Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/08/2009WO2008103632A3 Equipment and methods for etching of mems
01/08/2009WO2008089733A3 Etching solution and etching method
01/08/2009WO2008064172A3 Content addressable memory
01/08/2009WO2008005079A3 Method of providing a customer with increased integrated circuit performance
01/08/2009US20090013300 Synthesis strategies based on the appropriate use of inductance effects
01/08/2009US20090013294 System and method for statistical timing analysis of digital circuits
01/08/2009US20090012439 Attachment Member for Semiconductor Sensor Device
01/08/2009US20090011690 Polishing apparatus and polishing method
01/08/2009US20090011683 Method For Grinding Semiconductor Wafers
01/08/2009US20090011681 Method of producing a glass substrate for a mask blank, method of producing a mask blank, and method of producing a transfer mask
01/08/2009US20090011680 Polishing state monitoring apparatus and polishing apparatus and method
01/08/2009US20090011676 Component Bonding Method and Component Bonding Device
01/08/2009US20090011615 Advanced Processing Technique and System for Preserving Tungsten in a Device Structure
01/08/2009US20090011614 Reconfigurable semiconductor structure processing using multiple laser beam spots
01/08/2009US20090011613 Method for producing annealed wafer and annealed wafer
01/08/2009US20090011612 Method of shortening photoresist coating process
01/08/2009US20090011611 Method for manufacturing semiconductor device
01/08/2009US20090011610 Selective implementation of barrier layers to achieve treshold voltage control in cmos device fabrication with high k dielectrics
01/08/2009US20090011609 Radical oxidation process for fabricating a nonvolatile charge trap memory device
01/08/2009US20090011608 Manufacturing method of semiconductor device
01/08/2009US20090011607 Silicon Dioxide Deposition Methods Using at Least Ozone and TEOS as Deposition Precursors
01/08/2009US20090011606 Substrate Processing Apparatus and Semiconductor Device Producing Method
01/08/2009US20090011605 Method of manufacturing semiconductor device
01/08/2009US20090011604 Photon induced removal of copper
01/08/2009US20090011603 Method of manufacturing semiconductor device
01/08/2009US20090011602 Film Forming Method of Amorphous Carbon Film and Manufacturing Method of Semiconductor Device Using the Same
01/08/2009US20090011601 Over-coating agent for forming fine patterns and a method of forming fine patterns using such agent
01/08/2009US20090011600 Method and apparatus for manufacturing semiconductor device
01/08/2009US20090011599 Slurry compositions for selectively polishing silicon nitride relative to silicon oxide, methods of polishing a silicon nitride layer and methods of manufacturing a semiconductor device using the same
01/08/2009US20090011598 Method of manufacturing semiconductor device including silicon carbide substrate
01/08/2009US20090011597 Mass production method of semiconductor integrated circuit device and manufacturing method of electronic device
01/08/2009US20090011596 Electronic device and manufacturing method thereof
01/08/2009US20090011595 Method of forming a layer on a semiconductor substrate and apparatus for performing the same
01/08/2009US20090011594 Methods of Trench and Contact Formation in Memory Cells
01/08/2009US20090011593 Method of depositing amorphous film on capacitor assembly
01/08/2009US20090011592 Method of manufacture of semiconductor integrated circuit device and semiconductor integrated circuit device
01/08/2009US20090011591 Film substrate, fabrication method thereof, and image display substrate
01/08/2009US20090011590 Method of fabricating semiconductor device
01/08/2009US20090011589 Method of manufacturing split gate type nonvolatile memory device
01/08/2009US20090011588 Flash Memory and Methods of Fabricating Flash Memory
01/08/2009US20090011587 Method of fabricating a semiconductor device
01/08/2009US20090011586 Nonvolatile semiconductor memory device
01/08/2009US20090011585 Methods of Etching Nanodots, Methods of Removing Nanodots From Substrates, Methods of Fabricating Integrated Circuit Devices, Methods of Etching a Layer Comprising a Late Transition Metal, and Methods of Removing a Layer Comprising a Late Transition Metal From a Substrate
01/08/2009US20090011584 Method for forming transistor of semiconductor device
01/08/2009US20090011583 Method of manufacturing a semiconductor device
01/08/2009US20090011582 Method for Depositing a Vapour Deposition Material
01/08/2009US20090011581 Carbon controlled fixed charge process
01/08/2009US20090011580 Method for fabricating semiconductor memory device
01/08/2009US20090011579 Quantum Dot Array And Production Method Therefor, And Dot Array Element And Production Method Therefor
01/08/2009US20090011578 Methods to fabricate mosfet devices using a selective deposition process
01/08/2009US20090011577 Method of making phase change materials electrochemical atomic layer deposition
01/08/2009US20090011576 Ultra-Violet Protected Tamper Resistant Embedded EEPROM
01/08/2009US20090011575 Manufacturing method of SOI substrate and manufacturing method of semiconductor device
01/08/2009US20090011574 Method for surface modification of semiconductor layer and method of manufacturing semiconductor device
01/08/2009US20090011573 Carrier used for deposition of materials on a non-planar surface
01/08/2009US20090011572 Wafer Working Method
01/08/2009US20090011571 Wafer working method
01/08/2009US20090011570 Method of manufacturing semiconductor device
01/08/2009US20090011569 Electrical device and method for fabricating the same
01/08/2009US20090011568 Semiconductor device, method of manufacture thereof and semiconductor integrated circuit
01/08/2009US20090011567 Method for manufacturing display substrate
01/08/2009US20090011566 Method of manufacturing semiconductor device
01/08/2009US20090011565 Field effect transistor structure with abrupt source/drain junctions
01/08/2009US20090011564 Method of forming a gate oxide layer
01/08/2009US20090011563 Fabrication of Self-Aligned Gallium Arsenide Mosfets Using Damascene Gate Methods
01/08/2009US20090011562 Process for Fabricating a Field-Effect Transistor with Self-Aligned Gates
01/08/2009US20090011561 Method of fabricating high-voltage mos having doubled-diffused drain
01/08/2009US20090011560 Multiple select gate architecture with select gates of different lengths
01/08/2009US20090011559 Non-volatile semiconductor memory and method for manufacturing a non-volatile semiconductor memory
01/08/2009US20090011558 Method of manufacturing nonvolatile semiconductor memory
01/08/2009US20090011557 Method for manufacturing a flash memory
01/08/2009US20090011556 Method for producing a microelectronic structure
01/08/2009US20090011555 Method of manufacturing CMOS integrated circuit
01/08/2009US20090011554 Component With Sensitive Component Structures and Method for the Production Thereof
01/08/2009US20090011553 THERMALLY STABLE BiCMOS FABRICATION METHOD AND BIPOLAR JUNCTION TRANSISTOR FORMED ACCORDING TO THE METHOD
01/08/2009US20090011552 Metal gate cmos with at least a single gate metal and dual gate dielectrics
01/08/2009US20090011551 Method for manufacturing semiconductor device
01/08/2009US20090011550 Flat panel display device and fabricating method thereof
01/08/2009US20090011549 Process and system for manufacturing an encapsulated semiconductor device
01/08/2009US20090011548 Hybrid integrated circuit device and manufacturing method thereof
01/08/2009US20090011547 Cooling of substrate using interposer channels
01/08/2009US20090011546 Cooling of substrate using interposer channels
01/08/2009US20090011545 Chip package process
01/08/2009US20090011544 Method of forming molded standoff structures on integrated circuit devices
01/08/2009US20090011543 Enhanced Reliability of Wafer-Level Chip-Scale Packaging (WLCSP) Die Separation Using Dry Etching
01/08/2009US20090011542 Structure and manufactruing method of chip scale package
01/08/2009US20090011541 Stacked microelectronic devices and methods for manufacturing microelectronic devices
01/08/2009US20090011540 Die-wafer package and method of fabricating same
01/08/2009US20090011539 Flexible Structures for Interconnect Reliability Test
01/08/2009US20090011538 Packaging system
01/08/2009US20090011537 Semiconductor device and method for manufacturing same
01/08/2009US20090011536 Optical device with irox nanostruture electrode neural interface
01/08/2009US20090011535 Apparatus and Method of Manufacturing Solar Cells
01/08/2009US20090011533 Isolation techniques for reducing dark current in cmos image sensors
01/08/2009US20090011531 Semiconductor Laser With Narrow Beam Divergence
01/08/2009US20090011530 Nitride-composite semiconductor laser element, its manufacturing method, and semiconductor optical device
01/08/2009US20090011529 Ir-light emitters based on swnt's (single walled carbon nanotubes), semiconducting swnts-light emitting diodes and lasers
01/08/2009US20090011526 Increasing an electrical resistance of a resistor by nitridization
01/08/2009US20090011525 Method for joining adhesive tape to semiconductor wafer and method for separating protective tape from semiconductor wafer
01/08/2009US20090011524 Method for determining suitability of a resist in semiconductor wafer fabrication