Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/08/2009US20090011523 Processing method and processing apparatus
01/08/2009US20090011522 Semiconductor Device Package Disassembly
01/08/2009US20090011375 Immersion liquid for liquid immersion lithography process and method for forming resist pattern using the same
01/08/2009US20090011249 Multilayer ceramic substrate, method for producing same, and electronic component
01/08/2009US20090011221 Cushioning Material for a Polishing Pad
01/08/2009US20090011158 Microneedle structures and corresponding production methods employing a backside wet etch
01/08/2009US20090011149 Substrate processing method
01/08/2009US20090011148 Methods and apparatuses promoting adhesion of dielectric barrier film to copper
01/08/2009US20090011129 Method and apparatus for providing precursor gas to a processing chamber
01/08/2009US20090010738 Vacuum processing apparatus and vacuum processing method
01/08/2009US20090010626 Processing multilayer semiconductors with multiple heat sources
01/08/2009US20090010594 Optical and electrical circuit board and method of manufacturing the same
01/08/2009US20090010527 Defect Inspection Method
01/08/2009US20090010291 Light-emitting device with a protection layer to prevent the inter-diffusion of zinc (Zn) atoms
01/08/2009US20090010075 NROM memory cell, memory array, related devices and methods
01/08/2009US20090010072 Semiconductor device
01/08/2009US20090010042 Semiconductor integrated circuit device
01/08/2009US20090009775 Reticle, apparatus for monitoring optical system, method for monitoring optical system, and method for manufacturing reticle
01/08/2009US20090009707 Liquid crystal display panel manufacturing method and device
01/08/2009US20090009705 Semiconductor device and manufacturing method thereof, and liquid crystal display device
01/08/2009US20090009440 Display device including an organic el device
01/08/2009US20090009434 High power address driver and display device employing the same
01/08/2009US20090009281 Fuse element and manufacturing method thereof
01/08/2009US20090009236 Step-down circuit with stabilized output voltage
01/08/2009US20090009215 Integrated Circuit with Multidimensional Switch Topology
01/08/2009US20090009205 Microcontactor probe assembly having a plunger and electric probe module using the same
01/08/2009US20090009200 Method for Providing Alignment of a Probe
01/08/2009US20090009094 Active matrix type organic electroluminescent display device and method of manufacturing the same
01/08/2009US20090009064 Organic Light Emitting Device Having Surface-Treated Bottom Electrode
01/08/2009US20090008801 Semiconductor device and method for fabricating the same
01/08/2009US20090008800 Flip chip mounting body, flip chip mounting method and flip chip mounting apparatus
01/08/2009US20090008799 Dual mirror chips, wafer including the dual mirror chips, multi-chip packages, methods of fabricating the dual mirror chip, the wafer, and multichip packages, and a method for testing the dual mirror chips
01/08/2009US20090008798 Semiconductor device suitable for a stacked structure
01/08/2009US20090008796 Copper on organic solderability preservative (osp) interconnect
01/08/2009US20090008795 Stackable microelectronic device carriers, stacked device carriers and methods of making the same
01/08/2009US20090008794 Thickness Indicators for Wafer Thinning
01/08/2009US20090008793 Semiconductor device
01/08/2009US20090008789 Method of manufacturing micro tunnel-junction circuit and micro tunnel-junction circuit
01/08/2009US20090008788 Method of forming a semiconductor device
01/08/2009US20090008787 High efficiency solar cell fabrication
01/08/2009US20090008784 Power semiconductor substrates with metal contact layer and method of manufacture thereof
01/08/2009US20090008782 Integrated circuit structure and manufacturing method thereof
01/08/2009US20090008781 Semiconductor device
01/08/2009US20090008780 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods
01/08/2009US20090008778 Structure and manufactruing method of chip scale package
01/08/2009US20090008777 Inter-connecting structure for semiconductor device package and method of the same
01/08/2009US20090008776 Electronic Component Mounted Body, Electronic Component with Solder Bump, Solder Resin Mixed Material, Electronic Component Mounting Method and Electronic Component Manufacturing Method
01/08/2009US20090008775 Semiconductor device with welded leads and method of manufacturing the same
01/08/2009US20090008774 Semiconductor device
01/08/2009US20090008773 Mounted Semiconductor Device And A Method For Making The Same
01/08/2009US20090008771 Semiconductor module device, method of manufacturing the same, flat panel display, and plasma display panel
01/08/2009US20090008769 Semiconductor module
01/08/2009US20090008767 Integrated circuit package with sputtered heat sink for improved thermal performance
01/08/2009US20090008766 High-Density Fine Line Structure And Method Of Manufacturing The Same
01/08/2009US20090008765 Chip embedded substrate and method of producing the same
01/08/2009US20090008762 Ultra slim semiconductor package and method of fabricating the same
01/08/2009US20090008760 Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant
01/08/2009US20090008759 Semiconductor device, lead frame, and manufacturing method for the lead frame
01/08/2009US20090008758 Use of discrete conductive layer in semiconductor device to re-route bonding wires for semiconductor device package
01/08/2009US20090008756 Multi-Chip Electronic Package with Reduced Stress
01/08/2009US20090008754 Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads
01/08/2009US20090008751 Method for Producing an Area having Reduced Electrical Conductivity Within a Semiconductor Layer and Optoelectronic Semiconductor Element
01/08/2009US20090008750 Seal ring for semiconductor device
01/08/2009US20090008749 Device made of single-crystal silicon
01/08/2009US20090008747 Semiconductor device and method for manufacturing thereof
01/08/2009US20090008746 Method of fabricating semiconductor high-voltage device
01/08/2009US20090008745 Nitride Compound Semiconductor and Process for Producing the Same
01/08/2009US20090008744 Semiconductor device and semiconductor device manufacturing method
01/08/2009US20090008743 Capacitor with pillar type storage node and method for fabricating the same
01/08/2009US20090008742 Semiconductor device including memory cell and anti-fuse element
01/08/2009US20090008741 Semiconductor device including memory cell and anti-fuse element
01/08/2009US20090008739 Photo Diodes Having a Conductive Plug Contact to a Buried Layer and Methods of Manufacturing the Same
01/08/2009US20090008733 Electric field steering cap, steering electrode, and modular configurations for a radiation detector
01/08/2009US20090008729 Image sensor package utilizing a removable protection film and method of making the same
01/08/2009US20090008728 Semiconductor device and manufacturing method of the same
01/08/2009US20090008726 Method of manufacturing semiconductor device and semiconductor device
01/08/2009US20090008725 Method for deposition of an ultra-thin electropositive metal-containing cap layer
01/08/2009US20090008724 Semiconductor device and method of manufacturing the same
01/08/2009US20090008723 Semiconductor component including an edge termination having a trench and method for producing
01/08/2009US20090008717 Semiconductor Devices Including Elevated Source and Drain Regions and Methods of Fabricating the Same
01/08/2009US20090008716 Semiconductor device and method of fabricating the same
01/08/2009US20090008714 Semiconductor devices and methods of forming the same
01/08/2009US20090008713 Display device and a method for manufacturing the same
01/08/2009US20090008709 Power Semiconductor Devices with Trenched Shielded Split Gate Transistor and Methods of Manufacture
01/08/2009US20090008708 Semiconductor device and manufacturing method of the same
01/08/2009US20090008706 Power Semiconductor Devices with Shield and Gate Contacts and Methods of Manufacture
01/08/2009US20090008705 Body-contacted finfet
01/08/2009US20090008704 Semiconductor memory device
01/08/2009US20090008703 Non-volatile memory cell and fabricating method thereof
01/08/2009US20090008702 Dielectric charge-trapping materials having doped metal sites
01/08/2009US20090008701 Nonvolatile memory device and method of fabricating the same
01/08/2009US20090008700 Semiconductor memory devices and methods of manufacturing the same
01/08/2009US20090008699 Non-volatile semiconductor memory device and method of manufacturing the same
01/08/2009US20090008698 Nonvolatile memory device and method for fabricating the sam
01/08/2009US20090008697 Sram cells with repressed floating gate memory, low tunnel barrier interpoly insulators
01/08/2009US20090008696 Semiconductor memory device and method of forming the same
01/08/2009US20090008695 Semiconductor device and method for fabricating the same
01/08/2009US20090008694 Integrated circuit and corresponding manufacturing method
01/08/2009US20090008693 Semiconductor device and method of manufacturing same
01/08/2009US20090008692 Semiconductor device and fabricating method thereof