Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/15/2009US20090017622 Chemical treatment method
01/15/2009US20090017621 Manufacturing method for semiconductor device and manufacturing device of semiconductor device
01/15/2009US20090017620 Method of manufacturing semiconductor device for dual damascene wiring
01/15/2009US20090017619 Method for manufacturing metal silicide layer in a semiconductor device
01/15/2009US20090017618 Method of fabricating semiconductor device
01/15/2009US20090017617 Method for formation of high quality back contact with screen-printed local back surface field
01/15/2009US20090017616 Method for forming conductive structures
01/15/2009US20090017615 Method of removing an insulation layer and method of forming a metal wire
01/15/2009US20090017614 Semiconductor device
01/15/2009US20090017613 Method of manufacturing interconnect substrate and semiconductor device
01/15/2009US20090017612 Methods for fabricating array substrates
01/15/2009US20090017611 Semiconductor device and method for fabricating the same
01/15/2009US20090017610 Junction structure of terminal pad and solder, semiconductor device having the junction structure, and method of manufacturing the semiconductor device
01/15/2009US20090017609 Rectangular contact used as a low voltage fuse element
01/15/2009US20090017608 Semiconductor device fabricating method
01/15/2009US20090017607 Gate cd trimming beyond photolithography
01/15/2009US20090017606 Method for Producing a Semiconductor Component Having Regions Which are Doped to Different Extents
01/15/2009US20090017605 Methods for doping nanostructured materials and nanostructured thin films
01/15/2009US20090017604 Method for fabricating a semiconductor device
01/15/2009US20090017603 Method of forming epitaxial layer
01/15/2009US20090017602 Method for manufacturing a semiconductor-on-insulator substrate for microelectronics and optoelectronics
01/15/2009US20090017601 Crystalline film devices, apparatuses for and methods of fabrication
01/15/2009US20090017600 Wafer dividing method using laser beam with an annular spot
01/15/2009US20090017599 Method for manufacturing semiconductor device
01/15/2009US20090017598 Method of manufacturing semiconductor device
01/15/2009US20090017597 Method for manufacturing shallow trench isolation
01/15/2009US20090017596 Methods Of Forming Oxides, Methods Of Forming Semiconductor Constructions, And Methods Of Forming Isolation Regions
01/15/2009US20090017595 Reliable gap-filling process and apparatus for performing the process in the manufacturing of semiconductor devices
01/15/2009US20090017594 Non-volatile semiconductor memory device and method of fabricating the same
01/15/2009US20090017593 Method for shallow trench isolation
01/15/2009US20090017592 Siloxane polymer composition, method of forming a pattern using the same, and method of manufacturing a semiconductor using the same
01/15/2009US20090017591 Local Oxidation of Silicon Planarization for Polysilicon Layers Under Thin Film Structures
01/15/2009US20090017590 Method for fabricating sonos a memory
01/15/2009US20090017589 Tri-gate integration with embedded floating body memory cell using a high-k dual metal gate
01/15/2009US20090017588 Systems and methods that selectively modify liner induced stress
01/15/2009US20090017587 Disposable organic spacers
01/15/2009US20090017586 Channel stress modification by capped metal-semiconductor layer volume change
01/15/2009US20090017585 Self Aligned Gate JFET Structure and Method
01/15/2009US20090017583 Double encapsulated semiconductor package and manufacturing method thereof
01/15/2009US20090017582 Method for manufacturing semiconductor device
01/15/2009US20090017581 Method for manufacturing a semiconductor device
01/15/2009US20090017580 Systems and methods for vertically integrating semiconductor devices
01/15/2009US20090017579 Method of manufacturing micro electro mechanical systems device
01/15/2009US20090017578 Application of RFID labels
01/15/2009US20090017576 Semiconductor Processing Methods
01/15/2009US20090017575 Methods Of Forming Openings
01/15/2009US20090017574 Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus
01/15/2009US20090017573 Image sensor with improved dynamic range and method of formation
01/15/2009US20090017572 Nanoelectromechanical transistors and methods of forming same
01/15/2009US20090017571 Sensing devices from molecular electronic devices
01/15/2009US20090017570 Semiconductor laser device and method for fabricating the same
01/15/2009US20090017569 Method for fabricating liquid crystal display device
01/15/2009US20090017568 Semiconductor device, electronic device and method for manufacturing semiconductor device
01/15/2009US20090017567 Method for manufacturing semiconductor device
01/15/2009US20090017565 Manufacturing method of semiconductor integrated circuit device
01/15/2009US20090017564 Method to detect and predict metal silicide defects in a microelectronic device during the manufacture of an integrated circuit
01/15/2009US20090017563 Plasma treatment and repair processes for reducing sidewall damage in low-k dielectrics
01/15/2009US20090017387 Reflective mask blank for exposure, reflective mask for exposure, method of producing a semiconductor device, and substrate provided with multilayer reflective film
01/15/2009US20090017323 Layered body and method for manufacturing thin substrate using the layered body
01/15/2009US20090017291 Silicon epitaxial wafer and production method for same
01/15/2009US20090017257 Processing method of glass substrate, and highly flat and highly smooth glass substrate
01/15/2009US20090017248 Layered body and method for manufacturing thin substrate using the layered body
01/15/2009US20090016951 Device structure of carbon fibers and manufacturing method thereof
01/15/2009US20090016867 Panel Transport Unit
01/15/2009US20090016862 Method and apparatus for providing flat panel display environmental isolation
01/15/2009US20090016860 Substrate convey processing device, trouble countermeasure method in substrate convey processing device, and trouble countermeasures program in substrate convey processing device
01/15/2009US20090016857 Substrate-replacing apparatus, substrate-processing apparatus, and substrate-inspecting apparatus
01/15/2009US20090016853 In-line wafer robotic processing system
01/15/2009US20090016674 Silicon structure and method of manufacturing the same
01/15/2009US20090016397 Nitride semiconductor light emitting device and method for manufacturing the same
01/15/2009US20090016393 Laser apparatus, laser irradiation method, and manufacturing method of semiconductor device
01/15/2009US20090016202 Method of producing a photoelectric transducer and optical pick up
01/15/2009US20090016108 Nonvolatile semiconductor memory
01/15/2009US20090016096 Integrated Circuits; Method for Manufacturing an Integrated Circuit; Method for Decreasing the Influence of Magnetic Fields; Memory Module
01/15/2009US20090016094 Selection device for Re-Writable memory
01/15/2009US20090016028 Method of obtaining enhanced localized thermal interface regions by particle stacking
01/15/2009US20090015969 Magnetic thin film, magnetoresistance effect device and magnetic device using the same
01/15/2009US20090015903 Complex Microdevices and Apparatus and Methods for Fabricating Such Devices
01/15/2009US20090015760 Method for manufacturing thin film transistors
01/15/2009US20090015534 Semiconductor device and electronic device
01/15/2009US20090015363 Integrated transformer
01/15/2009US20090015285 Test structures for electrically detecting back end of the line failures and methods of making and using the same
01/15/2009US20090014909 Printing device, production unit, and production method of electronic parts
01/15/2009US20090014898 Solder cap application process on copper bump using solder powder film
01/15/2009US20090014897 Semiconductor chip package and method of manufacturing the same
01/15/2009US20090014891 Three-dimensional die-stacking package structure and method for manufacturing the same
01/15/2009US20090014889 Method for producing chip stacks, and associated chip stacks
01/15/2009US20090014888 Semiconductor chip, method of fabricating the same and stack package having the same
01/15/2009US20090014887 Method of producing multilayer interconnection and multilayer interconnection structure
01/15/2009US20090014886 Dynamic random access memory with an electrostatic discharge structure and method for manufacturing the same
01/15/2009US20090014885 Four-Terminal Reconfigurable Devices
01/15/2009US20090014884 Slots to reduce electromigration failure in back end of line structure
01/15/2009US20090014881 Semiconductor device, and method and apparatus for manufacturing same
01/15/2009US20090014879 Semiconductor device and method of manufacturing the same
01/15/2009US20090014878 Structure and method of forming electrodeposited contacts
01/15/2009US20090014877 Selective Formation of Boron-Containing Metal Cap Pre-layer
01/15/2009US20090014876 Wafer level stacked package having via contact in encapsulation portion and manufacturing method thereof
01/15/2009US20090014875 Bonding pad for preventing pad peeling and method for fabricating the same
01/15/2009US20090014874 Semiconductor apparatus and manufacturing method of semiconductor apparatus
01/15/2009US20090014873 Electronic device and manufacturing method