Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2008
07/29/2008US7405132 Method of making a thin film transistor device
07/29/2008US7405131 Method and structure to prevent silicide strapping of source/drain to body in semiconductor devices with source/drain stressor
07/29/2008US7405130 Method of manufacturing a semiconductor device with a notched gate electrode
07/29/2008US7405129 Device comprising doped nano-component and method of forming the device
07/29/2008US7405128 Dotted channel MOSFET and method
07/29/2008US7405127 Method for producing a vertical field effect transistor
07/29/2008US7405126 Memory device with quantum dot and method for manufacturing the same
07/29/2008US7405125 Tunnel oxynitride in flash memories
07/29/2008US7405124 Fabricating method of non-volatile memory
07/29/2008US7405123 Electrically erasable programmable read-only memory cell and memory device and manufacturing method thereof
07/29/2008US7405122 Methods for fabricating a capacitor
07/29/2008US7405121 Semiconductor device with capacitors and its manufacture method
07/29/2008US7405120 Method of forming a gate insulator and thin film transistor incorporating the same
07/29/2008US7405119 Structure and method for a sidewall SONOS memory device
07/29/2008US7405118 Semiconductor device and method of fabricating the same
07/29/2008US7405117 Method of fabricating a lateral double-diffused MOSFET (LDMOS) transistor
07/29/2008US7405116 Application of gate edge liner to maintain gate length CD in a replacement gate transistor flow
07/29/2008US7405115 Semiconductor device and manufacturing method thereof
07/29/2008US7405114 Laser irradiation apparatus and method of manufacturing semiconductor device
07/29/2008US7405113 Fabrication method of thin film transistor
07/29/2008US7405112 Low contact resistance CMOS circuits and methods for their fabrication
07/29/2008US7405111 Methods for manufacturing an active matrix display device
07/29/2008US7405110 Methods of forming implant regions relative to transistor gates
07/29/2008US7405109 Method of fabricating the routing of electrical signals
07/29/2008US7405108 Methods for forming co-planar wafer-scale chip packages
07/29/2008US7405107 Semiconductor device, method and apparatus for fabricating the same
07/29/2008US7405106 Quad flat no-lead chip carrier with stand-off
07/29/2008US7405105 Stack package using anisotropic conductive film (ACF) and method of making same
07/29/2008US7405104 Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
07/29/2008US7405103 Process for fabricating chip embedded package structure
07/29/2008US7405102 Methods and apparatus for thermal management in a multi-layer embedded chip structure
07/29/2008US7405101 CMOS imager with selectively silicided gate
07/29/2008US7405100 Packaging of a semiconductor device with a non-opaque cover
07/29/2008US7405099 Wide and narrow trench formation in high aspect ratio MEMS
07/29/2008US7405098 Smooth surface liquid phase epitaxial germanium
07/29/2008US7405097 CMOS image sensor and method for manufacturing the same
07/29/2008US7405096 Manufacturing method of nitride semiconductor device and nitride semiconductor device
07/29/2008US7405095 Method for producing color-wheel segments
07/29/2008US7405094 Light emitting devices for light conversion and methods and semiconductor chips for fabricating the same
07/29/2008US7405093 Methods of assembly for a semiconductor light emitting device package
07/29/2008US7405092 Method of manufacturing electron-emitting device and method of manufacturing image display apparatus
07/29/2008US7405091 Method for testing contact open in semicoductor device
07/29/2008US7405090 Method of measuring an effective channel length and an overlap length in a metal-oxide semiconductor field effect transistor
07/29/2008US7405089 Method and apparatus for measuring a surface profile of a sample
07/29/2008US7405088 Method for analyzing fail bit maps of waters and apparatus therefor
07/29/2008US7405087 Magnetic memory device and method of manufacturing the same
07/29/2008US7405086 Above room temperature ferromagnetic silicon
07/29/2008US7405085 Amorphous soft magnetic shielding and keeper for MRAM devices
07/29/2008US7405034 Polymeric structures, particularly microstructures, and methods for making same
07/29/2008US7405033 Method for manufacturing resist pattern and method for manufacturing semiconductor device
07/29/2008US7405031 Lithographic apparatus and device manufacturing method
07/29/2008US7405028 Polymers based on cinnamic acid as a bottom antireflective coating for 157 NM photolithography
07/29/2008US7405025 Dicing lines extending longitudinally and transversely, and chip areas surrounded by the dicing lines are formed in a resist mask; critical-dimension patterns are formed in the dicing lines so as to be paired while placing the center line in between; for verification of process accuracy
07/29/2008US7405024 Lithographic mask, and method for covering a mask layer
07/29/2008US7405007 Semiconductor having a substantially uniform layer of electroplated metal
07/29/2008US7404991 Device and control method for micro wave plasma processing
07/29/2008US7404990 Non-thermal process for forming porous low dielectric constant films
07/29/2008US7404985 Noble metal layer formation for copper film deposition
07/29/2008US7404910 Etching solution, etched article and method for etched article
07/29/2008US7404886 Removing additives adsorbed on the top and cavity portions to allow plating to take place before the additive fully re-adsorbs onto the top portion so it is plated more than the cavity
07/29/2008US7404879 Ionized physical vapor deposition apparatus using helical self-resonant coil
07/29/2008US7404874 Method and apparatus for treating wafer edge region with toroidal plasma
07/29/2008US7404870 Methods for forming an assembly for transfer of a useful layer
07/29/2008US7404863 Methods of thinning a silicon wafer using HF and ozone
07/29/2008US7404757 Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system
07/29/2008US7404681 Coating methods and apparatus for coating
07/29/2008US7404511 Laser trimming problem suppressing semiconductor device manufacturing apparatus and method
07/29/2008US7404409 Substrate processing system and substrate processing method
07/29/2008US7404407 Substrate processing apparatus
07/29/2008US7404249 Method of manufacturing an inductance
07/29/2008CA2483558C Methods of handling wind turbine blades and mounting said blades on a wind turbine, system and gripping unit for handling a wind turbine blade
07/24/2008WO2008089474A2 Apparatus and method for reduced delamination of an integrated circuit module
07/24/2008WO2008089418A1 Microwave surface mount hermetically sealed package and method of forming the same
07/24/2008WO2008089415A2 A small form factor molded memory card and method thereof
07/24/2008WO2008089297A1 Multilayer silicon nitride deposition for a semiconductor device
07/24/2008WO2008089228A1 Recycling of ion implantation monitor wafers
07/24/2008WO2008089227A1 Non-volatile memory cell manufactured with cmos process steps
07/24/2008WO2008089153A2 Methods of forming spacer patterns using assist layer for high density semiconductor devices
07/24/2008WO2008089129A1 Scaleable image archiving and receiving system
07/24/2008WO2008088950A1 Method and system for detection of wafer centering in a track lithography tool
07/24/2008WO2008088907A2 Encapsulated graphite heater and process
07/24/2008WO2008088831A2 Coiled circuit device with active circuitry and methods for making the same
07/24/2008WO2008088825A1 Methods of forming through-substrate interconnects
07/24/2008WO2008088743A1 Gas treatment systems
07/24/2008WO2008088670A1 Extending lifetime of yttrium oxide as a plasma chamber material
07/24/2008WO2008088668A1 Apparatuses for adjusting electrode gap in capacitively-coupled rf plasma reactor
07/24/2008WO2008088654A1 Nand memory with dual control gates having fixed charge layer below control gates
07/24/2008WO2008088587A1 High throughput, low cost dual-mode patterning method for large area substrates
07/24/2008WO2008088559A1 Method and structure for cleaning surfaces for bonding layer transfer substrates
07/24/2008WO2008088551A1 Transparent conducting oxides and production thereof
07/24/2008WO2008088549A1 Folded package camera module and method of manufacture
07/24/2008WO2008088479A1 Microelectronic die including solder caps on bumping sites thereof and method of making same
07/24/2008WO2008088471A1 Annulus clamping and backside gas cooled electrostatic chuck
07/24/2008WO2008088459A1 Method of damaged low-k dielectric film layer removal
07/24/2008WO2008088300A2 Selective etching of oxides from substrates
07/24/2008WO2008088298A1 Method for producing thin semiconductor films
07/24/2008WO2008088291A1 Method of semiconductor packaging and/or a semiconductor package
07/24/2008WO2008088199A1 Method for fabricating semiconductor device
07/24/2008WO2008088120A1 Method for packaging semiconductor
07/24/2008WO2008088109A1 A loadlock chamber having dual-arm and a transportation system for processing semiconductor material using a loadlock chamber having dual-arm