Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/21/2009CN100454546C Semiconductor device and manufacturing method thereof
01/21/2009CN100454545C Semiconductor device and method of manufacturing the same
01/21/2009CN100454542C Integrated circuit die including a temperature detection circuit, and system and methods for calibrating the temperature detection circuit
01/21/2009CN100454539C Semiconductor integrated circuit device
01/21/2009CN100454538C Transistor array and its producing method, and image processing device
01/21/2009CN100454537C Electronic apparatus and method for manufacturing the same
01/21/2009CN100454535C Method and system for hermetically sealing packages for optics
01/21/2009CN100454532C Interposer, interposer assembly and device assembly therewith
01/21/2009CN100454531C Semiconductor device and method of manufacturing the same
01/21/2009CN100454530C Surface mounting electronic component and its manufacturing method
01/21/2009CN100454523C Integrated circuit chip packaging and manufacturing method thereof
01/21/2009CN100454521C Semiconductor device and its fabricating method, soi substrate and its production method and display device
01/21/2009CN100454520C Method for manufacturing film integrated circuit and element substrate
01/21/2009CN100454519C Semiconductor device and manufacturing method thereof
01/21/2009CN100454518C Dynamic RAM and manufacturing method
01/21/2009CN100454517C Method of manufacturing semiconductor device
01/21/2009CN100454516C A method for manufacturing of transformer integrated in the semiconductor integral circuit structure
01/21/2009CN100454515C Method for forming aluminium lead wire
01/21/2009CN100454514C Film tray for fabricating flexible display
01/21/2009CN100454513C Vertical heat treating apparatus and automatic teaching method for transfer mechanism
01/21/2009CN100454512C MEMS based contact conductivity electrostatic chuck
01/21/2009CN100454511C Apparatus and method of inspecting mura-defect and method of fabricating photomask
01/21/2009CN100454510C Method for matching integrated circuit chip terminals and package wiring terminals
01/21/2009CN100454509C 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/21/2009CN100454508C Method for producing image-pickup assembly and camera module
01/21/2009CN100454507C Improved semiconductor chip and lead-out wire welding mould
01/21/2009CN100454506C Anti-flashing plastic sealing mould
01/21/2009CN100454505C Semiconductor device and its making method
01/21/2009CN100454504C Imaging sensor mounting method and adhesive tape used thereby
01/21/2009CN100454503C Production of triode lead wire frame
01/21/2009CN100454502C Method for fabricating a multilayer wiring board, multilayer wiring board, and electronic device using the same
01/21/2009CN100454501C Surface-coating method, production of microelectronic interconnections using said method and integrated circuits
01/21/2009CN100454500C Semiconductor structure forming method
01/21/2009CN100454499C Semiconductor device and method for manufacturing same
01/21/2009CN100454498C Plasma processing apparatus and controlling method for plasma processing apparatus
01/21/2009CN100454497C Method of filling gaps and methods of depositing materials using high density plasma chemical vapor deposition
01/21/2009CN100454496C Method for cleaning substrate surface
01/21/2009CN100454495C Semiconductor manufacturing equipment
01/21/2009CN100454494C Method for production of semiconductor chip and semiconductor chip
01/21/2009CN100454493C Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method
01/21/2009CN100454492C Back side metallization technology for eutectic welding
01/21/2009CN100454491C Junction forming method and object to be processed and formed by using same
01/21/2009CN100454490C Method for producing substrate material of self-stripping gallium nitride
01/21/2009CN100454489C Methods for deposition of semiconductor material
01/21/2009CN100454488C Group III nitride crystal substrate, method of its manufacture, and group-III nitride semiconductor device
01/21/2009CN100454487C Method of manufacturing GaN crystal substrate
01/21/2009CN100454486C Defect reduction in semiconductor materials
01/21/2009CN100454485C Reflective photomask blank, reflective photomask, and method for manufacturing semiconductor device using same
01/21/2009CN100454484C Circuitry component fabricating method
01/21/2009CN100454483C Method for producing ion implantation thick film SOI wafer material
01/21/2009CN100454482C Heat treatment unit, heat treatiment method, control program and computer-readable recording medium
01/21/2009CN100454481C Stickup device of support plate
01/21/2009CN100454480C Mfg. method of semiconductor device
01/21/2009CN100454433C Write line design in MRAM and its manufacturing method
01/21/2009CN100454432C Relayed electric pulse used in magnetic resistor
01/21/2009CN100454216C Predictive, adaptive power supply for an integrated circuit under test
01/21/2009CN100454184C Control method, temperature control method and temperature regulator
01/21/2009CN100454146C Exposure apparatus
01/21/2009CN100454145C Method of charged particle beam lithography and equipment for charged particle beam lithography
01/21/2009CN100454144C Method for double-face etching of wafer
01/21/2009CN100454143C 正型抗蚀剂组合物 The positive resist composition
01/21/2009CN100454141C Device for transferring a pattern to an object
01/21/2009CN100454122C Liquid crystal display device capable of reducing leakage current, and fabrication method thereof
01/21/2009CN100454121C Thin film transistor display making method
01/21/2009CN100454118C Tape circuit substrate with reduced size of base film
01/21/2009CN100454084C 面板翻转机构 Panel reversing mechanism
01/21/2009CN100453712C III-V nitride semiconductor substrate and its production method
01/21/2009CN100453702C Plasma processing apparatus and components thereof, and method for detecting life span of the components
01/21/2009CN100453694C Plasma processing apparatus, semiconductor manufacturing apparatus and electrostatic chucking unit used thereof
01/21/2009CN100453234C Wire bonder with a downholder
01/20/2009USRE40623 Method and apparatus for identifying integrated circuits
01/20/2009US7480841 Semiconductor integrated circuit which properly executes an operational test of a circuit under test in the semiconductor integrated circuit
01/20/2009US7480604 Method of modeling and producing an integrated circuit including at least one transistor and corresponding integrated circuit
01/20/2009US7480598 Characteristic evaluation apparatus for insulated gate type transistors
01/20/2009US7480491 Wireless programmable logic devices
01/20/2009US7480404 Method and system for positioning articles with respect to a processing tool
01/20/2009US7480186 NROM flash memory with self-aligned structural charge separation
01/20/2009US7480185 Ballistic injection NROM flash memory
01/20/2009US7480171 MRAM based on vertical current writing and its control method
01/20/2009US7480168 Semiconductor memory device
01/20/2009US7480164 Semiconductor integrated circuit with voltage generation circuit, liquid crystal display controller and mobile electric equipment
01/20/2009US7480151 Wiring board and method of manufacturing the same
01/20/2009US7480129 Detachable electrostatic chuck for supporting a substrate in a process chamber
01/20/2009US7480028 Lithographic apparatus for imaging a front side or a back side of a substrate, method of substrate identification, device manufacturing method, substrate, and computer program
01/20/2009US7480025 Array substrate for a liquid crystal display device and manufacturing method of the same
01/20/2009US7479939 Electro-optical device
01/20/2009US7479823 Multiple circuit blocks with interblock control and power conservation
01/20/2009US7479804 Interface device and information processing system
01/20/2009US7479797 TDDB test pattern and method for testing TDDB of MOS capacitor dielectric
01/20/2009US7479697 Resilient carrier assembly for an integrated circuit
01/20/2009US7479694 Membrane 3D IC fabrication
01/20/2009US7479688 STI stress modification by nitrogen plasma treatment for improving performance in small width devices
01/20/2009US7479687 Deep via seed repair using electroless plating chemistry
01/20/2009US7479686 Backside imaging through a doped layer
01/20/2009US7479683 Selective implementation of barrier layers to achieve threshold voltage control in CMOS device fabrication with high-k dielectrics
01/20/2009US7479682 Structure of a field effect transistor having metallic silicide and manufacturing method thereof
01/20/2009US7479681 Multilayered semiconductor structure containing a MISFET, a resistor, a capacitor, and an inductor
01/20/2009US7479679 Field effect transistor and application device thereof
01/20/2009US7479677 Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
01/20/2009US7479674 Field effect transistor