Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
10/2008
10/16/2008US20080251876 Photoreceiver cell with color separation
10/16/2008US20080251872 Image sensor package, method of manufacturing the same, and image sensor module including the image sensor package
10/16/2008US20080251868 Standard component for calibration and electron-beam system using the same
10/16/2008US20080251867 Nanowire Magnetic Random Access Memory
10/16/2008US20080251865 Nanoelectromechanical systems and methods for making the same
10/16/2008US20080251864 Stacked poly structure to reduce the poly particle count in advanced cmos technology
10/16/2008US20080251862 Accumulation field effect microelectronic device and process for the formation thereof
10/16/2008US20080251861 Semiconductor apparatus and production method of the same
10/16/2008US20080251860 Semiconductor Memory Device
10/16/2008US20080251859 Semiconductor Module
10/16/2008US20080251857 Semiconductor Device with Improved Contact Pad and Method for Fabrication Thereof
10/16/2008US20080251856 Forming silicided gate and contacts from polysilicon germanium and structure formed
10/16/2008US20080251851 Strain enhanced semiconductor devices and methods for their fabrication
10/16/2008US20080251850 PMD Liner Nitride Films and Fabrication Methods for Improved NMOS Performance
10/16/2008US20080251849 Semiconductor Device and Method for Manufacturing Same
10/16/2008US20080251848 Manufacturing method for homogenizing the environment of transistors and associated device
10/16/2008US20080251846 Method and structure for low capacitance esd robust diodes
10/16/2008US20080251845 Semiconductor Device and Manufacturing Method Thereof
10/16/2008US20080251844 Method for forming pattern, method for manufacturing semiconductor device and semiconductor device
10/16/2008US20080251843 Semiconductor memory device and manufacturing method thereof
10/16/2008US20080251842 P-Channel FET Whose Hole Mobility is Improved by Applying Stress to the Channel Region and a Method of Manufacturing the Same
10/16/2008US20080251841 Mos transistor and manufacturing method thereof
10/16/2008US20080251839 Semiconductor device and method for fabricating the same
10/16/2008US20080251838 Semiconductor device
10/16/2008US20080251837 Semiconductor device and manufacturing method thereof
10/16/2008US20080251836 Non-volatile memory device and method for fabricating the same
10/16/2008US20080251834 Non-volatile semiconductor memory device and its manufacturing method
10/16/2008US20080251833 Integrated circuits and methods of manufacture
10/16/2008US20080251831 Semiconductor structure and process for reducing the second bit effect of a memory device
10/16/2008US20080251829 Memory device and fabrication method thereof
10/16/2008US20080251828 Enhanced atomic layer deposition
10/16/2008US20080251826 Multi-layer semiconductor structure and manufacturing method thereof
10/16/2008US20080251824 Semiconductor memory device and manufacturing method thereof
10/16/2008US20080251821 Method and device to reduce dark current in image sensors
10/16/2008US20080251820 CMOS image sensor and fabricating method thereof
10/16/2008US20080251819 Semiconductor device and method of manufacturing the same
10/16/2008US20080251818 Low noise jfet
10/16/2008US20080251816 Semiconductor memory device and method for fabricating the same
10/16/2008US20080251815 Method for manufacturing a transistor
10/16/2008US20080251814 Hetero-bonded semiconductor-on-insulator substrate with an unpinning dielectric layer
10/16/2008US20080251812 Heteroepitaxial Crystal Quality Improvement
10/16/2008US20080251807 Semiconductor light emitting device and method for manufacturing the same
10/16/2008US20080251802 METHOD FOR DEPOSITION OF (Al,In,Ga,B)N
10/16/2008US20080251801 Method of producing group iii-v compound semiconductor, schottky barrier diode, light emitting diode, laser diode, and methods of fabricating the diodes
10/16/2008US20080251800 Undoped and Unintentionally Doped Buffer Structures
10/16/2008US20080251797 Array substrate and method for manufacturing the same
10/16/2008US20080251793 Junction barrier schottky rectifiers having epitaxially grown p+-n junctions and methods of making
10/16/2008US20080251790 Pixel, a Storage Capacitor, and a Method for Forming the Same
10/16/2008US20080251789 Pixel structure and method for fabricating the same
10/16/2008US20080251788 Wafer-level package having test terminal
10/16/2008US20080251787 Thin film transistor substrate and flat panel display comprising the same
10/16/2008US20080251785 Display device and method of fabricating the same
10/16/2008US20080251778 Four-terminal programmable via-containing structure and method of fabricating same
10/16/2008US20080251557 Scribing unit and apparatus for scribing panel with the scribing unit, and scribing method and method for manufacutring substrate
10/16/2008US20080251506 Laser Processing Method and Device
10/16/2008US20080251414 Container and metal actuator of latching mechanism thereof
10/16/2008US20080251385 Electrolytic treatment such as plating or etching; providing high resistance structure having electrical conductivity lower than that of electrolytic solution in solution filled between substrate in contact with an electrode; filling metal such as copper in fine interconnect patterns in semiconductor
10/16/2008US20080251207 Multiple frequency plasma chamber, switchable rf system, and processes using same
10/16/2008US20080251206 Plasma Processing Apparatus And Method For Controlling The Same
10/16/2008US20080251116 Artificial Amorphous Semiconductors and Applications to Solar Cells
10/16/2008US20080251101 Substrate Cleaning Method, Substrate Cleaning Equipment, Computer Program, and Program Recording Medium
10/16/2008US20080251019 System and method for transferring a substrate into and out of a reduced volume chamber accommodating multiple substrates
10/16/2008US20080251008 Substrate Processing Apparatus and Semiconductor Device Producing Method
10/16/2008US20080250619 Vertical type semiconductor device producing apparatus
10/16/2008DE19904138B4 Verfahren zur Herstellung von Kontakthügeln für die Chipeinbettung in Dünnfilmanordnungen Process for the preparation of bumps for the chip embedding in thin film devices
10/16/2008DE19801770B4 Probenanalyseverfahren Sample analysis method
10/16/2008DE112007000092T5 Gruppe-III-Nitrid-Leistungshalbleiter mit einem Feld-Relaxations-Merkmal Group III-nitride power semiconductor with a field-relaxation characteristic
10/16/2008DE112006003315T5 Gaskopf und Dünnfilm-Herstellungsvorrichtung Gas head and the thin film forming apparatus
10/16/2008DE112006003206T5 Verfahren zur Herstellung eines Kontakts in einer Halbleiteranordnung A process for producing a contact in a semiconductor device
10/16/2008DE112005003802T5 Elektronisches Bauteil und ein Verfahren zum Herstellen eines elektronischen Bauteils Electronic component and a method of manufacturing an electronic component
10/16/2008DE112004000665B4 Verfahren zur Ausbildung eines ferroelektrischen Kondensators A method of forming a ferroelectric capacitor
10/16/2008DE10338078B4 Halbleiterelement mit verbesserten Haftungseigenschaften der nichtmetallischen Oberflächen und Verfahren zu dessen Herstellung Semiconductor element with improved adhesion properties of the non-metallic surfaces and process for its preparation
10/16/2008DE10331560B4 Halbleitervorrichtung mit einem Verbundbereich und ein Verfahren zur Herstellung derselben A semiconductor device comprising a composite region and a method of manufacturing the same
10/16/2008DE10205084B4 Verfahren zur thermischen Behandlung einer Siliciumscheibe sowie dadurch hergestellte Siliciumscheibe Method for the thermal treatment of a silicon wafer and silicon wafer produced thereby
10/16/2008DE102008016665A1 Verkapselungsverfahren und Vorrichtung Encapsulation methods and apparatus
10/16/2008DE102008016324A1 Halbleiterbausteinpackung mit einem Chip aufnehmendem Durchgangsloch und doppelseitigen Aufbauschichten auf beiden Oberflächenseiten für WLP und ein Verfahren dazu Semiconductor device package with a chip aufnehmendem through hole and double-sided structure layers on both surfaces for WLP and a method thereof
10/16/2008DE102008013755A1 Deckschichten beinhaltend Aluminiumnitrid für Nitrid-basierte Transistoren und Verfahren zu deren Herstellung Outer layers comprising aluminum nitride for nitride based transistors and methods for their preparation
10/16/2008DE102007036047A1 Integrierte Schaltung, Widerstandsänderungsspeichervorrichtung, Speichermodul sowie Verfahren zum Herstellen einer integrierten Schaltung An integrated circuit, the resistance change memory device, memory module, and method of fabricating an integrated circuit
10/16/2008DE102007032290B3 Transistor i.e. recessed channel array transistor, for use in memory i.e. dynamic RAM, of integrated circuit, has gate electrode arranged in gate trench, and carbon material corresponding to layer over gate dielectric layer
10/16/2008DE102007019320A1 Integrierte Schaltkreise und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same
10/16/2008DE102007014389A1 Semiconductor components producing method, involves placing semiconductor elements in hollow spaces, where number of hollow spaces is filled with housing material, and removing carrier
10/16/2008DE102006023607B4 Verfahren zur Ausbildung von Seitenwand-Distanzstrukturen und Feldeffekttransistoren sowie Strukturierungsverfahren Methods of forming sidewall spacer and field effect transistors and patterning methods
10/16/2008DE102005030588B4 Technik zum Reduzieren des Ätzschadens während der Herstellung von Kontaktdurchführungen und Gräben in Zwischenschichtdielektrika Technique for reducing the Ätzschadens during the production of vias and trenches in interlayer
10/16/2008DE102005027456B4 Photodiode mit verringertem Dunkelstrom, Verfahren zur Herstellung und ihre Verwendung Photodiode having a reduced dark current, process for preparation and their use
10/16/2008DE102004063949B4 Verfahren zum Herstellen eines eine becherförmige Elektrodenstruktur aufweisenden Kondensators A method for producing a a cup-shaped electrode structure having capacitor
10/16/2008DE102004013056B4 Verfahren zur Herstellung eines Halbleiterbauelements A process for producing a semiconductor device
10/16/2008DE10164359B4 Versorgungsspannungspegeldetektor Power supply voltage level detector
10/16/2008DE10139555B4 Verfahren zum Aufbringen einer Haftvermittlerschicht auf einer Metallschicht eines Chips A method of applying an adhesive layer on a metal layer of a chip
10/16/2008DE10085278B4 Verfahren zur Herstellung eines polykristallinen Aluminumnitridkörpers A process for producing a polycrystalline Aluminumnitridkörpers
10/16/2008DE10013067B4 Verfahren zum Herstellen von einer Halbleitervorrichtung durch Chipvereinzelung und Wafer-Lösevorrichtung A process for producing a semiconductor device by dicing the wafer and release device
10/15/2008EP1981086A1 Thin film transistor, and active matrix substrate and display device provided with such thin film transistor
10/15/2008EP1981085A1 Tft substrate, reflective tft substrate and method for manufacturing such substrates
10/15/2008EP1981083A2 Method for manufacturing an SOI substrate
10/15/2008EP1981079A2 Method for manufacturing an SOI substrate
10/15/2008EP1981078A1 Drive apparatus for substrate transfer robot having coolant circulating passage
10/15/2008EP1981077A2 Surface treatment method and surface treatment apparatus
10/15/2008EP1981076A1 Method for manufacturing silicon carbide semiconductor device
10/15/2008EP1981074A1 Organic silica film and method for forming same, composition for forming insulating film of semiconductor device and method for producing same, wiring structure and semiconductor device
10/15/2008EP1981073A2 Surface treatment method and surface treatment apparatus
10/15/2008EP1981072A1 Single wafer etching method
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