory
07/24/2008US20080175051 Semiconductor memory
07/24/2008US20080175038 Semiconductor memory device
07/24/2008US20080174930 Electrostatic chuck with heater and manufacturing method thereof
07/24/2008US20080174927 Esd protection scheme for semiconductor devices having dummy pads
07/24/2008US20080174923 ESD protection scheme for semiconductor devices having dummy pads
07/24/2008US20080174853 Multi-layer sheet for use in electro-optic displays
07/24/2008US20080174772 Circuit-pattern inspection apparatus
07/24/2008US20080174757 Imaging device in a projection exposure machine
07/24/2008US20080174755 Movable Stage Apparatus
07/24/2008US20080174750 Apparatus configured to position a workpiece
07/24/2008US20080174711 Liquid crystal display device and fabrication method thereof
07/24/2008US20080174710 Capacitor, semiconductor device and manufacturing method thereof
07/24/2008US20080174584 Flat panel display device
07/24/2008US20080174535 Driver chip and display apparatus having the same
07/24/2008US20080174327 Electric signal connecting device and probe assembly and probing device using the same
07/24/2008US20080174325 Inspection method and inspection apparatus for inspecting electrical characteristics of inspection object
07/24/2008US20080174240 Active matrix electroluminescence device having a metallic protective layer and method for fabricating the same
07/24/2008US20080174029 semiconductor device and method of forming metal pad of semiconductor device
07/24/2008US20080174027 Semiconductor interconnect structure with rounded edges and method for forming the same
07/24/2008US20080174025 Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
07/24/2008US20080174024 Method for realizing an electric linkage in a semiconductor electronic device between a nanometric circuit architecture and standard electronic components
07/24/2008US20080174023 Chip having side pad, method of fabricating the same and package using the same
07/24/2008US20080174022 Semiconductor device and fabrication method thereof
07/24/2008US20080174021 Semiconductor devices having metal interconnections, semiconductor cluster tools used in fabrication thereof and methods of fabricating the same
07/24/2008US20080174020 Electronic device having metal pad structure and method of fabricating the same
07/24/2008US20080174019 Semiconductor device and method for manufacturing the same
07/24/2008US20080174018 Semiconductor device and method for fabricating the same
07/24/2008US20080174017 Hybrid interconnect structure for performance improvement and reliability enhancement
07/24/2008US20080174015 Removal of etching process residual in semiconductor fabrication
07/24/2008US20080174012 Semiconductor device manufacturing method, semiconductor device, and wiring board
07/24/2008US20080174011 Semiconductor structure and method for forming the same
07/24/2008US20080174010 Mems element fabrication method and mems element
07/24/2008US20080174008 Structure of Memory Card and the Method of the Same
07/24/2008US20080174007 Heat sink with preattached thermal interface material and method of making same
07/24/2008US20080174006 Semiconductor device and method of manufacturing the same
07/24/2008US20080174005 Electronic device and method for manufacturing electronic device
07/24/2008US20080174004 Semiconductor device using wiring substrate having a wiring structure reducing wiring disconnection
07/24/2008US20080174003 Apparatus and method for reduced delamination of an integrated circuit module
07/24/2008US20080174002 Stress relieving layer for flip chip packaging
07/24/2008US20080174000 Zigzag-stacked package structure
07/24/2008US20080173998 Chip arrangement and method for producing a chip arrangement
07/24/2008US20080173997 Electronic device and method of manufacturing the same
07/24/2008US20080173996 Semiconductor card package and method of forming the same
07/24/2008US20080173995 Memory card and manufacturing method of the same
07/24/2008US20080173994 Method of making release coatings for composite materials
07/24/2008US20080173992 Semiconductor device including isolation layer
07/24/2008US20080173991 Pre-molded clip structure
07/24/2008US20080173990 Thermally enhanced single inline package (SIP)
07/24/2008US20080173988 Gas phase precipitated polymers as highly insulating chip backside layer
07/24/2008US20080173986 Multilayer silicon nitride deposition for a semiconductor device
07/24/2008US20080173985 Dielectric cap having material with optical band gap to substantially block uv radiation during curing treatment, and related methods
07/24/2008US20080173984 MECHANICALLY ROBUST METAL/LOW-k INTERCONNECTS
07/24/2008US20080173981 Integrated circuit (ic) chip with one or more vertical plate capacitors and method of making the capacitors
07/24/2008US20080173980 Semiconductor device fabrication method and semiconductor device
07/24/2008US20080173979 Semiconductor device with leaning storage node contact and method for fabricating the same
07/24/2008US20080173977 Post sti trench capacitor
07/24/2008US20080173976 Air gap under on-chip passive device
07/24/2008US20080173975 Programmable resistor, switch or vertical memory cell