Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/15/2009US20090014435 Heating apparatus, substrate processing apparatus employing the same, method of manufacturing semiconductor devices, and insulator
01/15/2009US20090014431 Plate, apparatus for adjusting temperature of substrate having the plate and apparatus for processing substrate having the plate
01/15/2009US20090014415 Compositions and methods for rapidly removing overfilled substrates
01/15/2009US20090014126 Substrate processing apparatus and substrate processing method
01/15/2009US20090014125 Substrate processing system and method
01/15/2009US20090014124 First peeling unit pulls adhesive tape along the direction across the sheet in a state stuck to the sheet to peel off the sheet at a predetermined peeling angle; 2nd peeling unit pulls adhesive tape in a state stuck to the end portion of such sheet to peel off the sheet at different peeling angle
01/15/2009US20090013698 Heat treatment apparatus
01/15/2009DE112007000608T5 Laserbearbeitungsverfahren und Laserbearbeitungssystem Laser processing method and laser processing system
01/15/2009DE112007000578T5 Verfahren zur Herstellung eines Substrats eines Nitridhalbleiters der Gruppe III-V A process for preparing a substrate of a nitride semiconductor of Group III-V
01/15/2009DE112007000524T5 Wafer-Bearbeitungsverfahren Wafer processing method
01/15/2009DE112007000520T5 Halbleiterscheibenbearbeitungsverfahren Semiconductor wafer processing method
01/15/2009DE112006003810T5 Polierzusammensetzung für Siliciumwafer, Polierzusammensetzungskit für Siliciumwafer und Verfahren zum Siliciumwaferpolieren Polishing composition for silicon wafers, Polierzusammensetzungskit for silicon wafer and method for silicon wafer polishing
01/15/2009DE10296984B4 Niederspannungs- und schnittstellenbeschädigungsfreie polymere Speichervorrichtung Low Voltage and interface damage-free polymer memory device
01/15/2009DE102008032551A1 Speicherbauelement, Speicher und Verfahren zum Bearbeiten eines derartigen Speichers Memory device, memory, and method of processing of such a memory
01/15/2009DE102008029868A1 Halbleiterbauteil und Herstellungsverfahren desselben Semiconductor device and manufacturing method thereof
01/15/2009DE102008029811A1 Verfahren zur Herstellung eines Flash-Speicher-Bausteins Process for the preparation of a flash memory block
01/15/2009DE102008029607A1 Verfahren zur Verbesserung der Verbindung zwischen Aluminium und Kupfer in einem Halbleiter-Metallleitungs-Prozess A method for improving the connection between aluminum and copper in a semiconductor-metal-line process
01/15/2009DE102008027025A1 Speicher mit gemeinsam genutztem Speichermaterial Memory shared-memory material
01/15/2009DE102008011799A1 Halbleitervorrichtung Semiconductor device
01/15/2009DE102008008152A1 Leistungshalbleitervorrichtung und Herstellungsverfahren derselben Power semiconductor device and manufacturing method thereof
01/15/2009DE102007042950A1 Integrierte Schaltungsvorrichtung mit einer Gateelektrodenstruktur und ein entsprechendes Verfahren zur Herstellung An integrated circuit device having a gate electrode structure and a corresponding method for the preparation of
01/15/2009DE102007033242A1 Verfahren und Vorrichtung zum Trennen einer Planplatte aus sprödbrüchigem Material in mehrere Einzelplatten mittels Laser Method and apparatus for separating a plane plate of brittle material into individual plates by laser
01/15/2009DE102007032560A1 Semiconductor component e.g. ROM, solder contact and/or contact ball checking system, has medium for supplying mechanical load to solder contacts, and bristles arranged such that load results through touch/friction
01/15/2009DE102007032557A1 Vorrichtung zum Testen von elektronischen Bauelementen, insbesondere IC's, mit innerhalb einer Drucktestkammer angeordnetem Abdichtboard Apparatus for testing electronic components, in particular IC's, with arranged within a test chamber pressure Abdichtboard
01/15/2009DE102007032285A1 Method for manufacturing doped semiconductor components involves providing semiconductor substrate and doping one side of semiconductor substrate with p- or n- doping
01/15/2009DE102007031958A1 Kontakt-Struktur für ein Halbleiter-Bauelement sowie Verfahren zur Herstellung desselben Contact structure for a semiconductor device and method of manufacturing the same
01/15/2009DE102007031490A1 Halbleitermodul Semiconductor module
01/15/2009DE102007030020A1 Verfahren zum Ausbilden einer Halbleiterstruktur mit einem Ausbilden von mindestens einer Seitenwandabstandshalterstruktur A method of forming a semiconductor structure with a forming at least a sidewall spacer structure
01/15/2009DE102007007356B4 Hochfrequenzschaltung, Standardzelle, Entwurfsystem und Testverfahren High-frequency circuit, standard cell design system and test method
01/15/2009DE102005014794B4 Verfahren zum Prüfen einer Halbleiterprobe mit mehreren Abtastungen A method for testing a semiconductor sample having a plurality of samples
01/15/2009DE10147376B4 Elektronisches Bauteil und Systemträger sowie Verfahren zur Herstellung derselben Electronic component and system carrier, as well as methods for making same
01/15/2009DE10102542B4 Anordnung zur visuellen Inspektion von Substraten Arrangement for visual inspection of substrates
01/15/2009DE10022333B4 CVD-Verfahren zu Herstellung eines siliciumcarbidbeschichteten Graphitwerkstoff und Verwendung eines siliciumcarbidbeschichteten Graphitwerkstoffs CVD process for producing a siliciumcarbidbeschichteten graphite material and using a siliciumcarbidbeschichteten graphite material
01/14/2009EP2015367A1 Electroconductive paste for solar battery electrode
01/14/2009EP2015364A2 SiC semiconductor device with BPSG insulation film and method for manufacturing the same
01/14/2009EP2015362A1 Semiconductor array and manufacturing method thereof
01/14/2009EP2015359A2 Process for manufacturing a semiconductor package and circuit board aggregation
01/14/2009EP2015358A2 Non-volatile SRAM memory cell with mobile-gate transistors and piezoelectric activation
01/14/2009EP2015357A1 Process for manufacturing an array of cells including selection bipolar junction transistors with projecting conduction regions
01/14/2009EP2015356A1 Method for singulation of wafers
01/14/2009EP2015355A2 Methods of manufacturing semiconductor structures with air dielectric
01/14/2009EP2015354A1 Method for recycling a substrate, laminated wafer fabricating method and suitable recycled donor substrate
01/14/2009EP2015353A1 Semiconductor device and method for manufacturing semiconductor device
01/14/2009EP2015352A2 Photon induced etching of copper
01/14/2009EP2015351A1 Method for manufacturing semiconductor substrate, solar semiconductor substrate, and etching liquid
01/14/2009EP2015350A1 Semiconductor component with buffer layer
01/14/2009EP2015349A1 Method of manufacturing a semiconductor-on-insulator substrate for microelectronics and optoelectronics
01/14/2009EP2015348A2 Method for manufacturing a SiC semiconductor device
01/14/2009EP2015347A2 Automated preform attach for vacuum packaging
01/14/2009EP2015343A2 High temperature cathode for plasma etching
01/14/2009EP2015310A2 Methods for identifying non-volatile memory elements with poor subthreshold slope or weak transconductance
01/14/2009EP2015139A1 Reflective photomask blank, process for producing the same, reflective photomask and process for producing semiconductor device
01/14/2009EP2015089A1 Tester, circuit, and electronic device
01/14/2009EP2014790A1 Process for forming continuous copper thin films via vapor deposition
01/14/2009EP2014787A1 Cu-Mn ALLOY SPUTTERING TARGET AND SEMICONDUCTOR WIRING
01/14/2009EP2014722A1 Composition and Organic Insulator Prepared Using the Same
01/14/2009EP2014611A2 Suspended-gate MOS transistor with non-volatile operation by piezoelectric activation
01/14/2009EP2014406A2 Relocation device, contacting device, delivery system, relocation and contacting unit production facility and a transponder unit
01/14/2009EP2014373A1 Drop coating apparatus
01/14/2009EP2013910A2 Method of forming a body-tie
01/14/2009EP2013904A2 Body-tied mosfet device with strained active area
01/14/2009EP2013903A2 Stressor integration and method thereof
01/14/2009EP2013902A1 Method of producing a transistor gate comprising decomposition of a precursor material into at least one metallic material, by means of at least one electron beam
01/14/2009EP2013901A2 Patterning sub-lithographic features with variable widths
01/14/2009EP2013900A1 Non-volatile memory device
01/14/2009EP2013899A1 Flat-type non-thermal plasma reactor
01/14/2009EP2013898A2 Fabrication tool for bonding
01/14/2009EP2013897A1 Byproduct collecting apparatus of semiconductor apparatus
01/14/2009EP2013886A1 High precision capacitor with standoff
01/14/2009EP2013880A1 Nanostructures and a method for the manufacture of the same
01/14/2009EP2013661A2 Mask structure for manufacture of trench type semiconductor device
01/14/2009EP2013407A2 High temperature anodic bonding apparatus
01/14/2009EP2013378A2 Exhaust system
01/14/2009EP2013375A2 System and method for transport
01/14/2009EP2013308A1 Cmp method for copper-containing substrates
01/14/2009EP1943667A4 Polymer or resist pattern, and metal film pattern, metal pattern and plastic mold using the same, and fabrication methods thereof
01/14/2009EP1856725A4 Self-forming metal silicide gate for cmos devices
01/14/2009EP1685930B1 Vacuum suction head, and vacuum suction device and table using the same
01/14/2009EP1680805A4 Wafer carrier door
01/14/2009EP1610132B1 Fabricating interconnects using sacrificial substrates
01/14/2009EP1609172B1 Device and method for wet treatment of disc-shaped articles
01/14/2009EP1525488B1 Electronic circuit with asynchronously operating components
01/14/2009EP1451642B1 Chemical rinse composition
01/14/2009EP1221176B1 Method of etching a layer using sacrificial elements
01/14/2009EP1210724B1 Method of determining etch endpoint using principal components analysis of optical emission spectra
01/14/2009EP1186002A4 Ic-compatible parylene mems technology and its application in integrated sensors
01/14/2009EP1152868A4 Robot having multiple degrees of freedom
01/14/2009EP1138085B1 Field effect-controlled transistor and method for producing the same
01/14/2009EP1092145B1 A system and method for analyzing topological features on a surface
01/14/2009EP1008169B1 Producing microstructures or nanostructures on a support
01/14/2009EP0923128B1 Method of manufacturing a semiconductor package
01/14/2009CN201182036Y 气体注入喷嘴 Gas injection nozzle
01/14/2009CN201181695Y Vacuum voltage regulation adsorber of scribing machine
01/14/2009CN201181694Y Transfer case used for containing silicon slice
01/14/2009CN201181693Y Upper electrode of semiconductor etching equipment
01/14/2009CN201181389Y Photo-etching machine silicon slice bench exchanging set adopting transition connection device
01/14/2009CN201181388Y Photo-etching machine silicon slice bench exchanging set adopting conveyor belt structure
01/14/2009CN201181387Y Photo-etching machine silicon slice bench exchanging set adopting cross sliding rail
01/14/2009CN201180156Y Automatic ditcher for silicon slice
01/14/2009CN101347056A Manufacturing method and manufacturing apparatus of printed wiring board