Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/05/2014WO2014083924A1 Semiconductor device and method for manufacturing same
06/05/2014WO2014083872A1 Sheet for forming resin film for chips and method for manufacturing semiconductor device
06/05/2014WO2014083871A1 Exposure apparatus and exposure method
06/05/2014WO2014083805A1 Semiconductor device and wire bonding wiring method
06/05/2014WO2014083782A1 Resist film forming device and method, conductive film forming and circuit forming device and method, electromagnetic wave shield forming device and method, shortwave high-transmissibility insulation film forming device and method, fluorescent light body film forming device and method, trace material combining device and method, resin molding device, resin molding method, thin film forming device, organic electroluminescence element, bump forming device and method, wiring forming device and method, and wiring structure body
06/05/2014WO2014083771A1 Semiconductor element and method for manufacturing same
06/05/2014WO2014083731A1 Method for manufacturing display apparatus
06/05/2014WO2014083647A1 Method for manufacturing resin-sealed semiconductor device, and resin-sealed semiconductor device
06/05/2014WO2014083633A1 Substrate transfer apparatus and method for changing substrate transfer apparatus
06/05/2014WO2014083606A1 Die supply device
06/05/2014WO2014083558A1 A monolithic optical receiver and a method for manufacturing same
06/05/2014WO2014083241A1 Method for fabricating a passivation film on a crystalline silicon surface
06/05/2014WO2014083240A1 A method for fabricating a structure comprising a passivation layer on a surface of a substrate
06/05/2014WO2014083152A1 Station and method for measuring the particulate contamination of a transport chamber for conveying and atmospherically storing semiconductor substrates
06/05/2014WO2014083151A1 Station and method for measuring particulate contamination of a transport chamber for conveying and atmospherically storing semiconductor substrates
06/05/2014WO2014082545A1 Substrate etching method
06/05/2014WO2014082438A1 Addressable test circuit for testing transistor key parameters, and test method thereof
06/05/2014WO2014082357A1 Planarization processing method
06/05/2014WO2014082356A1 Planarization processing method
06/05/2014WO2014082352A1 Planarization processing method
06/05/2014WO2014082351A1 Method for manufacturing fin structure
06/05/2014WO2014082350A1 Method for manufacturing fin structure
06/05/2014WO2014082340A1 Finfet and manufacturing method thereof
06/05/2014WO2014082339A1 Manufacturing method of n-type mosfet
06/05/2014WO2014082338A1 Method for manufacturing semiconductor device
06/05/2014WO2014082337A1 Semiconductor device and manufacturing method thereof
06/05/2014WO2014082336A1 Semiconductor device and manufacturing method thereof
06/05/2014WO2014082335A1 N-type mosfet and manufacturing method thereof
06/05/2014WO2014082334A1 Method for manufacturing semiconductor device
06/05/2014WO2014082333A1 Manufacturing method of n-type mosfet
06/05/2014WO2014082332A1 Manufacturing method of semiconductor device
06/05/2014WO2014082331A1 Method for manufacturing p-type mosfet
06/05/2014WO2014082292A1 Self-aligned metal oxide thin-film transistor component and production method thereof
06/05/2014WO2014082213A1 Moist air controller and system for static charge reduction
06/05/2014WO2014082212A1 Method and apparatus for cleaning semiconductor wafer
06/05/2014WO2014082197A1 Method for forming interconnection structures
06/05/2014WO2014082196A1 Substrate supporting apparatus
06/05/2014WO2014082153A1 Furnace and method for processing silicon wafers
06/05/2014WO2014082152A1 Method for diffusing dopants into silicon wafers for manufacturing solar cells
06/05/2014WO2014071312A9 Semiconductor device and method of adaptive patterning for panelized packaging
06/05/2014US20140154891 Beam Delivery Systems for Laser Processing Materials and Associated Methods
06/05/2014US20140154890 Periphery coating apparatus, periphery coating method and storage medium therefor
06/05/2014US20140154889 Dry-etch for selective tungsten removal
06/05/2014US20140154888 Showerhead electrode assemblies for plasma processing apparatuses
06/05/2014US20140154887 Semiconductor device processing tools and methods for patterning substrates
06/05/2014US20140154886 Methods of Processing Semiconductor Substrates In Forming Scribe Line Alignment Marks
06/05/2014US20140154885 Methods of fabricating semiconductor devices having double patterning technology
06/05/2014US20140154883 Tungsten nucleation process to enable low resistivity tungsten feature fill
06/05/2014US20140154881 Method of manufacturing metal silicide and semiconductor structure using the same
06/05/2014US20140154880 Post-Polymer Revealing of Through-Substrate Via Tips
06/05/2014US20140154879 Methods of forming interconnects and semiconductor structures
06/05/2014US20140154878 Nor flash device manufacturing method
06/05/2014US20140154876 Mechanisms for forming stressor regions in a semiconductor device
06/05/2014US20140154875 Method of epitaxial germanium tin alloy surface preparation
06/05/2014US20140154874 Method of making semiconductor materials and devices on silicon substrate
06/05/2014US20140154873 Dislocation engineering using a scanned laser
06/05/2014US20140154872 Dislocation engineering using a scanned laser
06/05/2014US20140154871 Method and system for manufacturing semiconductor device
06/05/2014US20140154870 Method of manufacturing semiconductor wafers
06/05/2014US20140154869 Method and Apparatus for Plasma Dicing a Semi-conductor Wafer
06/05/2014US20140154868 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
06/05/2014US20140154867 Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation
06/05/2014US20140154866 Method of Forming a Semiconductor Memory Device
06/05/2014US20140154865 Shallow trench isolation structures
06/05/2014US20140154864 Crack stop structure and method for forming the same
06/05/2014US20140154861 Semiconductor Constructions, Memory Arrays, Methods of Forming Semiconductor Constructions and Methods of Forming Memory Arrays
06/05/2014US20140154854 Methods for fabricating integrated circuits
06/05/2014US20140154848 N/P METAL CRYSTAL ORIENTATION FOR HIGH-K METAL GATE Vt MODULATION
06/05/2014US20140154845 Complementary soi lateral bipolar for sram in a cmos platform
06/05/2014US20140154843 Method for Top-side Cooled Semiconductor Package with Stacked Interconnection Plates
06/05/2014US20140154842 Carrier, semiconductor package and fabrication method thereof
06/05/2014US20140154838 Mounting apparatus and mounting method
06/05/2014US20140154837 Method for manufacturing semiconductor device
06/05/2014US20140154832 Plasma processing apparatus and plasma processing method
06/05/2014US20140154831 Method and Device for processing at least one crystalline Silicon-wafer or a Solar-cell wafer
06/05/2014US20140154819 Power switching system for esc with array of thermal control elements
06/05/2014US20140154818 Defect detection method, method for repairing organic el element, and organic el display panel
06/05/2014US20140154465 Substrate support assembly having a plasma resistant protective layer
06/05/2014US20140154406 Wet activation of ruthenium containing liner/barrier
06/05/2014US20140154038 Multi-axis robot apparatus with unequal length forearms, electronic device manufacturing systems, and methods for transporting substrates in electronic device manufacturing
06/05/2014US20140154037 Method and systems for semiconductor chip pick & transfer and bonding
06/05/2014US20140154033 Dual arm vacuum robot
06/05/2014US20140153001 Gimbaled scanning mirror array
06/05/2014US20140152383 Integrated circuits and systems and methods for producing the same
06/05/2014US20140152349 Semiconductor device, manufacturing method thereof and operating method thereof
06/05/2014US20140151903 Repairing method, repairing structure, and repairing system for disconnected defect
06/05/2014US20140151900 Stacked packaging using reconstituted wafers
06/05/2014US20140151896 Implementing enhanced power supply distribution and decoupling utilizing tsv exclusion zone
06/05/2014US20140151895 Die having through-substrate vias with deformation protected tips
06/05/2014US20140151894 Far back end of the line stack encapsulation
06/05/2014US20140151893 Semiconductor interconnect structures
06/05/2014US20140151890 Package with a fan-out structure and method of forming the same
06/05/2014US20140151889 Techniques for enhancing dielectric breakdown performance
06/05/2014US20140151888 Air-Gap Formation in Interconnect Structures
06/05/2014US20140151887 Memory Device Interconnects and Method of Manufacture
06/05/2014US20140151886 Semiconductor element and method for manufacturing semiconductor element
06/05/2014US20140151885 Semiconductor device and method for manufacturing a semiconductor device
06/05/2014US20140151883 Method for manufacturing a semiconductor component and structure therefor
06/05/2014US20140151879 Stress-resilient chip structure and dicing process
06/05/2014US20140151875 Crosstalk polarity reversal and cancellation through substrate material tuning
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