| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
|---|
| 01/22/2009 | WO2009012295A2 Fin-type field effect transistor structure with merged source/drain silicide and method of forming the structure |
| 01/22/2009 | WO2009012276A2 Asymmetric field effect transistor structure and method |
| 01/22/2009 | WO2009012248A1 System and method for monitoring vehicles on a roadway |
| 01/22/2009 | WO2009012206A1 Amorphous metal-metalloid alloy barrier layer for ic devices |
| 01/22/2009 | WO2009012184A1 Surface modification of low-k dielectric materials |
| 01/22/2009 | WO2009012122A1 Method for shallow trench isolation |
| 01/22/2009 | WO2009012111A1 Method for fabricating dual damascene profiles using sub pixel-voting lithography and devices made by same |
| 01/22/2009 | WO2009012067A1 Boron derived materials deposition method |
| 01/22/2009 | WO2009012053A2 Isolated tri-gate transistor fabricated on bulk substrate |
| 01/22/2009 | WO2009011997A1 Transistor with differently doped strained current electrode region |
| 01/22/2009 | WO2009011816A1 Method of producing large area sic substrates |
| 01/22/2009 | WO2009011781A1 Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment |
| 01/22/2009 | WO2009011730A1 Cluster tool with a linear source |
| 01/22/2009 | WO2009011696A1 A device and method for reparing a microelectromechanical system |
| 01/22/2009 | WO2009011581A1 An electronic device and a method of manufacturing an electronic device |
| 01/22/2009 | WO2009011574A1 Lithography system, method of clamping and wafer table |
| 01/22/2009 | WO2009011532A2 Apparatus, method for depositing thin film on wafer and method for gap-filling trench using the same |
| 01/22/2009 | WO2009011450A1 Core-shell-shell nanowire transistor and fabrication method thereof |
| 01/22/2009 | WO2009011445A1 Laminate structure, electronic device, and display device |
| 01/22/2009 | WO2009011428A1 Apparatus for attaching load port apparatus |
| 01/22/2009 | WO2009011408A1 Polishing apparatus |
| 01/22/2009 | WO2009011394A1 Method for manufacturing electronic device, method for manufacturing epitaxial substrate, iii nitride semiconductor element and gallium nitride epitaxial substrate |
| 01/22/2009 | WO2009011383A1 Adhesive for electronic component |
| 01/22/2009 | WO2009011365A1 Probe card |
| 01/22/2009 | WO2009011364A1 Resist composition used for lithography process using electron beam, x ray or euv light. |
| 01/22/2009 | WO2009011363A1 Etching solution composition |
| 01/22/2009 | WO2009011356A1 Measurement method, stage apparatus, and exposure apparatus |
| 01/22/2009 | WO2009011304A1 Heat curable resin compositon |
| 01/22/2009 | WO2009011303A1 Si LAYER AGGREGATION SUPPRESSION METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND VACUUM PROCESSING DEVICE |
| 01/22/2009 | WO2009011289A1 Positive-working resist composition and method for pattern formation using the positive-working resist composition |
| 01/22/2009 | WO2009011281A1 Dicing/die bonding tape and method for manufacturing semiconductor chip |
| 01/22/2009 | WO2009011235A1 Sintered silicon wafer |
| 01/22/2009 | WO2009011224A1 Method for producing metal oxide semiconductor, and thin film transistor obtained from the metal oxide semiconductor |
| 01/22/2009 | WO2009011220A1 Semiconductor device, semiconductor device manufacturing method, display device and display device manufacturing method |
| 01/22/2009 | WO2009011216A1 Storage element and memory |
| 01/22/2009 | WO2009011215A1 Imprint mode |
| 01/22/2009 | WO2009011204A1 Method for manufacturing organic thin film transistor, and organic thin film transistor |
| 01/22/2009 | WO2009011166A1 Vacuum processing device and vacuum processing method |
| 01/22/2009 | WO2009011165A1 Thin board transfer apparatus, thin board processing/transfer system and thin board transfer method |
| 01/22/2009 | WO2009011152A1 Soi substrate and semiconductor device using soi substrate |
| 01/22/2009 | WO2009011119A1 Pattern formation method and device, exposure method and device, and device manufacturing method and device |
| 01/22/2009 | WO2009011100A1 Iii nitride semiconductor substrate and method for cleaning the same |
| 01/22/2009 | WO2009011084A1 Semiconductor device provided with thin film transistor and method for manufacturing the semiconductor device |
| 01/22/2009 | WO2009011045A1 Crystallization device |
| 01/22/2009 | WO2009011015A1 High-frequency induction heating apparatus and plasma cvd apparatus |
| 01/22/2009 | WO2009010592A1 Arrangement for the contactless transport of flat substrates |
| 01/22/2009 | WO2009010394A1 Apparatus and method for wet treatment of disc-like articles |
| 01/22/2009 | WO2009010391A1 Method for etching a layer of a silicon semiconductor substrate |
| 01/22/2009 | WO2009010265A2 Semiconductor substrate and method for producing a semiconductor component |
| 01/22/2009 | WO2009009947A1 A dual-stage switching system for a lithographic machine |
| 01/22/2009 | WO2009009931A1 A method for processing a semiconductor substrate surface and a chemical processing device for the semiconductor substrate surface |
| 01/22/2009 | WO2008132204A3 Nitride semi-conductor component layer structure on a group iv substrate surface |
| 01/22/2009 | WO2008118635A3 Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphipilic monolayers |
| 01/22/2009 | WO2008116917A8 Method for detecting surface defects on a substrate and device using said method |
| 01/22/2009 | WO2008066947A3 Formation of carbon and semiconductor nanomaterials using molecular assemblies |
| 01/22/2009 | WO2008048275A3 Rapid heating with nanoenergetic materials |
| 01/22/2009 | WO2007018812A3 Semiconductor devices and method of fabrication |
| 01/22/2009 | US20090024978 Semiconductor device mask, method of forming the same and method of manufacturing semiconductor device using the same |
| 01/22/2009 | US20090024968 Method of designing semiconductor integrated circuit and mask data generation program |
| 01/22/2009 | US20090024244 High throughput semiconductor wafer processing |
| 01/22/2009 | US20090023361 Cmp apparatus and method of polishing wafer using cmp |
| 01/22/2009 | US20090023303 Method of manufacturing a semiconductor integrated circuit device |
| 01/22/2009 | US20090023302 Protective inserts to line holes in parts for semiconductor process equipment |
| 01/22/2009 | US20090023301 Film deposition apparatus, method of manufacturing a semiconductor device, and method of coating the film deposition apparatus |
| 01/22/2009 | US20090023300 Method of forming shadow layer on the wafer bevel |
| 01/22/2009 | US20090023299 Reduction of defects formed on the surface of a silicon oxynitride film |
| 01/22/2009 | US20090023298 Inverse self-aligned spacer lithography |
| 01/22/2009 | US20090023297 Method and apparatus for hmds treatment of substrate edges |
| 01/22/2009 | US20090023296 Plasma Etching Method |
| 01/22/2009 | US20090023295 Manufacturing method for semiconductor chips |
| 01/22/2009 | US20090023294 Method for etching using advanced patterning film in capacitive coupling high frequency plasma dielectric etch chamber |
| 01/22/2009 | US20090023293 Implementing state-of-the-art gate transistor, sidewall profile/angle control by tuning gate etch process recipe parameters |
| 01/22/2009 | US20090023292 Photoelectric conversion device and method for producing photoelectric conversion device |
| 01/22/2009 | US20090023291 Polishing Methods |
| 01/22/2009 | US20090023290 Planarization method |
| 01/22/2009 | US20090023289 Conductor removal process |
| 01/22/2009 | US20090023288 Method of manufacturing nanoelectrode lines using nanoimprint lithography process |
| 01/22/2009 | US20090023287 Interconnection process |
| 01/22/2009 | US20090023286 Dielectric interconnect structures and methods for forming the same |
| 01/22/2009 | US20090023285 Method of forming contact of semiconductor device |
| 01/22/2009 | US20090023284 Integrated Wafer Processing System for Integration of Patternable Dielectric Materials |
| 01/22/2009 | US20090023283 Interconnection process |
| 01/22/2009 | US20090023282 Conductive ball mounting method and apparatus |
| 01/22/2009 | US20090023281 Solder bump forming method |
| 01/22/2009 | US20090023280 Method for forming high-k charge storage device |
| 01/22/2009 | US20090023279 Method of fabricating flash memory device |
| 01/22/2009 | US20090023278 Method of manufacturing flash memory device |
| 01/22/2009 | US20090023277 Method for fabricating semiconductor device |
| 01/22/2009 | US20090023276 Method for manufacturing a semiconductor device |
| 01/22/2009 | US20090023275 Method for forming silicon wells of different crystallographic orientations |
| 01/22/2009 | US20090023274 Hybrid Chemical Vapor Deposition Process Combining Hot-Wire CVD and Plasma-Enhanced CVD |
| 01/22/2009 | US20090023273 Method of fabricating semiconductor device |
| 01/22/2009 | US20090023272 Method of producing bonded wafer |
| 01/22/2009 | US20090023271 Glass-based SOI structures |
| 01/22/2009 | US20090023270 Method for manufacturing SOI wafer |
| 01/22/2009 | US20090023269 Method for producing soi wafer |
| 01/22/2009 | US20090023268 Isolation method of active area for semiconductor device |
| 01/22/2009 | US20090023267 Method of reducing roughness of a thick insulating layer |
| 01/22/2009 | US20090023266 Method of manufacturing a semiconductor device |
| 01/22/2009 | US20090023265 Etching solution for removal of oxide film, method for preparing the same, and method of fabricating semiconductor device |