Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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04/23/2009 | US20090104779 Method of producing phase change memory device |
04/23/2009 | US20090104778 Polishing Composition for CMP and device wafer producing method using the same |
04/23/2009 | US20090104777 Methods of depositing a ruthenium film |
04/23/2009 | US20090104776 Methods for forming nested and isolated lines in semiconductor devices |
04/23/2009 | US20090104775 Method for Forming Tantalum Nitride Film |
04/23/2009 | US20090104774 Method of manufacturing a semiconductor device |
04/23/2009 | US20090104773 Method of forming contact |
04/23/2009 | US20090104772 Process of fabricating circuit structure |
04/23/2009 | US20090104771 Method for making a self-converged void and bottom electrode for memory cell |
04/23/2009 | US20090104770 Method for depinning the fermi level of a semiconductor at an electrical junction and devices incorporating such junctions |
04/23/2009 | US20090104769 Semiconductor chip with coil element over passivation layer |
04/23/2009 | US20090104768 Method for forming metal line in semiconductor device |
04/23/2009 | US20090104767 Methods for fabricating residue-free contact openings |
04/23/2009 | US20090104766 Method of Forming Micro Metal Bump |
04/23/2009 | US20090104765 Semiconductor device having diffusion layers as bit lines and method for manufacturing the same |
04/23/2009 | US20090104764 Methods and Systems for Forming at Least One Dielectric Layer |
04/23/2009 | US20090104763 Method of fabricating flash memory device |
04/23/2009 | US20090104762 Semiconductor device and method for fabricating the same |
04/23/2009 | US20090104761 Plasma Doping System With Charge Control |
04/23/2009 | US20090104760 Vertical cvd appparatus for forming silicon-germanium film |
04/23/2009 | US20090104759 Methods of manufacturing semiconductor devices including a doped silicon layer |
04/23/2009 | US20090104758 Gallium nitride materials and methods |
04/23/2009 | US20090104757 Method for producing group III nitride-based compound semiconductor |
04/23/2009 | US20090104756 Method to form a rewriteable memory cell comprising a diode and a resistivity-switching grown oxide |
04/23/2009 | US20090104755 High quality silicon oxide films by remote plasma cvd from disilane precursors |
04/23/2009 | US20090104754 Method to improve electrical leakage performance and to minimize electromigration in semiconductor devices |
04/23/2009 | US20090104753 Process of Forming a Curved Profile on a Semiconductor Substrate |
04/23/2009 | US20090104752 Method for Producing Soi Wafer |
04/23/2009 | US20090104751 Narrow semiconductor trench structure |
04/23/2009 | US20090104750 Method for manufacturing semiconductor substrate, display panel, and display device |
04/23/2009 | US20090104749 Methods of Manufacturing Semiconductor Devices Having Contact Plugs in Insulation Layers |
04/23/2009 | US20090104748 Method for fabricating self-aligned recess gate trench |
04/23/2009 | US20090104747 Method for fabricating deep trench dram array |
04/23/2009 | US20090104746 Channel strain induced by strained metal in fet source or drain |
04/23/2009 | US20090104745 Integration method for dual doped polysilicon gate profile and cd control |
04/23/2009 | US20090104744 Vertical gated access transistor |
04/23/2009 | US20090104743 Nitrogen Profile in High-K Dielectrics Using Ultrathin Disposable Capping Layers |
04/23/2009 | US20090104742 Methods for forming gate electrodes for integrated circuits |
04/23/2009 | US20090104741 Methods of fabricating semiconductor devices using a plasma process with non-silane gas including deuterium |
04/23/2009 | US20090104740 Semiconductor device producing method |
04/23/2009 | US20090104739 Method of forming conformal silicon layer for recessed source-drain |
04/23/2009 | US20090104738 Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits |
04/23/2009 | US20090104737 Method for manufacturing tft substrate |
04/23/2009 | US20090104736 Stacked Packaging Improvements |
04/23/2009 | US20090104735 Semiconductor package having increased resistance to electrostatic discharge |
04/23/2009 | US20090104734 Power semiconductor module method |
04/23/2009 | US20090104731 Semiconductor device and manufacturing method thereof |
04/23/2009 | US20090104729 Solid-state image sensor and imaging system |
04/23/2009 | US20090104728 Gallium Nitride-Based Compound Semiconductor Multilayer Structure and Production Method Thereof |
04/23/2009 | US20090104727 High power semiconductor laser diodes |
04/23/2009 | US20090104726 LED Fabrication Via Ion Implant Isolation |
04/23/2009 | US20090104725 Liquid crystal display device and method for manufacturing the same |
04/23/2009 | US20090104723 Method for manufacturing display device |
04/23/2009 | US20090104722 Method for manufacturing pixel structure |
04/23/2009 | US20090104721 Deposition Method and Method for Manufacturing Light Emitting Device |
04/23/2009 | US20090104720 Photoresist Coating Apparatus Having Nozzle Monitoring Unit and Method for Supplying Photoresist Using the Same |
04/23/2009 | US20090104719 Plasma Doping System with In-Situ Chamber Condition Monitoring |
04/23/2009 | US20090104718 Method of magnetic tunneling layer processes for spin-transfer torque MRAM |
04/23/2009 | US20090104549 Method for error reduction in lithography |
04/23/2009 | US20090104548 Substrate-processing apparatus, substrate-processing method, substrate-processing program, and computer-readable recording medium recorded with such program |
04/23/2009 | US20090104547 Image sensor |
04/23/2009 | US20090104540 Graded lithographic mask |
04/23/2009 | US20090104457 Conductive compositions and processes for use in the manufacture of semiconductor devices: flux materials |
04/23/2009 | US20090104415 Element with Optical Marking, Manufacturing Method, and Use |
04/23/2009 | US20090104376 Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition |
04/23/2009 | US20090104014 Carrier frame for electronic components and production method for electronic components |
04/23/2009 | US20090104006 Storage, storage set and transporting system |
04/23/2009 | US20090103583 Surface emitting laser and manufacturing method thereof |
04/23/2009 | US20090103582 Optical waveguide device and manufacturing method thereof |
04/23/2009 | US20090103389 Semiconductor memory device and method of providing product families of the same |
04/23/2009 | US20090103363 Apparatus and associated method for making a virtual ground array structure that uses inversion bit lines |
04/23/2009 | US20090103353 Semiconductor memory device |
04/23/2009 | US20090103350 Method of Testing an Integrated Circuit, Method of Manufacturing an Integrated Circuit, and Integrated Circuit |
04/23/2009 | US20090103292 Image display unit |
04/23/2009 | US20090103284 Polymer Composition And Polymer Light-Emitting Device Using Same |
04/23/2009 | US20090103232 Substrate Holding System and Exposure Apparatus Using the Same |
04/23/2009 | US20090103078 Surface inspection apparatus and method thereof |
04/23/2009 | US20090103070 Optical element and exposure apparatus |
04/23/2009 | US20090103061 Reticle Protection Member, Reticle Carrying Device, Exposure Device and Method for Carrying Reticle |
04/23/2009 | US20090102995 Electrostatic discharge protection circuit, manufacturing method thereof and liquid crystal display device having the same |
04/23/2009 | US20090102895 Piezoelectric inkjet printhead and method of manufacturing the same |
04/23/2009 | US20090102582 Resonator device with shorted stub and mim-capacitor |
04/23/2009 | US20090102415 Suitcase power system |
04/23/2009 | US20090102071 Semiconductor substrate and method for manufacturing semiconductor device |
04/23/2009 | US20090102070 Alignment Marks on the Edge of Wafers and Methods for Same |
04/23/2009 | US20090102069 Integrated circuit system with assist feature |
04/23/2009 | US20090102068 System and method to manufacture an implantable electrode |
04/23/2009 | US20090102067 Electrically enhanced wirebond package |
04/23/2009 | US20090102066 Chip package structure and method of manufacturing the same |
04/23/2009 | US20090102065 Bonding pad for anti-peeling property and method for fabricating the same |
04/23/2009 | US20090102064 Connection structure and method of producing the same |
04/23/2009 | US20090102063 Semiconductor package and method for fabricating the same |
04/23/2009 | US20090102062 Wiring substrate and method of manufacturing the same, and semiconductor device |
04/23/2009 | US20090102060 Wafer Level Stacked Die Packaging |
04/23/2009 | US20090102058 Method for forming a plug structure and related plug structure thereof |
04/23/2009 | US20090102056 Patterned Leads For WLCSP And Method For Fabricating The Same |
04/23/2009 | US20090102054 Semiconductor package |
04/23/2009 | US20090102053 Metal line stacking structure in semiconductor device and formation method thereof |
04/23/2009 | US20090102052 Semiconductor Device and Fabricating Method Thereof |
04/23/2009 | US20090102048 Electronic device and manufacturing method thereof |