Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/04/2014CN103840014A Groove type schottky diode device structure and process realization method
06/04/2014CN103840013A Bidirectional TVS and manufacturing method of bidirectional TVS
06/04/2014CN103840012A Junction field-effect transistor (JFET) and preparation method thereof
06/04/2014CN103840011A Zinc-oxide-base amorphous oxide semiconductor thin film transistor and manufacturing method thereof
06/04/2014CN103840010A Thin film transistor and fabrication method thereof
06/04/2014CN103840008A High-voltage LDMOS device based on BCD process and manufacturing process
06/04/2014CN103840006A Fin type field effect transistor with GeSn channel and forming method thereof
06/04/2014CN103840005A Fin type field effect transistor with SiGeSn source drain and forming method thereof
06/04/2014CN103840004A Fin type field effect transistor with SiGeSn source drain and forming method thereof
06/04/2014CN103840003A Double-gate graphene transistor with aluminum oxide as gate dielectric and manufacturing method thereof
06/04/2014CN103840001A High voltage drain-extended mosfet having extra drain-od addition
06/04/2014CN103840000A Semiconductor device with reduced miller capacitance and fabrication method thereof
06/04/2014CN103839999A Structure and preparation method of power field effect transistor
06/04/2014CN103839998A LDMOS device and manufacture method thereof
06/04/2014CN103839997A Planar DMOS device, preparation method thereof, and electronic device
06/04/2014CN103839996A Groove grid high-voltage device based on composite drain electrode and method for manufacturing same
06/04/2014CN103839994A IGBT structure and manufacturing method thereof
06/04/2014CN103839992A Structure and preparation method of power device - TI - IGBT
06/04/2014CN103839991A Weak current connecting structure formed by terminal and active region and design method thereof
06/04/2014CN103839990A Buffer layer structure of IGBT and manufacturing method thereof
06/04/2014CN103839989A Low-voltage IGBT with buffer layer and method for manufacturing low-voltage IGBT with buffer layer
06/04/2014CN103839988A Structure of EMPT-TI-IGBT device and manufacturing method thereof
06/04/2014CN103839987A Structure and manufacturing method of power device MPT-TI-IGBT
06/04/2014CN103839985A Lateral parasitic PNP device in germanium-silicon HBT process and manufacturing method thereof
06/04/2014CN103839984A InP/high kappa gate medium stack structure and preparation method thereof
06/04/2014CN103839983A Semiconductor device and manufacturing method thereof
06/04/2014CN103839981A Semiconductor device and method for manufacturing same
06/04/2014CN103839980A MOSFET with SiGeSn source drain and forming method thereof
06/04/2014CN103839979A Nitride semiconductor device, nitride semiconductor wafer, and method for forming nitride semiconductor layer
06/04/2014CN103839978A Terminal structure of middle-high pressure groove typed power device and manufacturing method thereof
06/04/2014CN103839976A Gallium arsenide substrate structure on silicon-based insulator and preparation method thereof
06/04/2014CN103839975A Low-depth connection groove and manufacture method
06/04/2014CN103839971A Organic light emitting display and method for manufacturing the same
06/04/2014CN103839967A Organic light emitting diode display apparatus and method of manufacturing the same
06/04/2014CN103839964A Organic electro-luminescent device and method of fabricating the same
06/04/2014CN103839963A Organic electro-luminescent device and method of fabricating the same
06/04/2014CN103839961A Pixel unit, display device and defect repair method
06/04/2014CN103839956A Cutting method used for image sensor chip wafers by adoption of wafer-level package mode
06/04/2014CN103839950A TFT-LCD array substrate and manufacturing method thereof
06/04/2014CN103839949A Thin film transistor array substrate for digital x-ray detector
06/04/2014CN103839947A Silicon substrate structure on silicon-based insulator and preparation method thereof
06/04/2014CN103839946A MFIS structure based on tetragonal phase bismuth ferrite and preparation method thereof
06/04/2014CN103839943A Semiconductor device
06/04/2014CN103839941A Junction-isolated blocking voltage devices with integrated protection structures and methods of forming same
06/04/2014CN103839938A Server processing module
06/04/2014CN103839932A Logic die and other components embedded in build-up layers
06/04/2014CN103839929A Rf (radio frequency) module and method of maufacturing the same
06/04/2014CN103839928A High-voltage-withstanding, low-electric-leakage and high-polarization strength bismuth ferrite thin film and preparation method thereof
06/04/2014CN103839924A MOSFET mismatch testing structure and method
06/04/2014CN103839923A Alignment mark manufacturing method and substrate
06/04/2014CN103839922A Semiconductor test structure and test method thereof
06/04/2014CN103839920A Copper seed layer for an interconnect structure having a doping concentration level gradient
06/04/2014CN103839919A Manufacturing method for electrode, fuse device and manufacturing method thereof
06/04/2014CN103839918A Semicondutor packages and methods of fabrication thereof
06/04/2014CN103839917A Mim capacitor and forming method thereof
06/04/2014CN103839915A Thin film transistor array substrate and manufacturing method thereof
06/04/2014CN103839911A Offset integrated circuit packaging interconnects
06/04/2014CN103839910A Semiconductor device assembly including a chip carrier, semiconductor wafer and method of manufacturing a semiconductor device
06/04/2014CN103839908A Welding pad structure and manufacture method thereof
06/04/2014CN103839905A Silicon substrate micro-channel heat exchanger with electric fluid power micro-pump and manufacturing method thereof
06/04/2014CN103839903A Three-dimensional stacked chip with cooling function and manufacturing method thereof
06/04/2014CN103839902A A semiconductor device including a heat-spreading lid
06/04/2014CN103839900A Flexible display apparatus and manufacturing method thereof
06/04/2014CN103839899A Semiconductor package and fabrication method thereof
06/04/2014CN103839898A Package structure and manufacturing method thereof
06/04/2014CN103839894A Method for Forming Package-on-Package Structure
06/04/2014CN103839893A Method for improving flash memory high-temperature oxidation treatment
06/04/2014CN103839892A Semiconductor structure and manufacturing method thereof
06/04/2014CN103839891A Semiconductor structure and method for manufacturing semiconductor structure
06/04/2014CN103839890A Semiconductor devices including stressor in recess and methods of forming same
06/04/2014CN103839889A Method for segmentation of plate-shaped object to be processed
06/04/2014CN103839888A Array substrate, manufacturing method thereof and displaying device
06/04/2014CN103839887A Method of manufacturing thin film transistor array panel
06/04/2014CN103839886A Forming method for interlevel dielectric layer with air gap
06/04/2014CN103839885A Method for removing defects
06/04/2014CN103839884A Semiconductor device structure and forming method thereof
06/04/2014CN103839883A Methods of forming graphene liners and/or cap layers on copper-based conductive structures
06/04/2014CN103839882A Sandwiched diffusion barrier and metal liner for an interconnect structure
06/04/2014CN103839881A Semiconductor device with self aligned end-to-end conductive line structure and method for forming the same
06/04/2014CN103839880A Method for forming semiconductor device
06/04/2014CN103839879A Semiconductor device and manufacturing method thereof
06/04/2014CN103839878A Method for forming semiconductor structure
06/04/2014CN103839877A Semiconductor structure and forming method thereof
06/04/2014CN103839876A Method and device for manufacturing semiconductor device
06/04/2014CN103839875A Substrate processing system
06/04/2014CN103839874A Metal interconnection structure and manufacturing method thereof
06/04/2014CN103839873A Method for manufacturing semiconductor device
06/04/2014CN103839872A Method for manufacturing semiconductor device
06/04/2014CN103839871A Method for manufacturing semiconductor device
06/04/2014CN103839870A Method for reducing side-wall roughness of TSV during TSV etching
06/04/2014CN103839869A Method for protecting metal structures in semiconductor comprising air gap
06/04/2014CN103839868A Manufacturing method for shallow-trench isolation structure
06/04/2014CN103839867A Method for improving shallow trench isolation dielectric material etching morphology
06/04/2014CN103839866A Insulating paste, electronic device and method for forming insulator
06/04/2014CN103839865A Making method of touch control device
06/04/2014CN103839864A Coating alignment device and coating system
06/04/2014CN103839863A Device for producing compound semiconductor and wafer retainer
06/04/2014CN103839862A Mechanical bonding disassembling process method
06/04/2014CN103839861A Multi-overprinting alignment method for solar cell surface fine grid
06/04/2014CN103839860A Film magazine lifting device and film magazine transmission system with film magazine lifting device
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