| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/29/2009 | DE112007000751T5 Graben-Isolationsstruktur mit einem erweiterten Abschnitt Trench isolation structure with an expanded section |
| 01/29/2009 | DE112007000668T5 Gruppe-III-Nitrid-Leistungshalbleiter-Bauteil Group III-nitride power semiconductor component |
| 01/29/2009 | DE10351875B4 Integriertes Schaltkreisbauelement mit MIM-Kondensator Integrated circuit device with MIM capacitor |
| 01/29/2009 | DE10260615B4 Technik zum Verringern der Lackvergiftung bei der Herstellung einer Metallisierungsschicht mit einem Dielektrikum mit kleinem ε Technique for reducing the poisoning lacquer in the manufacture of a metallization layer with a dielectric with small ε |
| 01/29/2009 | DE10245770B4 Ausgangsschaltkreis Output circuit |
| 01/29/2009 | DE10237325B4 Gerät zur Belichtung eines Objektes mit Licht Apparatus for exposing an object with light |
| 01/29/2009 | DE102008033465A1 Halbleiterbaugruppe mit einem Gehäuse Semiconductor device having a housing |
| 01/29/2009 | DE102008029791A1 Verfahren zur Herstellung von Halbleiterbauelementen Process for the preparation of semiconductor devices |
| 01/29/2009 | DE102008029645A1 Halbleiter-Waferstruktur A semiconductor wafer structure |
| 01/29/2009 | DE102008028721A1 Flash-Speicher-Baustein und Verfahren zu seiner Herstellung Flash memory module and method for its preparation |
| 01/29/2009 | DE102007060238A1 Verfahren zum Herstellen einer Halbleitervorrichtung mit einer Gate-Stapelstruktur A method of manufacturing a semiconductor device having a gate stack structure |
| 01/29/2009 | DE102007035266A1 Verfahren zum Polieren eines Substrates aus Halbleitermaterial A method for polishing a substrate of semiconductor material |
| 01/29/2009 | DE102007035060A1 Connection for semiconductor component with carrier element, has holes arranged one above other in semiconductor component and carrier element, where hole of semiconductor component is conically formed |
| 01/29/2009 | DE102007033810A1 Test structure e.g. MOSFET, for use in semiconductor device, has structure element e.g. isolation layer, positioned in structure with respect to another structure element such that changing of electric characteristics is effected |
| 01/29/2009 | DE102007033449A1 Semiconductor wafer for use as donor wafer, has layer structure that stands under course or compression stress and another layer structure compensates tension with compression stress or tensile stress |
| 01/29/2009 | DE102007010882B4 Verfahren zur Herstellung einer Lötverbindung zwischen einem Halbleiterchip und einem Substrat A process for producing a solder connection between a semiconductor chip and a substrate |
| 01/29/2009 | DE102007007140B4 Verfahren und Anordnung zur Detektion mechanischer Defekte eines Halbleiter-Bauelements, insbesondere einer Solarzelle oder Solarzellen-Anordnung Method and apparatus for detecting mechanical defects of a semiconductor device, particularly a solar cell or solar panel |
| 01/29/2009 | DE102004063560B4 Kapazitive Struktur und Verfahren zur Herstellung einer kapazitiven Struktur Capacitive structure and method of manufacturing a capacitive structure |
| 01/29/2009 | DE102004059350B4 Nichtflüchtiges Halbleiterspeicherbauelement The non-volatile semiconductor memory device |
| 01/29/2009 | DE102004055649B4 Verfahren zum Herstellen eines Isolationsgrabens in einer Halbleiterstruktur A method for producing an isolation trench in a semiconductor structure |
| 01/29/2009 | DE102004043084B4 Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips Apparatus and method for the assembly or wiring of semiconductor chips |
| 01/29/2009 | DE102004031453B4 Verfahren zur Erzeugung eines Dielektrikums und Halbleiterstruktur A method for producing a dielectric and semiconductor structure |
| 01/29/2009 | DE102004026002B4 Halbleiterbauelement mit Festkörperelektrolytspeicherzellen und Herstellungsverfahren A semiconductor device having solid electrolyte memory cells and manufacturing processes |
| 01/29/2009 | DE102004003863B4 Technik zur Herstellung eingebetteter Metallleitungen mit einer erhöhten Widerstandsfähigkeit gegen durch Belastung hervorgerufenen Materialtransport Technology for the production of embedded metal lines with increased resistance caused by load material handling |
| 01/29/2009 | DE10146013B4 Halbleitervorrichtungsherstellungsverfahren The semiconductor device manufacturing method |
| 01/29/2009 | DE10117880B4 Verfahren zum Vereinzeln von elektronischen Bauteilen aus einem Verbund A method of separating electronic components from a composite |
| 01/29/2009 | DE10042839B4 Elektronisches Bauteil mit Wärmesenke und Verfahren zu seiner Herstellung Electronic component having heat sink and method for its preparation |
| 01/29/2009 | DE10031624B4 Verfahren zur Herstellung eines Transistors mit erhöhten Source- und Drain-Bereichen A method of manufacturing a transistor with raised source and drain regions |
| 01/28/2009 | EP2019576A2 Apparatus and method of mounting conductive ball |
| 01/28/2009 | EP2019575A2 Conductor ball mounting apparatus, conductor ball mounting method, mask used for mounting conductor ball, and mask manufacturing method |
| 01/28/2009 | EP2019437A1 Iii nitride compound semiconductor laminated structure |
| 01/28/2009 | EP2019430A1 Semiconductor non volatile memory device and method of producing the same |
| 01/28/2009 | EP2019424A2 High performance semiconductor module with sealant device on substrate carrier and corresponding production method |
| 01/28/2009 | EP2019423A2 Standardized power packages independent of the assembly of components |
| 01/28/2009 | EP2019422A2 Apparatus and method for arranging magnetic solder balls |
| 01/28/2009 | EP2019421A2 Power semiconductor device with metal contact layer and corresponding production method |
| 01/28/2009 | EP2019420A1 Device for texturising surfaces of silicon discs and uses of this device |
| 01/28/2009 | EP2019419A1 Method for producing polishing composition |
| 01/28/2009 | EP2019418A2 Method and structure using selected implant angles for manufacturing free standing films of materials |
| 01/28/2009 | EP2019417A1 System for transporting substrate carriers |
| 01/28/2009 | EP2019387A1 Pattern forming method |
| 01/28/2009 | EP2019155A2 Gallium nitride substrate and gallium nitride film deposition method |
| 01/28/2009 | EP2019154A1 Electrolytic copper plating method, phosphorous copper anode for electrolytic copper plating method, and semiconductor wafer having low particle adhesion plated with said method and anode |
| 01/28/2009 | EP2018676A1 Method for production of a multi-layered object |
| 01/28/2009 | EP2018664A1 Electrically conducting connection with insulating connection medium |
| 01/28/2009 | EP2018663A1 Semiconductor devices including self aligned refractory contacts and methods of fabricating the same |
| 01/28/2009 | EP2018662A2 Power mosfet contact metallization |
| 01/28/2009 | EP2018661A1 Pitch reduction |
| 01/28/2009 | EP2018660A2 Electric device comprising an improved electrode |
| 01/28/2009 | EP2018659A1 Device and method for wet treating plate-like substrates |
| 01/28/2009 | EP1927128A4 Multiple low and high k gate oxides on single gate for lower miller capacitance and improved drive current |
| 01/28/2009 | EP1735476A4 Textured-grain-powder metallurgy tantalum sputter target |
| 01/28/2009 | EP1593162A4 Semiconductor device, production method thereof and light-emitting device |
| 01/28/2009 | EP1317775A4 Materials having low dielectric constants and methods of making |
| 01/28/2009 | EP1212150B1 Lactam compositions for cleaning organic and plasma etched residues for semiconductor devices |
| 01/28/2009 | EP1008177B1 Improved active matrix esd protection and testing scheme |
| 01/28/2009 | CN201188464Y Connecting apparatus for producing process chamber |
| 01/28/2009 | CN201188428Y Slant stop and categorization apparatus for solar silicium chip detection platform |
| 01/28/2009 | CN201188427Y Guiding machine for solar silicium chip detection panel conveying device and the conveying device |
| 01/28/2009 | CN201188417Y Slice-bearing platform for chips |
| 01/28/2009 | CN201188416Y Crystal round case |
| 01/28/2009 | CN201188415Y Binding equipment capable of improving identification precision |
| 01/28/2009 | CN201188414Y Window for monitoring gas reaction chamber |
| 01/28/2009 | CN201186404Y Simple polisher station |
| 01/28/2009 | CN201186403Y Adjusting ring capable of improving short finish of edge |
| 01/28/2009 | CN101356866A Method and apparatus for mounting solder ball |
| 01/28/2009 | CN101356699A Monitoring photodetector for integrated photonic devices |
| 01/28/2009 | CN101356653A Photo field effect transistor and integrated photo detector using the same |
| 01/28/2009 | CN101356651A Laminated structure, electronic element using the same, manufacturing method thereof, electronic element array, and display unit |
| 01/28/2009 | CN101356650A Semiconductor device and display device |
| 01/28/2009 | CN101356649A Environmentally robust passivation structures for high-voltage silicon carbide semiconductor devices |
| 01/28/2009 | CN101356643A 半导体器件 Semiconductor devices |
| 01/28/2009 | CN101356642A Printed-circuit board, and method for manufacturing the same |
| 01/28/2009 | CN101356639A Semiconductor device and process for producing the same |
| 01/28/2009 | CN101356638A Semiconductor device and method for manufacturing semiconductor device |
| 01/28/2009 | CN101356637A Producing a covered through substrate via using a temporary cap layer |
| 01/28/2009 | CN101356636A Reduced capacity carrier, transport, load port, buffer system |
| 01/28/2009 | CN101356635A Apparatus and method for measuring semiconductor |
| 01/28/2009 | CN101356634A Method for forming solder contacts on mounted substrates |
| 01/28/2009 | CN101356633A Methods of packaging a semiconductor die and package formed by the methods |
| 01/28/2009 | CN101356632A Method for manufacturing semiconductor device |
| 01/28/2009 | CN101356631A Film position adjusting method, memory medium and substrate processing system |
| 01/28/2009 | CN101356630A Processing apparatus |
| 01/28/2009 | CN101356629A Composition and method for recycling semiconductor wafers having low-K dielectric materials thereon |
| 01/28/2009 | CN101356628A High throughput chemical mechanical polishing composition for metal film planarization |
| 01/28/2009 | CN101356627A Enhanced multi-volatile memory device with resonant tunnel barrier |
| 01/28/2009 | CN101356626A Metal film decarbonizing method, film forming method and semiconductor device manufacturing method |
| 01/28/2009 | CN101356625A Plasma doping method and apparatus |
| 01/28/2009 | CN101356624A Laser annealing method and laser annealing apparatus |
| 01/28/2009 | CN101356623A Moving body drive method, moving body drive system, pattern formation method, pattern formation device, exposure method, exposure device, and device fabrication method |
| 01/28/2009 | CN101356622A Method for producing bonded wafer |
| 01/28/2009 | CN101356621A Ball grid attachment |
| 01/28/2009 | CN101356620A Positive displacement pumping chamber |
| 01/28/2009 | CN101356557A Active matrix substrate, display device and television receiver |
| 01/28/2009 | CN101356516A Semiconductor integrated circuit, system device including semiconductor integrated circuit, and semiconductor integrated circuit control method |
| 01/28/2009 | CN101356481A Pressure regulation in remote zones |
| 01/28/2009 | CN101356303A Method of forming a recessed structure employing a reverse tone process |
| 01/28/2009 | CN101356297A Spattering device and film forming method |
| 01/28/2009 | CN101356181A Organic ruthenium compound for chemical vapor deposition, and chemical vapor deposition method using the organic ruthenium compound |
| 01/28/2009 | CN101356017A Dust remover |