Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/04/2014CN103834497A Epoxy resin corrodent and application of epoxy resin corrodent in removal of semiconductor packaging material
06/04/2014CN103832966A Forming method and detection method of semiconductor device
06/04/2014CN103831676A Window cleaning kit for wire bonding apparatus, wire bonding apparatus including the same and cleaning method of capillary using the same
06/04/2014CN102856258B Formation method of semiconductor device
06/04/2014CN102804359B Semiconductor device
06/04/2014CN102738082B Method for manufacturing semiconductor device
06/04/2014CN102738062B Method for manufacturing semiconductor device
06/04/2014CN102709250B Semiconductor device manufacturing method utilizing stress memorization technology
06/04/2014CN102709249B Manufacturing method for semi-conductor appliance through application of stress memory technology
06/04/2014CN102709245B Method for preparing double-layer SOI (Silicon on Insulator) mixed crystal orientation rear grid type inverted mode SiNWFET (Silicon Nano Wire Field Effect Transistor)
06/04/2014CN102683294B Method for preparing double-layer isolation mixed crystal orientation rear gate type Si nanowire field effect transistor (SiNWFET) on silicon on insulator (SOI)
06/04/2014CN102664165B Method for manufacturing complementary tunneling field effect transistor (TFET) based on standard complementary metal oxide semiconductor integrated circuit (CMOS IC) process
06/04/2014CN102645102B Cooling system, thermal annealing furnace pipe with same and cooling method
06/04/2014CN102623393B Method for filling micropores by utilizing tin whisker growth
06/04/2014CN102623343B Side wall hollow layer structure for semiconductor device and preparation method for side wall hollow layer structure
06/04/2014CN102597061B Polyimide precursor and photosensitive resin composition containing the polyimide precursor
06/04/2014CN102592999B Method for optimizing thickness of channel layer of quantum well high electron mobility transistor (HEMT) appliance
06/04/2014CN102569509B Carbon plate conveying assembly and disassembly platform of feeding and discharging systems of plate-type plasma enhanced chemical vapor deposition (PECVD) device
06/04/2014CN102569161B Semiconductor device manufacturing method
06/04/2014CN102569118B Yield increasing system of excursion management in semiconductor manufacturing process
06/04/2014CN102569019B Shallow trench isolation forming method
06/04/2014CN102543996B Pixel structure and manufacturing method thereof
06/04/2014CN102543782B Switching and encapsulating structure and forming method thereof
06/04/2014CN102543760B Method for increasing shallow trench isolating compressive stress and improving NMOS electron mobility
06/04/2014CN102543706B Integration process for different polycrystalline silicon gate electrode thicknesses
06/04/2014CN102522348B Eutectic welding machine for die bonding of LED (Light Emitting Diode) chip
06/04/2014CN102516876B Polishing composition for silicon wafer polishing and preparation method thereof
06/04/2014CN102516873B Silicon wafer polishing composition and preparation method thereof
06/04/2014CN102487009B Manufacturing method of source electrode and drain electrode of N metal-oxide semiconductor field effect transistor (MOS) device
06/04/2014CN102486991B Method of wafer surface photoresist edge removing
06/04/2014CN102486604B Phase shift mask, manufacturing method thereof and haze defect detection method thereof
06/04/2014CN102479692B Gate forming method
06/04/2014CN102468217B Method for forming contact hole
06/04/2014CN102468178B Method for manufacturing transistor
06/04/2014CN102468168B Method for forming metal oxide semiconductor (MOS) transistor
06/04/2014CN102446854B Manufacturing method for CMOS (Complementary Metal Oxide Semiconductor) transistor
06/04/2014CN102446812B Metal interconnecting method
06/04/2014CN102437123B Implantation method and structure capable of enhancing writing speed of floating body dynamic random access memory unit
06/04/2014CN102437049B Method for simplifying double pattern exposure process of side wall definition
06/04/2014CN102437037B Method for effectively reducing water mark defects
06/04/2014CN102422445B Epitaxial wafer for light emitting diode
06/04/2014CN102420194B Passivation layer of integrated circuit and manufacturing method of passivation layer
06/04/2014CN102412138B Method for treating silicon nitride film under non-field condition to guarantee high tensile stress of silicon nitride film
06/04/2014CN102408837B Polishing composition capable of improving silicon wafer polishing accuracy and preparation method thereof
06/04/2014CN102403263B Trench etching method in double Damascus structure
06/04/2014CN102403226B Transistor and manufacturing method thereof
06/04/2014CN102376525B Exhaust system for semiconductor processing and method for cleaning exhaust system
06/04/2014CN102356186B Germanium ingots/wafers having low micro-pit density (mpd) as well as systems and methods for manufacturing same
06/04/2014CN102308380B Electrocstatic chuck system and process for radially tuning the temperature profile across the surface of a substrate
06/04/2014CN102301445B Method for manufacturing element by etching
06/04/2014CN102290374B Method of manufacturing IC device
06/04/2014CN102280423B Integrated circuit device and manufacturing method thereof
06/04/2014CN102280362B Control system of substrate processing apparatus, collecting unit, substrate processing apparatus and control method of the substrate processing apparatus
06/04/2014CN102272899B Electrically actuated device and method of controlling the formation of dopants therein
06/04/2014CN102246289B De-clamping wafers from an electrostatic chuck
06/04/2014CN102237279B Oxide terminated trench MOSFET with three or four masks
06/04/2014CN102232245B Method for producing a metal contact on a semiconductor substrate provided with a coating
06/04/2014CN102224590B Antenna integrated in a semiconductor chip
06/04/2014CN102224585B Integration sequences with top profile modification
06/04/2014CN102222606B Forming method of capacitor
06/04/2014CN102203918B Self cleaning and adjustable slurry delivery arm
06/04/2014CN102203871B Semiconductor integrated circuit
06/04/2014CN102201365B Method for producing semiconductor device
06/04/2014CN102201358B Device and method for characterizing substrate surface property
06/04/2014CN102196881B Semiconductor device
06/04/2014CN102187452B Semiconductor substrates with unitary vias and via terminals, and associated systems and methods
06/04/2014CN102165594B Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate
06/04/2014CN102165586B Leadframe substrate and method for manufacturing same
06/04/2014CN102163530B Plasma processing apparatus
06/04/2014CN102148213B Lead frame of high-power chip package structure and manufacturing method thereof
06/04/2014CN102122638B Semiconductor device and method for forming stress film of CMOS (Complementary Metal-Oxide-Semiconductor Transistor) device
06/04/2014CN102104074B Semiconductor device and manufacturing method thereof
06/04/2014CN102084512B Switching element
06/04/2014CN102077339B Big foot lift pin
06/04/2014CN102074571B Semiconductor device and method of manufacturing semiconductor device
06/04/2014CN102017101B System for non radial temperature control for rotating substrates
06/04/2014CN101903991B Methods for isolating portions of a loop of pitch-multiplied material and related structures
06/04/2014CN101894738B Method of cleaning semiconductor wafers
06/04/2014CN101887916B Asymmetric semiconductor devices and method of fabricating
06/04/2014CN101859722B Processing device
06/04/2014CN101728332B Method of forming patterns for semiconductor device
06/04/2014CN101673711B Semiconductor integrated circuit device and a method of manufacturing the same
06/04/2014CN101609810B Method of improving adhesive power of semiconductor device and method of processing semiconductor device
06/04/2014CN101542702B Bonding method of three dimensional wafer lamination based on silicon through holes
06/04/2014CN101523419B Semiconductor device
06/04/2014CN101456530B Method and system for mems switches fabricated in an integrated circuit package
06/04/2014CN101404861B Electronic circuit device and method of making the same
06/03/2014US8745420 Semiconductor device for supplying power supply voltage to semiconductor device
06/03/2014US8744615 Substrate processing system, substrate detecting apparatus, and substrate detecting method
06/03/2014US8743837 Modified preamble structure for IEEE 802.11A extensions to allow for coexistence and interoperability between 802.11A devices and higher data rate, MIMO or otherwise extended devices
06/03/2014US8743250 Semiconductor device and method of driving the same
06/03/2014US8743165 Methods and device for laser processing
06/03/2014US8742872 MEMS element, and manufacturing method of MEMS element
06/03/2014US8742780 Semiconductor devices including design for test capabilities and semiconductor modules and test systems including such devices
06/03/2014US8742601 Semiconductor device including a buffer layer structure for reducing stress
06/03/2014US8742596 Semiconductor device and method for manufacturing same
06/03/2014US8742595 MEMS devices and methods of forming same
06/03/2014US8742591 Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief
06/03/2014US8742588 Method for making via interconnection
06/03/2014US8742585 Semiconductor device having a plurality of pads of low diffusible material formed in a substrate