Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/14/2009CN101345184A Plasma processing apparatus, gas dispensing device and gas delivery method
01/14/2009CN101345183A Reaction chamber performance analysis method and correlative performance analysis system
01/14/2009CN101345114A Inductance coupling coil and inductance coupling plasma apparatus using the same
01/14/2009CN101344898A Production method, design method and design system for semiconductor integrated circuit
01/14/2009CN101344784A Standard operation time calculating device and standard operation time calculating method
01/14/2009CN101344733A Photoresist coating and developing apparatus
01/14/2009CN101344732A Maskless lithography systems and methods utilizing spatial light modulator arrays
01/14/2009CN101344725A Coating apparatus, substrate exchanging method and coating method
01/14/2009CN101344721A Photo-etching method
01/14/2009CN101344697A Image element structure and LCD panel
01/14/2009CN101344695A Display panel and method of manufacturing the same
01/14/2009CN101344693A Display device and manufacturing method thereof
01/14/2009CN101344692A Thin film LCD and method for regulating white spot color temperature of thin film LCD
01/14/2009CN101344650A Test device of display device, test method and substrate with test device
01/14/2009CN101344570A Inspection method and program recording medium recorded with inspection method
01/14/2009CN101343510A Metal polishing liquid and polishing method using it
01/14/2009CN101342992A Plate-like body conveyance device
01/14/2009CN101342681A Polishing head
01/14/2009CN101342679A Polishing head for chemico-mechanical polishing
01/14/2009CN100452945C Decoupling reactive ion etching chamber containing multiple processing platforms
01/14/2009CN100452944C Plasma processing device
01/14/2009CN100452627C Semiconductor circuit device and data processing system
01/14/2009CN100452583C Nitride semiconductor device and method for manufacturing same
01/14/2009CN100452582C Semiconductor laser and method for manufacturing the same
01/14/2009CN100452578C Micro-channel thermal deposit chemical cleaning device of semiconductor laser array and alternation array
01/14/2009CN100452480C Method of and system for manufacturing organic EL devices
01/14/2009CN100452472C Organic field-effect transistor and method of making same based on polymerizable self-assembled monolayers
01/14/2009CN100452464C Nitride semiconductor light emitting device and method of fabricating nitride semiconductor laser device
01/14/2009CN100452449C Nitride semiconductors on silicon substrate and method of manufacturing the same
01/14/2009CN100452446C A method for pulse electrodeposit CIGS semiconductor film material
01/14/2009CN100452442C Method for production of a semiconductor device with auto-aligned metallisations
01/14/2009CN100452441C Optical sensor package
01/14/2009CN100452440C Nonvolatile semiconductor memory device and method of manufacturing the same
01/14/2009CN100452439C Transistor of semiconductor device and method of manufacturing the same
01/14/2009CN100452438C Floating gate transistors
01/14/2009CN100452436C Transistor manufacturing method, electro-optic device and electronic instrument
01/14/2009CN100452435C Planar ultra-thin semiconductor-on-insulator channel mosfet and manufacturing method thereof
01/14/2009CN100452434C Field effect transistor and making method thereof
01/14/2009CN100452432C Structure and method for manufacturing strained finfet
01/14/2009CN100452430C Semiconductor device and its manufacturing method
01/14/2009CN100452429C High switch speed power device and its manufacturing method
01/14/2009CN100452428C Trench gate field effect devices
01/14/2009CN100452426C Semiconductor device and its manufacturing method
01/14/2009CN100452423C Semiconductor device
01/14/2009CN100452422C Reliable semiconductor structure and method for fabricating
01/14/2009CN100452416C Solid-state image pickup device and method for producing the same
01/14/2009CN100452413C Semiconductor device, a manufacturing method thereof, and a camera
01/14/2009CN100452412C Pixel structure and manufacture method and photoelectronic device with the pixel structure and manufacture method
01/14/2009CN100452411C Semiconductor structure and producing method thereof
01/14/2009CN100452410C Active driving TFT matrix structure and method of manufacture
01/14/2009CN100452409C STI formation in semiconductor device including SOI and bulk silicon regions
01/14/2009CN100452408C SOI wafer and method for manufacturing same
01/14/2009CN100452407C SOI wafer and production method therefor
01/14/2009CN100452405C Flash memory device and method of manufacturing the same
01/14/2009CN100452404C Manufacture of semiconductor device
01/14/2009CN100452402C Semiconductor device and method for fabricating the same
01/14/2009CN100452401C Semiconductor memory device and package thereof, and memory card using the same
01/14/2009CN100452400C Manufacturable recessed strained rsd structure and process for advanced cmos
01/14/2009CN100452397C A semiconductor structure and method to isolate one first circuit and one second circuit
01/14/2009CN100452396C Semiconductor device and manufacturing method therefor
01/14/2009CN100452390C Integrated circuit element with fuse structure including buffering layer, and mfg. method thereof
01/14/2009CN100452389C Semiconductor structure and manufacture method thereof
01/14/2009CN100452388C Structure of semiconductor device and method for manufacturing the same
01/14/2009CN100452387C Semiconductor device having multilevel copper wiring layers and its manufacture method
01/14/2009CN100452386C Semiconductor device and fabrication method thereof
01/14/2009CN100452385C Semiconductor element and manufacturing method thereof
01/14/2009CN100452384C Semiconductor device and production method therefor
01/14/2009CN100452382C Wiring board, semiconductor device, and method of manufacturing the same
01/14/2009CN100452373C Connecting structure of integrated circuit and its production
01/14/2009CN100452372C Semiconductor device having tin-based solder layer and method for manufacturing the same
01/14/2009CN100452371C Method and apparatus for chip cooling using a liquid metal thermal interface
01/14/2009CN100452369C Semiconductor device and manufacturing method therefor
01/14/2009CN100452368C Semiconductor device, method and apparatus for fabricating the same
01/14/2009CN100452367C Semiconductor device packaged into chip size and manufacturing method thereof
01/14/2009CN100452366C Adhesive film for manufacturing semiconductor device
01/14/2009CN100452363C Film transistor array substrate and mfg. method thereof
01/14/2009CN100452362C Nonvolatile memory and producing method thereof
01/14/2009CN100452361C Isolation film in semiconductor device and method of forming the same
01/14/2009CN100452360C Method of fabricating flash memory device
01/14/2009CN100452359C Semiconductor device and method for manufacturing the same
01/14/2009CN100452358C Method of manufacturing a flash memory device
01/14/2009CN100452357C Semiconductor device and manufacturing method thereof
01/14/2009CN100452356C Nonvolatile memory unit, manufacturing method, and opertion method
01/14/2009CN100452355C Nonvolatile memory, and manufacturing method
01/14/2009CN100452354C Producing method for strain source leakage CMOS using multilayer film as hard mask and anti-reflecting layer
01/14/2009CN100452353C Method of forming source/drain region of semiconductor device
01/14/2009CN100452352C CMOS image sensor and manufacturing method thereof
01/14/2009CN100452351C Method of manufacturing semiconductor device
01/14/2009CN100452350C Manufacturing method for non-refrigeration infrared focal plane array based on silicon substrate without sacrifice layer
01/14/2009CN100452349C Computer implemented method for designing a semiconductor device, an automated design system and a semiconductor device
01/14/2009CN100452348C Method for manufacturing microelectronic circuit component and integrated circuit component
01/14/2009CN100452347C Interlinkage structure and its forming method
01/14/2009CN100452346C Coating forming method, apparatus and device, method for mfg. device and electronic apparatus
01/14/2009CN100452345C Method of manufacturing a semiconductor device, and a semiconductor substrate
01/14/2009CN100452344C Method for forming shallow groove segregation of improving element leakage behave
01/14/2009CN100452343C Carrier support device
01/14/2009CN100452342C Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board
01/14/2009CN100452341C Middle current injection device and communication and control method for standard mechanical interface
01/14/2009CN100452340C Substrate treating apparatus
01/14/2009CN100452339C Method for measuring silicon slice extension linear defect