| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/20/2009 | US7478466 Device for applying weatherstrip on a motor vehicle body, and related method |
| 01/20/2009 | CA2638191A1 Buried contact devices for nitride-based films and manufacture thereof |
| 01/20/2009 | CA2505065C Rear interconnect blade for rack mounted systems |
| 01/20/2009 | CA2442176C Penetrable cap |
| 01/18/2009 | CA2641383A1 Thin film transistor and method for forming the same |
| 01/15/2009 | WO2009009694A2 Solder cap application process on copper bump using solder powder film |
| 01/15/2009 | WO2009009639A2 Electronic assemblies without solder and methods for their manufacture |
| 01/15/2009 | WO2009009612A2 Growth of self-assembled gan nanowires and application in nitride semiconductor bulk material |
| 01/15/2009 | WO2009009607A1 Apparatus and method for processing a substrate edge region |
| 01/15/2009 | WO2009009580A1 Method to improve performance of secondary active components in an esige cmos technology |
| 01/15/2009 | WO2009009576A1 Subassembly that includes a power semiconductor die and a heat sink and method of forming same |
| 01/15/2009 | WO2009009566A2 Method for manufacturing semiconductor device |
| 01/15/2009 | WO2009009534A1 Lateral power mosfet with integrated schottky diode |
| 01/15/2009 | WO2009009526A2 A processing system platen having a variable thermal conductivity profile |
| 01/15/2009 | WO2009009514A2 Composite nanorods |
| 01/15/2009 | WO2009009436A2 Packaged semiconductor assemblies and methods for manufacturing such assemblies |
| 01/15/2009 | WO2009009418A1 Methods of smoothing oxide spacer |
| 01/15/2009 | WO2009009272A2 Conformal doping using high neutral plasma implant |
| 01/15/2009 | WO2009009260A2 Dielectric charge-trapping materials having doped metal sites |
| 01/15/2009 | WO2009009095A1 Spacer lithography |
| 01/15/2009 | WO2009008973A2 Method for forming an acoustic mirror with reduced metal layer roughness and related structure |
| 01/15/2009 | WO2009008958A2 Method of post etch polymer residue removal |
| 01/15/2009 | WO2009008839A1 Die ejector with illuminating unit |
| 01/15/2009 | WO2009008673A2 Substrate heating apparatus |
| 01/15/2009 | WO2009008659A2 Plasma etching apparatus and method of etching wafer |
| 01/15/2009 | WO2009008626A2 Ion implanter, internal structure of ion implanter and method of forming a coating layer in the ion implanter |
| 01/15/2009 | WO2009008605A2 Maskless exposure method |
| 01/15/2009 | WO2009008594A1 End point detecting apparatus for semiconductor wafer polishing process |
| 01/15/2009 | WO2009008532A1 Polishing apparatus and polishing method |
| 01/15/2009 | WO2009008531A1 Polishing apparatus |
| 01/15/2009 | WO2009008491A1 Diamine compound, polyamic acid, soluble polyimide, composition, wettability changing film, electrode, and method of manufacturing a wettability changing film |
| 01/15/2009 | WO2009008474A1 Plasma processing method and plasma processing apparatus |
| 01/15/2009 | WO2009008448A1 Adhesive for circuit member connection |
| 01/15/2009 | WO2009008446A1 Resist underlayer film forming composition, and method for resist pattern formation using the composition |
| 01/15/2009 | WO2009008431A1 Metal film polishing liquid and polishing method |
| 01/15/2009 | WO2009008407A1 Process for producing organic semiconductor element, organic semiconductor element, and organic semiconductor device |
| 01/15/2009 | WO2009008376A1 Process for producing semiconductor device, semiconductor device, semiconductor production apparatus, and storage medium |
| 01/15/2009 | WO2009008375A1 Lid body for substrate container and substrate container |
| 01/15/2009 | WO2009008310A1 Base material with junction film, method of joining and junction structure |
| 01/15/2009 | WO2009008309A1 Base material with junction film, method of joining and junction structure |
| 01/15/2009 | WO2009008308A1 Junction structure and method of joining |
| 01/15/2009 | WO2009008293A1 Polishing apparatus |
| 01/15/2009 | WO2009008265A1 Composition for forming micropattern and method for forming micropattern using the same |
| 01/15/2009 | WO2009008241A1 Plasma treating apparatus |
| 01/15/2009 | WO2009008212A1 Insulating film material, multilayer wiring board and process for producing the multilayer wiring board, and semiconductor apparatus and process for producing the semiconductor device |
| 01/15/2009 | WO2009008156A1 Wiring method, and wiring apparatus |
| 01/15/2009 | WO2009008151A1 Semiconductor device and method for adjusting characteristics of semiconductor device |
| 01/15/2009 | WO2009008124A1 Heat treatment jig for wafer and vertical heat treatment boat provided with the jig |
| 01/15/2009 | WO2009008082A1 Semiconductor device and manufacturing method of semiconductor device |
| 01/15/2009 | WO2009008080A1 Semiconductor device |
| 01/15/2009 | WO2009008047A1 Device for charging dry air or nitrogen gas into semiconductor wafer storage container and wafer static charge removing apparatus utilizing the device |
| 01/15/2009 | WO2009008041A1 Material for insulating film, multilayered wiring board, method for manufacturing the multilayered wiring board, semiconductor device, and method for manufacturing the semiconductor device thereof |
| 01/15/2009 | WO2009007957A2 Screenprintable titania paste and titania precursor treatment for dye cell photoanodes |
| 01/15/2009 | WO2009007943A1 Hetero-structure field effect transistor, integrated circuit including a hetero-structure field effect transistor and method for manufacturing a hetero-structure field effect transistor |
| 01/15/2009 | WO2009007932A2 Integrated circuits on a wafer and method of producing integrated circuits |
| 01/15/2009 | WO2009007931A1 Wafer, reticle and method for manufacturing integrated circuits on a wafer |
| 01/15/2009 | WO2009007928A2 Methods for manufacturing integrated circuits |
| 01/15/2009 | WO2009007907A2 Single crystal growth on a mis-matched substrate |
| 01/15/2009 | WO2009007793A1 Coupling layer composition for a semiconductor device, semiconductor device, method of forming the coupling layer, and apparatus for the manufacture of a semiconductor device |
| 01/15/2009 | WO2009007003A1 Method for recycling a substrate, laminated water fabricating method and suitable recycled donor substrate |
| 01/15/2009 | WO2009006988A1 Contact structure for a semiconductor component and a method for production thereof |
| 01/15/2009 | WO2009006783A1 Cleaning composition for removing resist |
| 01/15/2009 | WO2009006679A1 Pattern transferring by direct current plasma based ion implantation and deposition |
| 01/15/2009 | WO2008145999A4 Organic el device and manufacturing method thereof |
| 01/15/2009 | WO2008143461A3 Wafer level chip scale package of an image sensor by means of through hole interconnection and method for manufacturing the same |
| 01/15/2009 | WO2008132734A3 Focused ion beam deep nano- patterning method |
| 01/15/2009 | WO2008123391A3 Apparatus and method for plasma doping |
| 01/15/2009 | WO2008121955A3 In-line lithography and etch system |
| 01/15/2009 | WO2008106913A4 Automation carrier for substrates in particular for wafers for producing silicon-based solar cells |
| 01/15/2009 | WO2008098963A3 Method of forming an oxide thin film |
| 01/15/2009 | WO2008091579A3 Memory having a vertical access device |
| 01/15/2009 | WO2008073926A3 Formation of epitaxial layers containing silicon |
| 01/15/2009 | WO2008066952A4 Selective destruction of metallic nanostructures via electromagnetic radiation |
| 01/15/2009 | WO2008013563A3 Nanotube circuit analysis system and method |
| 01/15/2009 | WO2007106625A3 Perforated embedded plane package and method |
| 01/15/2009 | WO2007041205A3 Wafer-level method for metallizing source, gate and drain contact areas of semiconductor die |
| 01/15/2009 | US20090019418 Lithography simulation method, mask pattern preparation method, semiconductor device manufacturing method and recording medium |
| 01/15/2009 | US20090019414 High tolerance tcr balanced high current resistor for rf cmos and rf sige bicmos applications and cadenced based hierarchical parameterized cell design kit with tunable tcr and esd resistor ballasting feature |
| 01/15/2009 | US20090019408 Production method, design method and design system for semiconductor integrated circuit |
| 01/15/2009 | US20090018692 Substrate Processing Apparatus |
| 01/15/2009 | US20090017642 Laser crystallization apparatus and laser crystallization method |
| 01/15/2009 | US20090017641 Substrate processing apparatus and semiconductor device producing method |
| 01/15/2009 | US20090017640 Boron derived materials deposition method |
| 01/15/2009 | US20090017639 Novel silicon precursors to make ultra low-k films of k<2.2 with high mechanical properties by plasma enhanced chemical vapor deposition |
| 01/15/2009 | US20090017638 Substrate processing apparatus and method for manufacturing semiconductor device |
| 01/15/2009 | US20090017637 Method and apparatus for batch processing in a vertical reactor |
| 01/15/2009 | US20090017636 Titanium nitride-stripping liquid, and method for stripping titanium nitride coating film |
| 01/15/2009 | US20090017635 Apparatus and method for processing a substrate edge region |
| 01/15/2009 | US20090017634 Use of a plasma source to form a layer during the formation of a semiconductor device |
| 01/15/2009 | US20090017633 Alternative method for advanced cmos logic gate etch applications |
| 01/15/2009 | US20090017632 Methods of manufacturing semiconductor structures using rie process |
| 01/15/2009 | US20090017631 Self-aligned pillar patterning using multiple spacer masks |
| 01/15/2009 | US20090017630 Methods For Forming Contacts For Dual Stress Liner CMOS Semiconductor Devices |
| 01/15/2009 | US20090017629 Method of forming contact structure with contact spacer and method of fabricating semiconductor device using the same |
| 01/15/2009 | US20090017628 Spacer lithography |
| 01/15/2009 | US20090017627 Methods of Modifying Oxide Spacers |
| 01/15/2009 | US20090017626 Semiconductor wet etchant and method of forming interconnection structure using the same |
| 01/15/2009 | US20090017625 Methods For Removing Gate Sidewall Spacers In CMOS Semiconductor Fabrication Processes |
| 01/15/2009 | US20090017624 Nodule Defect Reduction in Electroless Plating |
| 01/15/2009 | US20090017623 Wafer processing method |