Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2014
06/05/2014US20140151874 Bump-equipped electronic component and method for manufacturing bump-equipped electronic component
06/05/2014US20140151871 Heat spreader with flexible tolerance mechanism
06/05/2014US20140151866 Packaged Semiconductor Device with Tensile Stress and Method of Making a Packaged Semiconductor Device with Tensile Stress
06/05/2014US20140151865 Semiconductor device packages providing enhanced exposed toe fillets
06/05/2014US20140151862 Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package
06/05/2014US20140151858 Increasing the doping efficiency during proton irradiation
06/05/2014US20140151857 Method and system for binding halide-based contaminants
06/05/2014US20140151856 Chip Module, an Insulation Material and a Method for Fabricating a Chip Module
06/05/2014US20140151854 Method for Separating a Layer and a Chip Formed on a Layer
06/05/2014US20140151853 Ion Implantation Apparatus, Ion Implantation Method, and Semiconductor Device
06/05/2014US20140151848 Mimcap structure in a semiconductor device package
06/05/2014US20140151846 Shielding silicon from external rf interference
06/05/2014US20140151844 Integrated circuits separated by through-wafer trench isolation
06/05/2014US20140151843 Semiconductor device structures including metal oxide structures, and related methods of forming semiconductor device structures
06/05/2014US20140151841 Semiconductor devices having a positive-bevel termination or a negative-bevel termination and their manufacture
06/05/2014US20140151826 Graphene magnetic tunnel junction spin filters and methods of making
06/05/2014US20140151820 Gas-diffusion barriers for mems encapsulation
06/05/2014US20140151818 Semiconductor device with a silicon dioxide gate insulation layer implanted with a rare earth element and methods of making such a device
06/05/2014US20140151814 Methods for forming fins for metal oxide semiconductor device structures
06/05/2014US20140151812 Contact Plugs in SRAM Cells and the Method of Forming the Same
06/05/2014US20140151808 Bulk finfet esd device
06/05/2014US20140151807 Combination finfet and planar fet semiconductor device and methods of making such a device
06/05/2014US20140151803 Inducing Channel Stress in Semiconductor-on-Insulator Devices by Base Substrate Oxidation
06/05/2014US20140151802 Semiconductor Device Having SSOI Substrate
06/05/2014US20140151801 Uniform finfet gate height
06/05/2014US20140151800 Lateral double-diffused mosfet
06/05/2014US20140151797 Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips
06/05/2014US20140151795 Semiconductor device including gate drivers around a periphery thereof
06/05/2014US20140151789 Semiconductor Device Including Trenches and Method of Manufacturing a Semiconductor Device
06/05/2014US20140151782 Methods and Apparatus for Non-Volatile Memory Cells with Increased Programming Efficiency
06/05/2014US20140151778 Select Gate Formation for Nanodot Flat Cell
06/05/2014US20140151763 Semiconductor structure having contact plug and method of making the same
06/05/2014US20140151759 Facet-free strained silicon transistor
06/05/2014US20140151757 Substrate-templated epitaxial source/drain contact structures
06/05/2014US20140151751 Density gradient cell array
06/05/2014US20140151749 High electron mobility transistor and method of manufacturing the same
06/05/2014US20140151717 Packaged Vertical Power Device Comprising Compressive Stress and Method of Making a Packaged Vertical Power Device
06/05/2014US20140151713 Method of growing nitride semiconductor layer, nitride semiconductor device, and method of fabricating the same
06/05/2014US20140151710 Stacked Gate Structure, Metal-Oxide-Semiconductor Including the Same, and Method for Manufacturing the Stacked Gate Structure
06/05/2014US20140151706 Structures incorporating silicon nanoparticle inks, densified silicon materials from nanoparticle silicon deposits and corresponding methods
06/05/2014US20140151704 Method, System, and Apparatus for Preparing Substrates and Bonding Semiconductor Layers to Substrates
06/05/2014US20140151702 Semiconductor device having chip crack detection structure
06/05/2014US20140151701 Embedded chip package, a chip package, and a method for manufacturing an embedded chip package
06/05/2014US20140151700 Chip package and a method for manufacturing a chip package
06/05/2014US20140151699 Test Structure Placement on a Semiconductor Wafer
06/05/2014US20140151698 Test Structures for Post-Passivation Interconnect
06/05/2014US20140151697 Semiconductor Packages, Systems, and Methods of Formation Thereof
06/05/2014US20140151687 Semiconductor device and manufacturing method thereof
06/05/2014US20140151640 Self-aligned double-gate graphene transistor
06/05/2014US20140151639 Nanomesh complementary metal-oxide-semiconductor field effect transistors
06/05/2014US20140151638 Hybrid nanomesh structures
06/05/2014US20140151332 Substrate supporting unit and substrate treating apparatus and method
06/05/2014US20140151328 Method for forming laminate
06/05/2014US20140151264 Wafer carrier and applications thereof
06/05/2014US20140151237 Methods of and Apparatus for Electrochemically Fabricating Structures Interlaced Layers or Via Selective Etching and Filling of Voids
06/05/2014US20140151216 Sputtering Apparatus and Method of Manufacturing Display Substrate Using the Same
06/05/2014US20140150860 Electronic device from dissipative quantum dots
06/05/2014US20140150826 Wafer cleaning apparatus and methods
06/05/2014US20140150819 Method of wet cleaning aluminum chamber parts
06/05/2014DE112012003278T5 Filme von Nitriden von Gruppe-13-Elementen und geschichteter Körper, der dieselben beinhaltet Movies of nitrides of Group 13 elements and layered body including the same
06/05/2014DE112011105493T5 Herstellungsverfahren für Solarzellen und Solarzellen-Herstellungssystem Manufacturing process for solar cells and solar cell fabrication system
06/05/2014DE112007002215B4 Dielektrische Abstandshalter für Metallverbindungen und Verfahren zu ihrer Herstellung Dielectric spacers for metal compounds and processes for their preparation
06/05/2014DE102013223560A1 Verfahren zum abtrennen einer schicht und eines auf einer schicht gebildeten chip A method for separating a film and a layer formed on a chip
06/05/2014DE102013216007A1 Halbleitervorrichtungstreiberschaltung und Verfahren zu ihrem Testen Semiconductor device driver circuit and method for its testing
06/05/2014DE102013201663A1 Method for polishing front and rear sides of disk for fastidious components, involves extending polishing gap from inner edge of cloth to outer edge of cloth, where height of gap at inner edge differs from height of gap at outer edge
06/05/2014DE102013113558A1 Eingebettetes chipgehäuse, chipgehäuse und verfahren zur herstellung eines eingebetteten chipgehäuses Embedded chip packages, chip packages and methods for manufacturing of an embedded chip package
06/05/2014DE102013113464A1 Chipmodul, Isoliermaterial und Verfahren zur Herstellung eines Chipmoduls Chip module, insulating material and method for producing a chip module
06/05/2014DE102013113451A1 Eingehäuste vertikale Leistungsvorrichtung, die eine Druckbelastung aufweist, und Verfahren zur Herstellung einer eingehäusten vertikalen Leistungsvorrichtung Eingehäuste vertical power device, comprising a pressure load, and method of manufacturing a vertical power device eingehäusten
06/05/2014DE102013113395A1 Vorrichtungen und Verfahren zum Bereitstellen einer elektrischen Verbindung Apparatus and methods for providing an electrical connection
06/05/2014DE102013113343A1 Halbleitervorrichtung mit einer rippe und einem drain-ausdehnungsbereich sowie herstellungsverfahren A semiconductor device comprising a rib and a drain-range expansion and manufacturing processes
06/05/2014DE102013113286A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
06/05/2014DE102013113284A1 Halbleitervorrichtung und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device and method of manufacturing a semiconductor device
06/05/2014DE102013113232A1 Gehäuste Halbleitervorrichtung mit Zugspannung und Verfahren zur Herstellung einer gehäusten Halbleitervorrichtung mit Zugspannung Packaged semiconductor device with tensile stress and method of manufacturing a packaged semiconductor device having tensile stress
06/05/2014DE102013113186A1 Halbleiterpackages, Systeme und Verfahren für deren Ausbildung Semiconductor packages, systems, and methods for their training
06/05/2014DE102013112608A1 Halbleitervorrichtung mit Trenches und Verfahren zum Herstellen einer Halbleitervorrichtung A semiconductor device having trenches and method of manufacturing a semiconductor device
06/05/2014DE102013105020A1 SRAM-Zelle, die FinFETs umfasst SRAM cell includes the FinFETs
06/05/2014DE102012222015A1 Feuchtigkeitsdichtes Halbleitermodul und Verfahren zu dessen Herstellung Moisture-proof semiconductor module and method for its production
06/05/2014DE102012221904A1 Verfahren zur Wiederaufnahme des Drahtsägeprozesses eines Werkstückes nach einer unplanmäßigen Unterbrechung Process for the recovery of the wire-sawing of a workpiece after an unscheduled interruption
06/05/2014DE102012221396A1 Electronic arrangement for use in electronic assembly in e.g. motor vehicle electronics, has metallic sintered layer applied by dispensing or ink jet method, and connecting layer including gradient structure and/or rounding in corner region
06/05/2014DE102012220952A1 Method of machining edge of semiconductor wafer, involves using grinding tool with abrasive having grain size that is less than first particle size, and processing semiconductor wafer with grinding wheel pf specific rotational speed
06/05/2014DE102012111807A1 Verfahren zur Herstellung von Nanostrukturen A process for producing nanostructures
06/05/2014DE102012111215A1 Method for testing printed circuit board, involves approaching predetermined position on or in workpiece by using test pin arranged at support, and changing position of test pin with respect to support through active polymers
06/05/2014DE102012111114A1 Halbleiterbearbeitungsvorrichtung und -verfahren Semiconductor processing apparatus and method
06/05/2014DE102012023639A1 Method for three-dimensional (3D) integration of e.g. chips mounted in printed circuit board, involves patterning composite layer prior to lamination, and performing gluing or melting by laser or by cutting or punching process
06/05/2014DE102010037941B4 Verfahren und Verwendung eines rekonstituierten Wafer zur Halbleiterbauelementfabrikation The method and use of a reconstituted wafer for semiconductor device fabrication
06/05/2014DE102010000539B4 Halbleiteranordnung und Verfahren zur Herstellung einer Halbleiteranordnung A semiconductor device and method of manufacturing a semiconductor device
06/05/2014DE102008000660B4 Siliziumkarbid-Halbleitervorrichtung Silicon carbide semiconductor device
06/05/2014DE102007063640B4 Integrierter Schaltkreis mit einer Speicherzellenanordnung An integrated circuit comprising a memory cell array
06/05/2014DE102007025112B4 Verfahren zum Herstellen eines Dünnfilmmusters A method of manufacturing a thin film pattern
06/04/2014EP2738813A2 Semiconductor device including alternating source and drain regions, and respective source and drain metallic strips
06/04/2014EP2738805A1 Aluminium bonding wire, connection structure, semiconductor device and manufacturing method of same
06/04/2014EP2738797A2 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer
06/04/2014EP2738796A2 Method for producing a flip-chip structure for assembling microelectronic devices comprising an insulating block for guiding a connecting element and corresponding device
06/04/2014EP2738795A2 Electronic device with a mounting substrate with a roughened mounting surface and method for producing the same
06/04/2014EP2738794A1 Method for manufacturing semiconductor device, and semiconductor device
06/04/2014EP2738793A1 Method of Growing Nitride Semiconductor Layer, Nitride Semiconductor Device, and Method of Fabricating the Same
06/04/2014EP2738792A2 Exposure method, substrate stage, exposure apparatus, and device manufacturing method
06/04/2014EP2738791A2 Method for correcting a photomask
06/04/2014EP2738790A1 Procedure for preparing one single barrier and/or dielectric layer or multilayer on a substrate and device for the implementation thereof
06/04/2014EP2738789A1 Multi-chamber semiconductor processing device
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