Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/22/2009US20090023264 Method of making planar-type bottom electrode for semiconductor device
01/22/2009US20090023263 Method to manufacture a thin film resistor
01/22/2009US20090023262 Method for fabricating semiconductor device
01/22/2009US20090023260 Technique for forming the deep doped columns in superjunction
01/22/2009US20090023259 Method of Producing Non Volatile Memory Device
01/22/2009US20090023258 Method of manufacturing complementary metal oxide semiconductor transistors
01/22/2009US20090023257 Method of controlling metal silicide formation
01/22/2009US20090023256 Method for fabricating embedded static random access memory
01/22/2009US20090023255 Method for Reshaping Silicon Surfaces with Shallow Trench Isolation
01/22/2009US20090023254 Method of forming inorganic insulating layer and method of fabricating array substrate for display device using the same
01/22/2009US20090023253 Semiconductor Device and Method of Making Same
01/22/2009US20090023252 Method of manufacturing semiconductor device having a heat sink with a bored portion
01/22/2009US20090023251 Method for manufacturing semiconductor device
01/22/2009US20090023250 Apparatus and method for producing semiconductor modules
01/22/2009US20090023249 Wire bonded wafer level cavity package
01/22/2009US20090023248 Method of packaging a semiconductor die
01/22/2009US20090023247 Method for forming side wirings
01/22/2009US20090023246 Embedded chip package process
01/22/2009US20090023245 Flip chip mounting method and bump forming method
01/22/2009US20090023244 Etching/bonding chamber for encapsulated devices and method of use
01/22/2009US20090023243 Method and apparatus for fabricating integrated circuit device using self-organizing function
01/22/2009US20090023241 Clean rate improvement by pressure controlled remote plasma source
01/22/2009US20090023240 Semiconductor laser device and manufacturing method of the same
01/22/2009US20090023239 Light emitting device processes
01/22/2009US20090023238 Method to form an optical grating and to form a distributed feedback laser diode with the optical grating
01/22/2009US20090023237 Integrated optical isolator
01/22/2009US20090023236 Method for manufacturing display device
01/22/2009US20090023234 Method for manufacturing light emitting diode package
01/22/2009US20090023233 Method of manufacturing dispersion type ac inorganic electroluminescent device and dispersion type ac inorganic electroluminescent device manufactured thereby
01/22/2009US20090023232 Organic electroluminescence element, process for preparation of the same, and electrode film
01/22/2009US20090023231 Semiconductor Device Manufacturing Method and Method for Reducing Microroughness of Semiconductor Surface
01/22/2009US20090023230 Methods and apparatus for depositing an anti-reflection coating
01/22/2009US20090023229 Method for managing uv irradiation for curing semiconductor substrate
01/22/2009US20090023100 Patterning a surface comprising silicon and carbon
01/22/2009US20090023083 fabrication of dual damascene structures using imprint lithographic techniques; fabrication of dual damascene relief structures in imprint lithography molds
01/22/2009US20090023081 exposure method of illuminating a mask with polarized light and projecting an image of a pattern of the mask onto a substrate so as to expose the substrate
01/22/2009US20090023079 Photomask and Method of Forming Overlay Vernier of Semiconductor Device Using the Same
01/22/2009US20090022958 Amorphous metal-metalloid alloy barrier layer for ic devices
01/22/2009US20090022930 Single crystal silicon having improved gate oxide integrity
01/22/2009US20090022574 Workpiece loading system
01/22/2009US20090022572 Cluster tool with a linear source
01/22/2009US20090022571 Substrate processing apparatus with motors integral to chamber walls
01/22/2009US20090022191 Method for manufacturing a nitride semiconductor laser element and a nitride semiconductor laser element
01/22/2009US20090021986 Operating method of non-volatile memory device
01/22/2009US20090021979 Gate stack, capacitorless dynamic random access memory including the gate stack and methods of manufacturing and operating the same
01/22/2009US20090021975 Method and media for improving ferroelectric domain stability in an information storage device
01/22/2009US20090021888 Capacitor, method of manufacturing a capacitor and method of manufacturing a semiconductor device
01/22/2009US20090021873 Electro static discharge protection in integrated circuits
01/22/2009US20090021862 Electric field read/write head, method of manufacturing the same, and information storage device comprising the electric field read/write head
01/22/2009US20090021748 Method and system for wavefront measurements of an optical system
01/22/2009US20090021717 Radiation Detector, Method of Manufacturing a Radiation Detector, and Lithographic Apparatus Comprising a Radiation Detector
01/22/2009US20090021711 Method of inspecting exposure system and exposure system
01/22/2009US20090021707 Lithographic apparatus and device manufacturing method
01/22/2009US20090021704 Coating/developing apparatus and operation method thereof
01/22/2009US20090021687 Method of lifting off and fabricating array substrate for liquid crystal display device using the same
01/22/2009US20090021675 Liquid Crystal Display Device, Manufacturing Method Thereof, and Color Filter Substrate
01/22/2009US20090021663 Electro-optical device
01/22/2009US20090021661 Thin-film transistor, thin-film transistor producing method, and display apparatus
01/22/2009US20090021626 Solid state imaging apparatus and method for fabricatig the same
01/22/2009US20090021539 Light Emitting Device, Method of Driving a Light Emitting Device, Element Substrate, and Electronic Equipment
01/22/2009US20090021266 Defect detection system with multilevel output capability and method thereof
01/22/2009US20090021140 Light emitting device and method of manufacturing the same
01/22/2009US20090021109 Under bump metal film, method for forming same, and surface acoustic wave device
01/22/2009US20090020892 Selectively altering a predetermined portion or an external member in contact with the predetermined portion
01/22/2009US20090020890 Semiconductor device and method for manufacturing the same
01/22/2009US20090020889 Semiconductor apparatus and manufacturing method thereof
01/22/2009US20090020887 Semiconductor apparatus and manufacturing method thereof
01/22/2009US20090020886 Semiconductor device and method of fabricating the same
01/22/2009US20090020884 Surface treatment method, semiconductor device and method of forming the semiconductor device
01/22/2009US20090020883 Semiconductor device and method for fabricating semiconductor device
01/22/2009US20090020882 Semiconductor device and method of producing the same
01/22/2009US20090020881 Semiconductor device package and fabricating method thereof
01/22/2009US20090020880 Wiring structure in a semiconductor device and method of forming a wiring structure in a semiconductor device
01/22/2009US20090020879 Wiring structure in semiconductor device and method of fabricating wiring structure in semiconductor device
01/22/2009US20090020878 Semiconductor packages and methods of fabricating the same
01/22/2009US20090020876 High temperature packaging for semiconductor devices
01/22/2009US20090020874 Semiconductor device and method for manufacturing semiconductor device
01/22/2009US20090020873 Semiconductor apparatus, and method of manufacturing semiconductor apparatus
01/22/2009US20090020872 Wire bonding method and semiconductor device
01/22/2009US20090020871 Semiconductor chip with solder bump suppressing growth of inter-metallic compound and method of fabricating the same
01/22/2009US20090020870 Electronic device provided with wiring board, method for manufacturing such electronic device and wiring board for such electronic device
01/22/2009US20090020866 Semiconductor devices and manufacturing methods therefor
01/22/2009US20090020865 Method for Packaging Semiconductor Dies Having Through-Silicon Vias
01/22/2009US20090020864 Wafer Level package Structure and Fabrication Methods
01/22/2009US20090020862 Device structure with preformed ring and method therefor
01/22/2009US20090020861 Semiconductor device
01/22/2009US20090020860 Semiconductor device and manufacturing method of the same
01/22/2009US20090020856 Semiconductor device structures and methods for shielding a bond pad from electrical noise
01/22/2009US20090020855 Method for stacking serially-connected integrated circuits and multi-chip device made from same
01/22/2009US20090020854 Process of forming ultra thin wafers having an edge support ring
01/22/2009US20090020853 STRUCTURES OF AND METHODS FOR FORMING VERTICALLY ALIGNED Si WIRE ARRAYS
01/22/2009US20090020851 Bicmos devices with a self-aligned emitter and methods of fabricating such bicmos devices
01/22/2009US20090020849 Electronic device including a capacitor and a process of forming the same
01/22/2009US20090020847 Semiconductor device having trench isolation region and methods of fabricating the same
01/22/2009US20090020845 Shallow trench isolation structures for semiconductor devices including doped oxide film liners and methods of manufacturing the same
01/22/2009US20090020843 Bottom anode Schottky diode structure and method
01/22/2009US20090020841 Mesa-Type Photodetectors With Lateral Diffusion Junctions
01/22/2009US20090020838 Apparatus and method for reducing optical cross-talk in image sensors
01/22/2009US20090020837 Semiconductor device and manufacturing method thereof
01/22/2009US20090020835 Insulating film and electronic device