Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/13/2009US7477194 Conductive pattern and method of making
01/13/2009US7476981 Electronic module with layer of adhesive and process for producing it
01/13/2009US7476979 Chip scale surface mounted device and process of manufacture
01/13/2009US7476978 Electronic component having a semiconductor power device
01/13/2009US7476977 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
01/13/2009US7476974 Method to fabricate interconnect structures
01/13/2009US7476973 Method of manufacturing a semiconductor device having a silicidation blocking layer
01/13/2009US7476972 Circuit device, manufacturing method thereof, and sheet-like board member
01/13/2009US7476968 Semiconductor device including an under electrode and a bump electrode
01/13/2009US7476967 Composite carbon nanotube thermal interface device
01/13/2009US7476961 Method and apparatus for forming a DMD window frame with molded glass
01/13/2009US7476960 System and method for improved auto-boating
01/13/2009US7476958 Semiconductor wafer having different impurity concentrations in respective regions
01/13/2009US7476957 Semiconductor integrated circuit
01/13/2009US7476951 Selective isotropic etch for titanium-based materials
01/13/2009US7476946 Backgated FinFET having different oxide thicknesses
01/13/2009US7476945 Memory having reduced memory cell size
01/13/2009US7476944 Static random access memories including a silicon-on-insulator substrate
01/13/2009US7476940 Glass-based SOI structures
01/13/2009US7476937 Semiconductor device and method of fabricating the same
01/13/2009US7476936 Substrate, liquid crystal display having the substrate, and method for producing substrate
01/13/2009US7476935 High power semiconductor device having a schottky barrier diode
01/13/2009US7476932 U-shape metal-oxide-semiconductor (UMOS) gate structure for high power MOS-based semiconductor devices
01/13/2009US7476929 Multi-bit stacked-type non-volatile memory
01/13/2009US7476925 Atomic layer deposition of metal oxide and/or low asymmetrical tunnel barrier interploy insulators
01/13/2009US7476922 Logic device having vertically extending metal-insulator-metal capacitor between interconnect layers and method of fabricating the same
01/13/2009US7476921 Semiconductor device and method of manufacturing the same
01/13/2009US7476919 MRAM cell structure and method of fabrication
01/13/2009US7476916 Semiconductor device having a mis-type fet, and methods for manufacturing the same and forming a metal oxide film
01/13/2009US7476915 Semiconductor integrated circuit including a first region and a second region
01/13/2009US7476914 Methods to improve the SiGe heterojunction bipolar device performance
01/13/2009US7476899 Active matrix substrate and method of manufacturing the same
01/13/2009US7476898 Thin film and manufacturing method of the same
01/13/2009US7476895 Method of fabricating n-type semiconductor diamond, and semiconductor diamond
01/13/2009US7476875 Contact opening metrology
01/13/2009US7476872 Method and apparatus for observing inside structures, and specimen holder
01/13/2009US7476856 Sample dimension-measuring method and charged particle beam apparatus
01/13/2009US7476629 Beam irradiation apparatus, beam irradiation method, and method for manufacturing thin film transistor
01/13/2009US7476628 Metal oxide layer formed on substrates and its fabrication methods
01/13/2009US7476627 Surface preparation prior to deposition
01/13/2009US7476626 Etch stop layer for a metallization layer with enhanced etch selectivity and hermeticity
01/13/2009US7476625 Method for fabricating semiconductor device
01/13/2009US7476624 Dry-etching method
01/13/2009US7476623 Method for microstructuring flat glass substrates
01/13/2009US7476622 Method of forming a contact in a semiconductor device
01/13/2009US7476621 Halogen-free noble gas assisted H2 plasma etch process in deposition-etch-deposition gap fill
01/13/2009US7476620 Polishing integrated circuit substrate using fomulation containing water, abrasive, oxidizer, metal-ion oxidizer/polishing accelerator, a metal-ion polishing accelerator bound to particles such as to abrasive particles, 4-Dihydroxymethyl-2,3-dihydroxy-cyclopent-2-enone, ascorbic acid
01/13/2009US7476619 Semiconductor device
01/13/2009US7476618 Selective formation of metal layers in an integrated circuit
01/13/2009US7476617 Semiconductor device with epitaxial C49-titanium silicide (TiSi2) layer and method for fabricating the same
01/13/2009US7476616 Reagent activator for electroless plating
01/13/2009US7476615 Deposition process for iodine-doped ruthenium barrier layers
01/13/2009US7476614 Method of fabricating semiconductor device
01/13/2009US7476613 Method of forming an electrical contact in a semiconductor device using an improved self-aligned contact (SAC) process
01/13/2009US7476612 Method for manufacturing semiconductor device
01/13/2009US7476611 Semiconductor device and manufacturing method thereof
01/13/2009US7476610 Removable spacer
01/13/2009US7476609 Forming of a cavity in an insulating layer
01/13/2009US7476608 Electrically connecting substrate with electrical device
01/13/2009US7476607 Semiconductor electrode, production process thereof and photovoltaic cell using semiconductor electrode
01/13/2009US7476606 Eutectic bonding of ultrathin semiconductors
01/13/2009US7476605 Method of manufacturing semiconductor device
01/13/2009US7476604 Aggressive cleaning process for semiconductor device contact formation
01/13/2009US7476603 Printing conductive patterns using LEP
01/13/2009US7476602 N2 based plasma treatment for enhanced sidewall smoothing and pore sealing porous low-k dielectric films
01/13/2009US7476601 Semiconductor structure having multilayer of polysilicon and display panel applied with the same
01/13/2009US7476600 FET gate structure and fabrication process
01/13/2009US7476599 Two-phase thermal method for preparation of cadmium sulfide quantum dots
01/13/2009US7476598 Photodiode and method of manufacturing the same
01/13/2009US7476597 Methods and systems for laser assisted wirebonding
01/13/2009US7476596 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
01/13/2009US7476595 Method for the molecular bonding of microelectronic components to a polymer film
01/13/2009US7476594 Methods of fabricating silicon nitride regions in silicon carbide and resulting structures
01/13/2009US7476593 Semiconductor device and method of forming the same
01/13/2009US7476592 Method for manufacturing semiconductor device
01/13/2009US7476591 Lateral power MOSFET with high breakdown voltage and low on-resistance
01/13/2009US7476590 Method of manufacturing semiconductor device
01/13/2009US7476589 Methods for forming shielded gate field effect transistors
01/13/2009US7476588 Methods of forming NAND cell units with string gates of various widths
01/13/2009US7476587 Method for making a self-converged memory material element for memory cell
01/13/2009US7476586 NOR flash memory cell with high storage density
01/13/2009US7476585 Semiconductor device including storage node and method of manufacturing the same
01/13/2009US7476584 Method of fabricating a semiconductor device with a bit line contact plug
01/13/2009US7476583 Semiconductor device and method of manufacturing the same
01/13/2009US7476582 Semiconductor device and its manufacturing method
01/13/2009US7476581 Method of manufacturing semiconductor device having dual gate electrode
01/13/2009US7476580 Structures and methods for manufacturing of dislocation free stressed channels in bulk silicon and SOI CMOS devices by gate stress engineering with SiGe and/or Si:C
01/13/2009US7476579 Method and structure for enhancing both nMOSFET and pMOSFET performance with a stressed film
01/13/2009US7476578 Process for finFET spacer formation
01/13/2009US7476577 Semiconductor device and method of fabricating the same
01/13/2009US7476576 Method of fabricating a semiconductor device
01/13/2009US7476575 Method for manufacturing thin film integrated circuit
01/13/2009US7476574 Method for forming an integrated circuit semiconductor substrate
01/13/2009US7476573 Methods of selective deposition of fine particles onto selected regions of a substrate
01/13/2009US7476572 Method for manufacturing thin film transistor
01/13/2009US7476571 Method for cooling a semiconductor device
01/13/2009US7476570 System and method of attaching an integrated circuit assembly to a printed wiring board
01/13/2009US7476568 Wafer-level assembly of heat spreaders for dual IHS packages
01/13/2009US7476566 Electronic and optoelectronic component packaging technique
01/13/2009US7476565 Method for forming filling paste structure of WL package