Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
01/2009
01/13/2009US7476564 Flip-chip packaging process using copper pillar as bump structure
01/13/2009US7476563 Method of packaging a device using a dielectric layer
01/13/2009US7476562 Gapless microlens array and method of fabrication
01/13/2009US7476561 Method of making microminiature moving device
01/13/2009US7476560 Photoelectric conversion device, and process for its fabrication
01/13/2009US7476559 Thin film pattern is formed forming a hexamethyl disilazane layer on the substrate, the thin film pattern includes a first domain area into which the functional liquid is infused and a second domain area on which the functional liquid infused into the first domain area flows
01/13/2009US7476558 Method for manufacturing selective area grown stacked-layer electro-absorption modulated laser structure
01/13/2009US7476557 Roll-to-roll fabricated light sheet and encapsulated semiconductor circuit devices
01/13/2009US7476556 Systems and methods for plasma processing of microfeature workpieces
01/13/2009US7476555 Method of chip manufacturing
01/13/2009US7476554 Substrate processing method
01/13/2009US7476552 Method of reworking a semiconductor structure
01/13/2009US7476488 Photosensitive composition and method for forming pattern using same
01/13/2009US7476487 Inorganic nanocrystals surface-coordinated with a compound containing a photosensitive carbon to carbon double bond functional group is used for photolithographic process to form a pattern; curable with a curing agents; photomasking; simple method; organic-inorganic hybrid electroluminescent devices
01/13/2009US7476485 Resist lower layer film material and method for forming a pattern
01/13/2009US7476473 Process control method, a method for forming monitor marks, a mask for process control, and a semiconductor device manufacturing method
01/13/2009US7476471 Based on extreme ultraviolet radiation energies; lithography; semiconductors
01/13/2009US7476470 Method for manufacturing thin film semiconductor device and method for forming resist pattern thereof
01/13/2009US7476454 controlled roughness; head flying stability ; high recording density
01/13/2009US7476413 Low magnetization materials for high performance magnetic memory devices
01/13/2009US7476412 Method for the metalization of an insulator and/or a dielectric
01/13/2009US7476341 Process for producing photo-conductor layers for constituting radiation imaging panels
01/13/2009US7476329 Methods for contacting conducting layers overlying magnetoelectronic elements of MRAM devices
01/13/2009US7476306 Method and apparatus for electroplating
01/13/2009US7476301 Procedure and device for the production of a plasma
01/13/2009US7476291 High chamber temperature process and chamber design for photo-resist stripping and post-metal etch passivation
01/13/2009US7476290 Substrate processing apparatus and substrate processing method
01/13/2009US7476073 Vacuum processing method
01/13/2009US7475803 Solder ball loading method and solder ball loading unit background of the invention
01/08/2009WO2009006263A2 Forming complimentary metal features using conformal insulator layer
01/08/2009WO2009006197A1 Method of forming a guard ring or contact to an soi substrate
01/08/2009WO2009006183A2 Diffusion control in heavily doped substrates
01/08/2009WO2009006182A1 Suppression of oxygen precipitation in heavily doped single crystal silicon substrates
01/08/2009WO2009006175A2 Test structure, test structure formation and mask reuse in semiconductor processing
01/08/2009WO2009006152A2 Method and apparatus for a voltage/current probe test arrangements
01/08/2009WO2009006151A2 Arrays of inductive elements for minimizing radial non-uniformity in plasma
01/08/2009WO2009006149A1 Distributed power arrangements for localizing power delivery
01/08/2009WO2009006147A2 Integrated steerability array arrangement for minimizing non-uniformity
01/08/2009WO2009006127A2 Method for forming a metal siliicide
01/08/2009WO2009006072A2 Methods and arrangements for plasma processing system with tunable capacitance
01/08/2009WO2009006062A1 Methods and apparatus for substrate processing
01/08/2009WO2009006038A1 Edge ring arrangements for substrate processing
01/08/2009WO2009005993A2 Method and apparatus for a highly collimated light collection arrangement
01/08/2009WO2009005991A1 Plasma processing with enhanced charge neutralization and process control
01/08/2009WO2009005959A1 Techniques for handling substrates
01/08/2009WO2009005921A2 Polyceramic e-chuck
01/08/2009WO2009005904A1 Method for forming a dual metal gate structure
01/08/2009WO2009005903A1 Method for forming a dual metal gate structure
01/08/2009WO2009005902A1 Method for forming gate structures
01/08/2009WO2009005863A2 Fabricating complex micro and nanoscale structures, electronic devices, and components
01/08/2009WO2009005862A2 Novel methods for making and using halosilylgermanes
01/08/2009WO2009005843A1 Carrier used for deposition of materials on a non-planar surface
01/08/2009WO2009005788A2 A technique for forminig an interlayer dielectric material of increased reliability above a structure including closely spaced lines
01/08/2009WO2009005787A1 Blocking pre-amorphization of a gate electrode of a transistor
01/08/2009WO2009005785A1 Reducing transistor junction capacitance by recessing drain and source regions
01/08/2009WO2009005751A1 Fabricating method for quantum dot of active layer of led by nano-lithography
01/08/2009WO2009005710A1 Fabricating method of nano-ring structure by nano-lithography
01/08/2009WO2009005699A1 Memory cell that employs a selectively grown reversible resistance-switching element and methods of forming the same
01/08/2009WO2009005624A2 Inductively coupled dual zone processing chamber with single planar antenna
01/08/2009WO2009005477A1 Separation of semiconductor devices
01/08/2009WO2009005462A1 Low resistance through-wafer via
01/08/2009WO2009005394A1 Device for measuring mechanical quantities (variants) and a method for the production thereof
01/08/2009WO2009005295A2 Nanostructure, a method for fabricating the same, and fed, blu and fe type lamp with the nanostructure
01/08/2009WO2009005257A2 Method for manufacturing led package
01/08/2009WO2009005222A1 Vision inspection system for semiconductor devices
01/08/2009WO2009005214A1 Probe assembly and manufacturing method thereof
01/08/2009WO2009005183A1 Batch type ashing apparatus using remote radical generator
01/08/2009WO2009005148A1 Surface treatment apparatus
01/08/2009WO2009005143A1 Polishing liquid for metal film and polishing method
01/08/2009WO2009005134A1 Diamond semiconductor device
01/08/2009WO2009005130A1 Adhesive composition, bonded member made with adhesive composition, support member for semiconductor mounting, semiconductor device, and processes for producing these
01/08/2009WO2009005126A1 Iii nitride semiconductor light emitting element, method for manufacturing the iii nitride semiconductor light emitting element, and lamp
01/08/2009WO2009005087A1 Quantitative evaluation device of atomic vacancies existing in silicon wafer, method for the device, silicon wafer manufacturing method, and thin-film oscillator
01/08/2009WO2009005065A1 Projection optical system
01/08/2009WO2009005027A1 Substrate transfer robot and vacuum processing apparatus provided with the same
01/08/2009WO2009005014A1 Resist stripping composition
01/08/2009WO2009004988A1 System for continuously using resist stripper liquid based on nanofiltration
01/08/2009WO2009004977A1 Substrate treatment apparatus, substrate treatment method and storage medium
01/08/2009WO2009004968A1 Testing apparatus
01/08/2009WO2009004964A1 Ultrasonic rinsing device, and ultrasonic rinsing method
01/08/2009WO2009004919A1 Semiconductor device and manufacturing method thereof
01/08/2009WO2009004906A1 Substrate treatment method, substrate treatment apparatus, reducing agent sheet, and computer-readable storage medium
01/08/2009WO2009004889A1 Thin film silicon wafer and its fabricating method
01/08/2009WO2009004883A1 Levitation transportation device
01/08/2009WO2009004882A1 Levitation device and levitation transportation device
01/08/2009WO2009004858A1 Levitation transportation device
01/08/2009WO2009004852A1 Method for removing foreign matter from glass substrate surface and method for processing glass substrate surface
01/08/2009WO2009004793A1 Semiconductor device, semiconductor device manufacturing method and image display device
01/08/2009WO2009004243A2 Assemblage of radiofrequency chips
01/08/2009WO2009004117A1 Method in depositing metal oxide materials
01/08/2009WO2009003972A1 A method for producing a copper contact
01/08/2009WO2009003896A1 Hybrid fully-silicided (fusi)/partially-silicided (pasi) structures
01/08/2009WO2009003895A1 Integrated fin-local interconnect structure
01/08/2009WO2009003646A2 Method and apparatus for drying a substrate surface
01/08/2009WO2009003565A1 Method for packing semiconductor components, and product produced according to the method
01/08/2009WO2009003435A1 Method for producing optoelectronic components, and optoelectronic component
01/08/2009WO2009003343A1 Methods and apparatus for cleaning semiconductor wafers
01/08/2009WO2008137738A3 Method of forming group iv semiconductor junctions using laser processing
01/08/2009WO2008133767A3 Polysilicon planarization solution for planarizing low temperature polysilicon thin film panels
01/08/2009WO2008132703A8 High-voltage metal-oxide semiconductor device and corresponding manufacturing method and implantation mask