Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/22/2009US20090020834 Semiconductor device and manufacturing method thereof
01/22/2009US20090020833 Semiconductor device and method of fabricating the same
01/22/2009US20090020832 Semiconductor Devices and the Manufacture Thereof
01/22/2009US20090020831 Deuterated film encapsulation of nonvolatile charge trap memory device
01/22/2009US20090020829 Printing of contact metal and interconnect metal via seed printing and plating
01/22/2009US20090020828 Semiconductor device and its manufacturing method
01/22/2009US20090020827 Thin gate electrode cmos devices and methods of fabricating same
01/22/2009US20090020824 Semiconductor device and method for producing the same
01/22/2009US20090020823 Semiconductor device and method for manufacturing the same
01/22/2009US20090020822 Semiconductor device and method for fabricating the same
01/22/2009US20090020821 Dual workfunction semiconductor device
01/22/2009US20090020820 Channel-stressed semiconductor devices and methods of fabrication
01/22/2009US20090020819 Fin-type field effect transistor structure with merged source/drain silicide and method of forming the structure
01/22/2009US20090020817 Semiconductor device having a plurality of stacked transistors and method of fabricating the same
01/22/2009US20090020815 Semiconductor device and manufacturing method of the same
01/22/2009US20090020813 Formation of lateral trench fets (field effect transistors) using steps of ldmos (lateral double-diffused metal oxide semiconductor) technology
01/22/2009US20090020811 Guard ring structures for high voltage cmos/low voltage cmos technology using ldmos (lateral double-diffused metal oxide semiconductor) device fabrication
01/22/2009US20090020807 Semiconductor device and method for fabricating the same
01/22/2009US20090020806 Asymmetric field effect transistor structure and method
01/22/2009US20090020805 Non-volatile memory devices and methods of forming the same
01/22/2009US20090020804 Semiconductor device and method for fabricating the same
01/22/2009US20090020802 Integrated scheme for forming inter-poly dielectrics for non-volatile memory devices
01/22/2009US20090020801 Two-bit flash memory cell structure and method of making the same
01/22/2009US20090020800 Semiconductor Device and Method of Making Same
01/22/2009US20090020798 Transistor structure and method of making the same
01/22/2009US20090020797 Semiconductor device and method of manufacturing the same
01/22/2009US20090020795 Solid-state imaging element and method for fabricating the same
01/22/2009US20090020794 Image Sensor and Method of Manufacturing the Same
01/22/2009US20090020792 Isolated tri-gate transistor fabricated on bulk substrate
01/22/2009US20090020791 Process method to fabricate cmos circuits with dual stress contact etch-stop liner layers
01/22/2009US20090020790 Method for fabricating polysilicon film, a gas phase deposition apparatus and an electronic device formed thereby
01/22/2009US20090020786 Semiconductor device
01/22/2009US20090020783 Transistor with differently doped strained current electrode region
01/22/2009US20090020779 Method of preparing a sealed light-emitting diode chip
01/22/2009US20090020774 Package of light emitting diode and method for manufacturing the same
01/22/2009US20090020773 Semiconductor light emitting device and method of manufacturing the same
01/22/2009US20090020770 Led chip package structure with high-efficiency light-emitting effect and method of packaging the same
01/22/2009US20090020768 Buried contact devices for nitride-based films and manufacture thereof
01/22/2009US20090020765 Semiconductor Device and Method for Manufacturing Same
01/22/2009US20090020764 Graphene-based transistor
01/22/2009US20090020762 Display device and method of fabricating the same
01/22/2009US20090020761 Semiconductor device and method for manufacturing the same
01/22/2009US20090020758 Display substrate and method of manufacturing the same
01/22/2009US20090020757 Flash Anneal for a PAI, NiSi Process
01/22/2009US20090020756 Test structures of a semiconductor device and methods of forming the same
01/22/2009US20090020753 Method of manufacturing semiconductor active layer, method of manufacturing thin film transistor using the same and thin film transistor having semiconductor active layer
01/22/2009US20090020751 Method of forming thin film patterning substrate including formation of banks
01/22/2009US20090020748 Si/sige interband tunneling diodes with tensile strain
01/22/2009US20090020745 Method of manufacturing semiconductor device having transition metal oxide layer and related device
01/22/2009US20090020744 Stacked multilayer structure and manufacturing method thereof
01/22/2009US20090020740 Resistive memory structure with buffer layer
01/22/2009US20090020739 Method for Delineation of Phase Change Memory Cell Via Film Resistivity Modification
01/22/2009US20090020738 Integrated circuit including force-filled resistivity changing material
01/22/2009US20090020721 Valve for Vacuum Exhaustion System
01/22/2009US20090020699 Microstructured pattern inspection method
01/22/2009US20090020615 Method of making smart cards with an excapsulant
01/22/2009US20090020408 Substrate Processing Method and Substrate Processing Apparatus
01/22/2009US20090020228 Plasma processing apparatus and plasma generation chamber
01/22/2009US20090020227 Vacuum processing apparatus for semiconductor fabrication apparatus
01/22/2009US20090020158 Method for manufacturing solar cell and solar cell, and method for manufacturing semiconductor device
01/22/2009US20090020156 Method for manufacturing solar cell and solar cell
01/22/2009US20090020154 Multi-junction solar cells and methods and apparatuses for forming the same
01/22/2009US20090020144 Method and apparatus for cleaning a substrate
01/22/2009US20090020137 Cleaning apparatus and method, exposure apparatus having the cleaning apparatus, and device manufacturing method
01/22/2009US20090019722 Apparatus and method for removing organic contamination adsorbed onto substrate, and apparatus and method for measuring thickness of thin film formed on substrate
01/22/2009DE112007000735T5 Laserbestrahlungsgerät Laser irradiation device
01/22/2009DE112007000267T5 Halbleiteranordnung und Verfahren zur Herstellung derselben A semiconductor device and method of manufacturing the same
01/22/2009DE112004001922B4 Flash-Architektur mit abgesenktem Kanal für geringere Kurzkanaleffekte Flash architecture with reduced channel for lower short-channel effects
01/22/2009DE10392200B4 Herstellungsverfahren und Varaktor Manufacturing processes and varactor
01/22/2009DE10324751B4 Verfahren zur Herstellung einer Halbleiter-Struktur mit einem Halbleitersubstrat und mit diesem Verfahren hergestellte Halbleiter-Struktur A method of fabricating a semiconductor structure comprising a semiconductor substrate, and with this method produced semiconductor structure
01/22/2009DE10324657B4 Verfahren zur Herstellung eines Metallsilizids A process for producing a metal silicide
01/22/2009DE10250915B4 Verfahren zur Abscheidung eines Materials auf einem Substratwafer A method for depositing a material on a substrate wafer
01/22/2009DE10235981B9 Teilchenoptische Vorrichtung und Elektronenmikroskop A particle-optical and electron microscope
01/22/2009DE10222867B4 Verfahren der Verwendung von Opferabstandsstücken (Spacers) zur Verringerung des Kurzkanaleffekts A method of use of sacrificial spacers (spacer) to reduce the short channel effect
01/22/2009DE102008040058A1 Mikrolithographische Projektionsbelichtungsanlage Microlithographic projection exposure apparatus
01/22/2009DE102008034119A1 Anordnung zum berührungslosen Transport von flachen Substraten Arrangement for contactless transport of flat substrates
01/22/2009DE102008033651A1 Vorrichtung und Verfahren zum Herstellen von Halbleiterbaugruppen Apparatus and method for manufacturing semiconductor modules
01/22/2009DE102008032796A1 Halbleitervorrichtung mit PN-Säulenabschnitt A semiconductor device having PN-column portion
01/22/2009DE102008031373A1 Halbleiter-Packaging-Verfahren unter Verwendung eines Panels mit großer Abmessung Semiconductor packaging process using a panel of large size
01/22/2009DE102008030256A1 Bildsensor und Verfahren zu dessen Herstellung Image sensor and method for its production
01/22/2009DE102008029644A1 Halbleiterbauelement Semiconductor device
01/22/2009DE102008002652A1 Verfahren zum Herstellen eines nichtflüchtigen Speicherbauelements A method of manufacturing a nonvolatile memory device
01/22/2009DE102008002651A1 Halbleiterbauelement und Verfahren zu dessen Herstellung Semiconductor device and process for its preparation
01/22/2009DE102007061259A1 Arraysubstrat für ein Flüssigkristalldisplay sowie Verfahren zum Herstellen desselben On the same array substrate for a liquid crystal display and method of manufacturing
01/22/2009DE102007047469B3 Laser-stripping of existing thin layer from workpiece along defined track, e.g. to make thin-film solar modules, employs elliptical focal zone having major axis forming angle with direction of travel
01/22/2009DE102007043920A1 Funktionelles Material für gedruckte elektronische Bauteile Functional material for printed electronic components
01/22/2009DE102007034701A1 Halbleitersubstrat und Verfahren zum Herstellen eines Halbleiterbauelements Semiconductor substrate and method for fabricating a semiconductor device
01/22/2009DE102007033873A1 N-doped zone manufacturing method for semiconductor wafer e.g. silicon wafer, involves diffusing protons from end-of-range area along direction of wafer front side, and developing n-doped semiconductor zone with hydrogen-induced donors
01/22/2009DE102007033839A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
01/22/2009DE102007033685A1 Verfahren zum Ätzen einer Schicht auf einem Silizium-Halbleitersubstrat A method for etching a layer on a silicon semiconductor substrate
01/22/2009DE102007033465A1 Dehnschlitze zur thermomechanischen Entlastung einer elektrischen Kontaktierung Expansion slots for thermomechanical discharge an electrical contact
01/22/2009DE102007033288A1 Elektronisches Bauelement und Vorrichtung mit hoher Isolationsfestigkeit sowie Verfahren zu deren Herstellung An electronic component and device with a high insulation resistance as well as processes for their preparation
01/22/2009DE102007033258A1 Waste fluid separating medium regeneration method for use during manufacture of solar cells, involves removing solvent from fluid mixture after separation of solid particle and under pressure using ceramic nano-filtration unit
01/22/2009DE102007033005A1 Modul und Verfahren zur Herstellung eines Moduls Module and method for manufacturing a module
01/22/2009DE102007032559A1 Verschlussmechanismus für Drucktestkammern zum Testen von elektronischen Bauelementen, insbesonder IC's Closure mechanism for pressure test chambers for testing electronic components, IC's insbesonder
01/22/2009DE102007032385A1 Semiconductor wafer cleaning method for single wafer cleaning system, involves rinsing semiconductor wafer with water containing hydrochloric acid and with water in cleaning sequence implemented in same cleaning module
01/22/2009DE102007030056B3 Verfahren zum Blockieren einer Voramorphisierung einer Gateelektrode eines Transistors A method for blocking a pre-amorphization of a gate electrode of a transistor
01/22/2009DE102007024949B3 Handhabungsvorrichtung zum Positionieren eines Testkopfs, insbesondere an einer Prüfeinrichtung Handling device for positioning a test head, in particular to a test device
01/22/2009DE102005047475B4 Verfahren zum Herstellen eines Maskensatzes und Maskensatz zum Definieren eines Musters A method of producing a set of masks and mask set to define a pattern
01/22/2009DE102005045078B4 Feldeffekttransistor mit einer verspannten Kanalschicht an Seitenwänden einer Struktur an einem Halbleitersubstrat Field effect transistor with a strained channel layer on sidewalls of a structure on a semiconductor substrate