Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/28/2009CN100456116C Liquid crystal display device and fabricating method thereof
01/28/2009CN100456093C Chromatic cholesterol type LCD and method for manufacturing same
01/28/2009CN100456089C Pixel structure of LCD array substrate and method for making same
01/28/2009CN100456088C LCD adhesion machine and method for producing LCD with the same adhering machine
01/28/2009CN100456049C Method for manufacturing two-dimensional photonic crystals and photonic quasicrystalline
01/28/2009CN100456024C System and method for preventing mistakes in optical inspection
01/28/2009CN100455984C Eddy current sensor
01/28/2009CN100455619C Novel siloxane-based resin and interlayer insulating film formed using the same
01/27/2009US7484186 Method for designing a system LSI
01/27/2009US7484141 Semiconductor device capable of performing test at actual operating frequency
01/27/2009US7484135 Semiconductor device having a mode of functional test
01/27/2009US7483764 Exposure apparatus and device manufacturing method
01/27/2009US7483560 Method for measuring three dimensional shape of a fine pattern
01/27/2009US7483291 Magneto-resistance effect element, magnetic memory and magnetic head
01/27/2009US7483256 Electrostatic chuck
01/27/2009US7483155 Structure inspection method, pattern formation method, process condition determination method and resist pattern evaluation apparatus
01/27/2009US7483123 Substrate conveyor apparatus, substrate conveyance method and exposure apparatus
01/27/2009US7483118 Lithographic projection apparatus and device manufacturing method
01/27/2009US7483105 Vertically aligned mode liquid crystal display
01/27/2009US7483091 Semiconductor display devices
01/27/2009US7483089 Semiconductor device having thin film transistor with particular drain electrode
01/27/2009US7483001 Active matrix substrate, electro-optical device, and electronic device
01/27/2009US7482861 Semiconductor integrated circuit device, and method of manufacturing the same
01/27/2009US7482824 Polycrystalline contacting component and test tool having the contacting component
01/27/2009US7482821 Probe card and the production method
01/27/2009US7482730 High performance MEMS scanner
01/27/2009US7482727 Composite material with conductive nanowires
01/27/2009US7482702 Semiconductor component sealed on five sides by polymer sealing layer
01/27/2009US7482695 Stack MCP and manufacturing method thereof
01/27/2009US7482694 Semiconductor device and its manufacturing method
01/27/2009US7482693 Top layers of metal for high performance IC's
01/27/2009US7482690 Electronic components such as thin array plastic packages and process for fabricating same
01/27/2009US7482687 Etch stop in a damascene interconnect structure
01/27/2009US7482686 Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same
01/27/2009US7482681 Semiconductor device package utilizing proud interconnect material
01/27/2009US7482677 Dielectric structures having high dielectric constants, and non-volatile semiconductor memory devices having the dielectric structures
01/27/2009US7482676 Compositions for preparing low dielectric materials
01/27/2009US7482674 Crystalline III-V nitride films on refractory metal substrates
01/27/2009US7482671 MOS semiconductor device isolated by a device isolation film
01/27/2009US7482662 High voltage semiconductor device utilizing a deep trench structure
01/27/2009US7482661 Pattern forming method and semiconductor device manufactured by using said pattern forming method
01/27/2009US7482658 Semiconductor device and method of manufacturing the same
01/27/2009US7482655 MOSgate driver integrated circuit with adaptive dead time
01/27/2009US7482652 Multiwalled carbon nanotube memory device
01/27/2009US7482650 Method of manufacturing a semiconductor integrated circuit device having a columnar laminate
01/27/2009US7482648 Electronic device and method of manufacturing the same
01/27/2009US7482645 Method and structure for making a top-side contact to a substrate
01/27/2009US7482644 Integrated semiconductor memory and method for electrically stressing an integrated semiconductor memory
01/27/2009US7482638 Package for a semiconductor light emitting device
01/27/2009US7482630 NAND memory arrays
01/27/2009US7482628 Array substrate for liquid crystal display device and method of fabricating the same
01/27/2009US7482627 Semiconductor device, and method of fabricating the same
01/27/2009US7482623 Organic semiconductor film and organic semiconductor device
01/27/2009US7482622 Dual panel type organic electroluminescent device and method of fabricating the same
01/27/2009US7482618 ZnO group epitaxial semiconductor device and its manufacture
01/27/2009US7482617 Optical semiconductor device and fabrication method thereof
01/27/2009US7482616 Semiconductor devices having phase change memory cells, electronic systems employing the same and methods of fabricating the same
01/27/2009US7482611 Lithographic apparatus and device manufacturing method
01/27/2009US7482610 Vertical-cavity enhanced resonant thermal emitter
01/27/2009US7482570 Solid-state imaging device
01/27/2009US7482554 Laser beam processing machine
01/27/2009US7482552 Laser crystallizing device and method for crystallizing silicon
01/27/2009US7482551 Processing a memory link with a set of at least two laser pulses
01/27/2009US7482289 exposing a near-critical or supercritical CO2 containing a tantalum-releasing precursor such as cyclopentadiene Tantalum carbonyl (cp)Ta(CO)4 compound to a wavelength of light preselected to release tantalum from such precursor and deposited on a substrate ( polysiloxane, Cu, organosilicate glass etc.)
01/27/2009US7482288 Method for producing a grid cap with a locally increased dielectric constant
01/27/2009US7482286 Method for forming dielectric or metallic films
01/27/2009US7482285 Dual epitaxial layer for high voltage vertical conduction power MOSFET devices
01/27/2009US7482284 Deposition methods for forming silicon oxide layers
01/27/2009US7482283 Thin film forming method and thin film forming device
01/27/2009US7482282 dissolve and remove silicon oxide and nickel oxide on nickel silicide in two separate steps; lower contact resistance, allowing miniaturization of semiconductor device
01/27/2009US7482281 Substrate processing method
01/27/2009US7482280 Method for forming a lithography pattern
01/27/2009US7482279 Method for fabricating semiconductor device using ArF photolithography capable of protecting tapered profile of hard mask
01/27/2009US7482278 Key-hole free process for high aspect ratio gap filling with reentrant spacer
01/27/2009US7482277 Multilevel fabrication processing by functional regrouping of material deposition, lithography, and etching
01/27/2009US7482276 Semiconductor device and method of manufacturing the same
01/27/2009US7482275 Plasma treatment method and method of manufacturing semiconductor device
01/27/2009US7482274 Metal wiring and method of manufacturing the same, and metal wiring substrate and method of manufacturing the same
01/27/2009US7482273 Transmissive dynamic plasma steering method for radiant electromagnetic energy
01/27/2009US7482272 Through chip connection
01/27/2009US7482271 Manufacturing method for electronic substrate, manufacturing method for electro-optical device, and manufacturing method for electronic device
01/27/2009US7482270 Fully and uniformly silicided gate structure and method for forming same
01/27/2009US7482269 Method for controlling the step coverage of a ruthenium layer on a patterned substrate
01/27/2009US7482268 Top layers of metal for integrated circuits
01/27/2009US7482267 Ion implantation of spin on glass materials
01/27/2009US7482266 Method of forming composite opening and method of dual damascene process using the same
01/27/2009US7482265 irradiating the layer with radiation in 2 steps, having first and second wavelengths, wherein the first wavelength is larger than the second wavelength; plasma enhanced chemical vapor deposition; forming damascene interconnect structure; repairing damage forming silicon-carbon bond; semiconductor
01/27/2009US7482264 Method of forming metal line of semiconductor device, and semiconductor device
01/27/2009US7482263 Semiconductor device and method for manufacturing the same
01/27/2009US7482262 Method of manufacturing semiconductor device
01/27/2009US7482261 Interconnect structure for BEOL applications
01/27/2009US7482260 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
01/27/2009US7482259 Chip structure and process for forming the same
01/27/2009US7482258 Product and method for integration of deep trench mesh and structures under a bond pad
01/27/2009US7482257 Method for forming metal contact in semiconductor device
01/27/2009US7482256 Semiconductor device and method of manufacturing the same
01/27/2009US7482255 Method of ion implantation to reduce transient enhanced diffusion
01/27/2009US7482254 Apparatus and methods for thermally processing undoped and lightly doped substrates without pre-heating
01/27/2009US7482252 Method for reducing floating body effects in SOI semiconductor device without degrading mobility
01/27/2009US7482251 Etch before grind for semiconductor die singulation