| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 01/29/2009 | US20090029497 Semiconductor light-emitting device and method of fabricating the same |
| 01/29/2009 | US20090029496 Radiation-emitting semiconductor body for a vertically emitting laser and method for producing same |
| 01/29/2009 | US20090029493 Methods of Forming Light Emitting Devices with Active Layers that Extend Into Opened Pits |
| 01/29/2009 | US20090029492 Method of making light emitting diode |
| 01/29/2009 | US20090029491 Method of inspecting defect of semiconductor device |
| 01/29/2009 | US20090029490 Method of fabricating an electronic device |
| 01/29/2009 | US20090029489 Endpoint Detection Device For Realizing Real-Time Control Of Plasma Reactor, Plasma Reactor With Endpoint Detection Device, And Endpoint Detection Method |
| 01/29/2009 | US20090029488 Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor |
| 01/29/2009 | US20090029487 Semiconductor production method and semiconductor production device |
| 01/29/2009 | US20090029486 Substrate Processing Apparatus and Substrate Processing Method |
| 01/29/2009 | US20090029485 Manufacturing method of semiconductor device |
| 01/29/2009 | US20090029471 Microelectromechanical devices useful for manipulating cells or embryos, kits thereof, methods of making same, and methods of use thereof |
| 01/29/2009 | US20090029353 Molecular detector |
| 01/29/2009 | US20090029308 Heat shield plate for substrate annealing apparatus |
| 01/29/2009 | US20090029297 Method of forming fine patterns |
| 01/29/2009 | US20090029271 Container for housing a mask blank, method of housing a mask blank, and mask blank package |
| 01/29/2009 | US20090029269 Lithographic pellicle |
| 01/29/2009 | US20090029267 Photomask layout pattern |
| 01/29/2009 | US20090028910 Methods for Fabrication Isolated Micro-and Nano-Structures Using Soft or Imprint Lithography |
| 01/29/2009 | US20090028745 Ruthenium precursor with two differing ligands for use in semiconductor applications |
| 01/29/2009 | US20090028683 Substrate processing apparatus and method |
| 01/29/2009 | US20090028673 Direct tool loading |
| 01/29/2009 | US20090028672 Substrate transfer module and substrate processing system |
| 01/29/2009 | US20090028671 In-line system and method for manufacturing a semiconductor package |
| 01/29/2009 | US20090028670 Selectively rigidizable and actively steerable articulatable device |
| 01/29/2009 | US20090028493 Plasmon-enhanced electromagnetic-radiation-emitting devices and methods for fabricating the same |
| 01/29/2009 | US20090028202 Nitride light emitting device and manufacturing method thereof |
| 01/29/2009 | US20090027964 Semiconductor memory device having plural word lines arranged at narrow pitch and manufacturing method thereof |
| 01/29/2009 | US20090027955 Non-volatile memory devices including stacked nand-type resistive memory cell strings and methods of fabricating the same |
| 01/29/2009 | US20090027944 Increased Switching Cycle Resistive Memory Element |
| 01/29/2009 | US20090027938 Method and apparatus providing multi-planed array memory device |
| 01/29/2009 | US20090027882 Backlight Assembly, Method of Manufacturing the Same and Display Device Having the Same |
| 01/29/2009 | US20090027866 Semiconductor die package with internal bypass capacitors |
| 01/29/2009 | US20090027863 Method for making a semiconductor multipackage module including a processor and memory package assemblies |
| 01/29/2009 | US20090027822 Transient blocking unit having a fab-adjustable threshold current |
| 01/29/2009 | US20090027820 Semiconductor Integrated Circuit Device |
| 01/29/2009 | US20090027664 Defect inspection apparatus and its method |
| 01/29/2009 | US20090027328 Active matrix devices |
| 01/29/2009 | US20090027097 Semiconductor integrated circuit device |
| 01/29/2009 | US20090027076 Device and method for testing integrated circuit dice in an integrated circuit module |
| 01/29/2009 | US20090027074 Test structure and test method |
| 01/29/2009 | US20090026970 Method of Manufacturing Thin Film Transistor |
| 01/29/2009 | US20090026946 Display Device and Method of Manufacturing the Same |
| 01/29/2009 | US20090026676 Non-Contact Type Suction Holding Apparatus |
| 01/29/2009 | US20090026656 Vented mold for encapsulating semiconductor components |
| 01/29/2009 | US20090026636 Semiconductor device and method of manufacturing same |
| 01/29/2009 | US20090026635 Semiconductor device and manufacturing method thereof |
| 01/29/2009 | US20090026634 Electronic part mounting structure and its manufacturing method |
| 01/29/2009 | US20090026633 Flip chip package structure and method for manufacturing the same |
| 01/29/2009 | US20090026632 Chip-to-chip package and process thereof |
| 01/29/2009 | US20090026630 Semiconductor device and method for manufacturing same |
| 01/29/2009 | US20090026629 Semiconductor package having a stacked wafer level package and method for fabricating the same |
| 01/29/2009 | US20090026628 Electrical connections for multichip modules |
| 01/29/2009 | US20090026627 Support Structures for On-Wafer Testing of Wafer-Level Packages and Multiple Wafer Stacked Structures |
| 01/29/2009 | US20090026626 Method for fabricating semiconductor device and semiconductor device |
| 01/29/2009 | US20090026624 Semiconductor device and method for manufacturing metal line thereof |
| 01/29/2009 | US20090026623 Buried metal-semiconductor alloy layers and structures and methods for fabrication thereof |
| 01/29/2009 | US20090026622 Semiconductor Device and Method for Manufacturing Same |
| 01/29/2009 | US20090026621 Bond pad stacks for ESD under pad and active under pad bonding |
| 01/29/2009 | US20090026620 Method for cutting multilayer substrate, method for manufacturing semiconductor device, semiconductor device, light emitting device, and backlight device |
| 01/29/2009 | US20090026618 Semiconductor device including interlayer interconnecting structures and methods of forming the same |
| 01/29/2009 | US20090026617 Semiconductor device having a copper metal line and method of forming the same |
| 01/29/2009 | US20090026616 Integrated circuit having a semiconductor substrate with a barrier layer |
| 01/29/2009 | US20090026615 Semiconductor device having external connection terminals and method of manufacturing the same |
| 01/29/2009 | US20090026614 System in package and method for fabricating the same |
| 01/29/2009 | US20090026613 Semiconductor package and method for manufacturing the same |
| 01/29/2009 | US20090026612 Semiconductor package having an improved connection structure and method for manufacturing the same |
| 01/29/2009 | US20090026611 Electronic assembly having a multilayer adhesive structure |
| 01/29/2009 | US20090026610 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026609 Semiconductor device and method for manufacturing the same |
| 01/29/2009 | US20090026608 Crosstalk-Free WLCSP Structure for High Frequency Application |
| 01/29/2009 | US20090026607 Electronic Device and Method of Manufacturing Same |
| 01/29/2009 | US20090026606 Semiconductor Device and Method for Manufacturing the Same |
| 01/29/2009 | US20090026605 Heat Extraction from Packaged Semiconductor Chips, Scalable with Chip Area |
| 01/29/2009 | US20090026604 Semiconductor plastic package and fabricating method thereof |
| 01/29/2009 | US20090026603 Electronic component package and method of manufacturing same |
| 01/29/2009 | US20090026602 Method For Manufacturing And Making Planar Contact With An Electronic Apparatus, And Correspondingly Manufactured Apparatus |
| 01/29/2009 | US20090026601 Semiconductor module |
| 01/29/2009 | US20090026600 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods |
| 01/29/2009 | US20090026598 Wafer Level Packaging Integrated Hydrogen Getter |
| 01/29/2009 | US20090026594 Thin Plastic Leadless Package with Exposed Metal Die Paddle |
| 01/29/2009 | US20090026593 Thin semiconductor die packages and associated systems and methods |
| 01/29/2009 | US20090026592 Semiconductor dies with recesses, associated leadframes, and associated systems and methods |
| 01/29/2009 | US20090026591 Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same |
| 01/29/2009 | US20090026589 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026588 Plasma processing method for forming a film and an electronic component manufactured by the method |
| 01/29/2009 | US20090026587 Gradient deposition of low-k cvd materials |
| 01/29/2009 | US20090026586 Superjunction Device Having Oxide Lined Trenches and Method for Manufacturing a Superjunction Device Having Oxide Lined Trenches |
| 01/29/2009 | US20090026584 Method for manufacturing semiconductor device |
| 01/29/2009 | US20090026583 Method of Producing 3-D Mold, Method of Producing Finely Processed Product, Method of Producing Fine-Pattern Molded Product, 3-D Mold, Finely Processed Product, Fine-Pattern Molded Product and Optical Component |
| 01/29/2009 | US20090026581 Flash memory device and method of manufacturing the same |
| 01/29/2009 | US20090026580 Semiconductor Device and Manufacturing Method |
| 01/29/2009 | US20090026579 Em rectifying antenna suitable for use in conjunction with a natural breakdown device |
| 01/29/2009 | US20090026578 Vertical NPN Transistor Fabricated in a CMOS Process With Improved Electrical Characteristics |
| 01/29/2009 | US20090026576 Anti-fuse |
| 01/29/2009 | US20090026575 Semiconductor device and method of manufacturing the same |
| 01/29/2009 | US20090026574 Electrical fuse having sublithographic cavities thereupon |
| 01/29/2009 | US20090026573 Semiconductor memory device and method for manufacturing the same |
| 01/29/2009 | US20090026572 Method of Manufacturing a Semiconductor Device, Method of Manufacturing a SOI Device, Semiconductor Device, and SOI Device |
| 01/29/2009 | US20090026570 Methods and structures for discharging plasma formed during the fabrication of semiconuctor device |