Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/22/2009DE102004060854B4 Halbleitervorrichtungs-Simulationsverfahren und Halbleitervorrichtungs-Simulationsvorrichtung Semiconductor device simulation method and simulation apparatus semiconductor device
01/22/2009DE10127010B4 Elektronisches Bauteil mit einem Halbleiterchip auf einem spannungsreduzierten Substrat Electronic component having a semiconductor chip on a substrate voltage reduced
01/22/2009DE10106836B4 Integrierte Schaltungsanordnung aus einem flächigen Substrat Integrated circuit arrangement of a planar substrate
01/22/2009DE10103300B4 Verfahren zur Bestimmung von Widerständen und Kapazitäten eines Schaltplans, der eine elektrische Schaltung repräsentiert A method for determining resistance and capacitance of a circuit diagram representing an electric circuit
01/22/2009CA2693135A1 A method for processing a semiconductor substrate surface and a chemical processing device for the semiconductor substrate surface
01/22/2009CA2691081A1 System and method for monitoring vehicles on a roadway
01/21/2009EP2017885A2 Method of producing an electric connection using nanotubes and having air gaps
01/21/2009EP2017884A2 Buried contact devices for nitride-based films and manufacture thereof
01/21/2009EP2017883A2 Electronic device manufacturing method and electronic device
01/21/2009EP2017882A2 Conductive ball mounting method and apparatus
01/21/2009EP2017881A2 Method of manufacturing semiconductor active layer, method of manufacturing thin film transistor using the same and thin film transistor having semiconductor active layer.
01/21/2009EP2017880A2 Solid-state timing device using a floating-gate transistor
01/21/2009EP2017879A2 Method of treating wall portions of an opening made in a silicon substrate
01/21/2009EP2017878A2 Method for etching using advanced patterning film in capacitive coupling high frequency plasma dielectric etch chamber
01/21/2009EP2017675A1 Exposure apparatus
01/21/2009EP2017671A1 Lithographic pellicle
01/21/2009EP2017670A1 Phase shift mask
01/21/2009EP2017375A1 Process for producing group iii nitride crystal, group iii nitride crystal substrate, and group iii nitride semiconductor device
01/21/2009EP2017369A1 Chemical fluid deposition for the formation of metal and metal alloy films on patterned and unpatterned substrates
01/21/2009EP2017362A1 Brittle metall alloy sputtering targets and method of fabricating same
01/21/2009EP2017318A2 Chemical mechanical polishing aqueous dispersion preparation set, method of preparing chemical mechanical polishing aqueous dispersion, chemical mechanical polishing aqueous dispersion, and chemical mechanical polishing method
01/21/2009EP2017295A1 Thermosetting composition for optical semiconductor, die bond material for optical semiconductor device, underfill material for optical semiconductor device, sealing agent for optical semiconductor device, and optical semiconductor device
01/21/2009EP2016623A1 High voltage transistor with improved high side performance
01/21/2009EP2016621A1 Semiconductor device having a semiconductor-on-insulator configuration and a superlattice and associated methods
01/21/2009EP2016618A1 Hybrid wafers
01/21/2009EP2016616A1 Electrical components for microelectronic devices and methods of forming the same
01/21/2009EP2016615A1 Method and structure for creation of a metal insulator metal capacitor
01/21/2009EP2016614A1 Method of zinc oxide film grown on the epitaxial lateral overgrowth gallium nitride template
01/21/2009EP2016613A2 Template having a varying thickness
01/21/2009EP2016607A2 Semiconductor components and systems having encapsulated through wire interconnects (twi) and wafer level methods of fabrication
01/21/2009EP2016463A1 Composition for positive type photoresist and positive type photoresist film manufactured thereby
01/21/2009EP2016204A2 Controlling plasma processing using parameters derived through the use of a planar ion flux probing arrangement
01/21/2009EP1917132A4 Plastic semiconductor package having improved control of dimensions
01/21/2009EP1846956B1 Method for producing metal/semiconductor contacts through a dielectric
01/21/2009EP1829093B1 Cmp composition comprising surfactant
01/21/2009EP1576658B1 Method of producing mixed substrates and structure thus obtained
01/21/2009EP1570509B1 Method of producing a complex structure by assembling stressed structures
01/21/2009EP1502292A4 Polymeric antireflective coatings deposited by plasma enhanced chemical vapor deposition
01/21/2009EP1500129A4 Method and apparatus for shaping thin films in the near-edge regions of in-process semiconductor substrates
01/21/2009EP1490877B1 Synthetic-ferrimagnet sense-layer for high density mram applications
01/21/2009EP1470264B1 Methods for silicon oxide and oxynitride deposition using single wafer low pressure cvd
01/21/2009EP1454361A4 Trench mosfet device with polycrystalline silicon source contact structure
01/21/2009EP1394844B1 Method of fabricating semiconductor device
01/21/2009EP1264336B1 Forming microscale structures from polycrystalline materials
01/21/2009EP1230672B1 Method for treating a surface of an sic semiconductor layer and forming a contact
01/21/2009EP1038314A4 Substrate transfer system for semiconductor processing equipment
01/21/2009CN201185186Y Mechanism apparatus for sorting and carrying wafer
01/21/2009CN201185185Y System for detecting positioning accuracy of welding head
01/21/2009CN201185184Y Apparatus for shaping double positive angles of high voltage high-power thyristor
01/21/2009CN201185183Y Device for processing substrate
01/21/2009CN201185171Y Electrode capable of improving plasma evenness
01/21/2009CN201183095Y Special mould for processing grinding silicon chip carrier
01/21/2009CN101352108A Stage apparatus and plasma processing apparatus
01/21/2009CN101351899A Semiconductor light emitting device and method for manufacturing the same
01/21/2009CN101351892A Semiconductor device and method for manufacturing same
01/21/2009CN101351890A Semiconductor substrate for solid state imaging device, solid state imaging device, and method for manufacturing them
01/21/2009CN101351888A Electric element, memory device and semiconductor integrated circuit
01/21/2009CN101351887A Fabrication of transistors
01/21/2009CN101351880A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
01/21/2009CN101351879A Method for making a plate-like detachable structure, in particular made of silicon, and use of said method
01/21/2009CN101351878A Substrate transfer device, substrate processing apparatus and substrate transfer method
01/21/2009CN101351877A Substrate of probe card and method for regenerating thereof
01/21/2009CN101351876A Strip for integrated circuit packages having a maximized usable area
01/21/2009CN101351875A Semiconductor device manufacturing method
01/21/2009CN101351874A Soldering method and semiconductor module manufacturing method
01/21/2009CN101351873A Integrated capacitors in package-level structures, processes of making same, and systems containing same
01/21/2009CN101351872A Semiconductor device and process for producing the same
01/21/2009CN101351871A Plasma processing apparatus
01/21/2009CN101351870A Laser beam machining method and semiconductor chip
01/21/2009CN101351869A Method of forming a metal layer over a patterned dielectric by wet chemical deposition including an electroless and a powered phase
01/21/2009CN101351868A Method for atomizing material for coating processes
01/21/2009CN101351815A Manufacturing method and device for making an in-mold circuit comprising a chip
01/21/2009CN101351755A Dispensable cured resin
01/21/2009CN101351518A Free radical-forming activator attached to solid and used to enhance CPM formulations
01/21/2009CN101351407A Complex oxide film and method for producing same, composite body and method for producing same, dielectric material, piezoelectric material, capacitor, piezoelectric element and electronic device
01/21/2009CN101351088A Inside imbedded type line structure and technique thereof
01/21/2009CN101351087A Inside imbedded type line structure and technique thereof
01/21/2009CN101351086A Inside imbedded type line structural technique
01/21/2009CN101351076A Apparatus for processing plasma
01/21/2009CN101350618A Level shift circuit and semiconductor device
01/21/2009CN101350500A Semiconductor light- emitting device and manufacturing method thereof
01/21/2009CN101350392A P type nitride semiconductor Ohm contact electrode with nano pattern and preparation method thereof
01/21/2009CN101350388A Semiconductor structure combination for semiconductor actinoelectricity component great crystal and production thereof
01/21/2009CN101350387A Encapsulation base unit for LED and manufacturing method thereof
01/21/2009CN101350386A Method for incising LED crystal particle
01/21/2009CN101350381A Salient point LED and manufacturing method thereof
01/21/2009CN101350369A Bottom anode schottky diode structure and manufacture method
01/21/2009CN101350366A Antistatic TFT substrate and processing technique thereof
01/21/2009CN101350364A Method for preparing nano zinc oxide field-effect transistor
01/21/2009CN101350363A Transistor structure and preparation method thereof
01/21/2009CN101350360A Three-dimensional stacking non-phase-change caused resistance conversion storage apparatus and manufacturing method thereof
01/21/2009CN101350359A Image sensor and method of manufacturing the same
01/21/2009CN101350355A Capacitor and manufacturing method thereof
01/21/2009CN101350354A Semiconductor device and method for producing the same
01/21/2009CN101350353A Semiconductor device and its manufacturing method
01/21/2009CN101350352A Semiconductor IC device and manufacture method thereof
01/21/2009CN101350351A Semiconductor structure and forming method thereof
01/21/2009CN101350349A Semiconductor device and method for fabricating the same
01/21/2009CN101350347A Capacitor and manufacturing method thereof
01/21/2009CN101350346A Light emitting device and method of manufacturing the same