| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 04/29/2009 | CN100483693C Semiconductor package and method for manufacturing the same |
| 04/29/2009 | CN100483691C Flash memory device and a method of fabricating the same |
| 04/29/2009 | CN100483690C Method for mfg. double layer polysilicon rewritable non-volatile memory |
| 04/29/2009 | CN100483689C Method for preparing capacitor structure of semiconductor storage |
| 04/29/2009 | CN100483688C Method for making flash memory |
| 04/29/2009 | CN100483687C Metal gate transistor for cmos process and method for making |
| 04/29/2009 | CN100483686C Double-extension manufacturing technique for double-pole suspending PNP pipe adopting phosphorus-buried technology |
| 04/29/2009 | CN100483685C Method for manufacturing of cmos image sensor |
| 04/29/2009 | CN100483684C Method for manufacturing semiconductor device having metal silicide layer |
| 04/29/2009 | CN100483683C CMOS image sensor and manufacturing method thereof |
| 04/29/2009 | CN100483682C Making and detection method of silicon base LCD chip base plate |
| 04/29/2009 | CN100483681C Method for transmitting data in data processing and virtual integrated circuit manufacturing environment |
| 04/29/2009 | CN100483680C Method for fabricating capacitor in semiconductor device |
| 04/29/2009 | CN100483679C Method of reducing serial resistance between inductance in chip and antenna in chip |
| 04/29/2009 | CN100483678C Semiconductor structure and method of forming the same |
| 04/29/2009 | CN100483677C Method for preparing integrated circuit copper interconnecting line and barrier layer with ultrasonic chemistry |
| 04/29/2009 | CN100483676C Production method of metal wiring structure |
| 04/29/2009 | CN100483675C Method for forming double mosaic structure |
| 04/29/2009 | CN100483674C Method for manufacturing inlaid structure |
| 04/29/2009 | CN100483673C Forming method for contact hole |
| 04/29/2009 | CN100483672C Fabrication method |
| 04/29/2009 | CN100483671C Methods for forming semiconductor structures with buried isolation collars and semiconductor structures formed by these methods |
| 04/29/2009 | CN100483670C Method for forming isolation structure of shallow plough groove |
| 04/29/2009 | CN100483669C Method for manufacturing isolation structure of shallow plough groove |
| 04/29/2009 | CN100483668C Forming method of shallow plow groove isolation structure |
| 04/29/2009 | CN100483667C Method for forming shallow groove separation structure and shallow groove separation structure |
| 04/29/2009 | CN100483666C Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer |
| 04/29/2009 | CN100483665C Semiconductor isolating structure and its forming method |
| 04/29/2009 | CN100483664C Tcp handler, and method of detecting defective punching hole therefor |
| 04/29/2009 | CN100483663C A method for making CDSEM calibration sample |
| 04/29/2009 | CN100483662C Implementation method for 3D integrated circuit |
| 04/29/2009 | CN100483661C Package method for preventing chip interference and its package structure |
| 04/29/2009 | CN100483660C Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device |
| 04/29/2009 | CN100483659C Manufacturing method for packaging structure |
| 04/29/2009 | CN100483658C Mold compound cap in a flip chip multi-matrix array package and process of making same |
| 04/29/2009 | CN100483657C Resin molding machine |
| 04/29/2009 | CN100483656C Tape feeding apparatus for molding system and method having the same |
| 04/29/2009 | CN100483655C Producing process for digital camera module |
| 04/29/2009 | CN100483654C Preparation method of high-thermal conductivity electronic packaging shell with laser welding capacity |
| 04/29/2009 | CN100483653C Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias |
| 04/29/2009 | CN100483652C Groove power semiconductor device and its making method |
| 04/29/2009 | CN100483651C Process for fabricating semiconductor device |
| 04/29/2009 | CN100483650C Method for restraining edge breakdown of avalanche photodiode |
| 04/29/2009 | CN100483649C Method for the creation of an integrated electronic circuit and integrated electronic circuit thus obtained |
| 04/29/2009 | CN100483648C Semiconductor device and producing method and electroplating liquid |
| 04/29/2009 | CN100483647C Method for depositing porous films |
| 04/29/2009 | CN100483646C High-throughput HDP-CVD processes for advanced gapfill applications |
| 04/29/2009 | CN100483645C Plasma treatment to improve adhesion of low k dielectrics |
| 04/29/2009 | CN100483644C Semiconductor device and manufacturing method thereof |
| 04/29/2009 | CN100483643C A new method for making low dielectric constant layer and its application |
| 04/29/2009 | CN100483642C Manufacturing method for display device |
| 04/29/2009 | CN100483641C Fine processing treatment agent and fine processing treatment method using same |
| 04/29/2009 | CN100483640C Releasing method and releasing apparatus of work having adhesive tape |
| 04/29/2009 | CN100483639C Method for manufacturing integrated circuit |
| 04/29/2009 | CN100483638C Method of forming bank, method of forming film pattern, device, and electronic apparatus |
| 04/29/2009 | CN100483637C Method of forming a metal layer using an intermittent precursor gas flow process |
| 04/29/2009 | CN100483636C Atomic layer deposition methods |
| 04/29/2009 | CN100483635C Semiconductor device grid preparation method and semiconductor device |
| 04/29/2009 | CN100483634C Semiconductor device grids preparation method and semiconductor device |
| 04/29/2009 | CN100483633C Fabricating method for semiconductor device |
| 04/29/2009 | CN100483632C Method of manufacturing semiconductor device |
| 04/29/2009 | CN100483631C Localized annealing of metal-silicon carbide ohmic contacts and devices so formed |
| 04/29/2009 | CN100483630C Multiple mask and method for producing differently doped regions |
| 04/29/2009 | CN100483629C Semiconductor device and method of manufacturing the same |
| 04/29/2009 | CN100483628C Fabrication of crystalline materials over substrates |
| 04/29/2009 | CN100483627C Gan substrate and method of fabricating the same, nitride semiconductor device and method of fabricating the same |
| 04/29/2009 | CN100483626C P type doping method for cubic boron nitride thin film |
| 04/29/2009 | CN100483625C Exposure apparatus, exposure method and device manufacturing method |
| 04/29/2009 | CN100483624C Coater/developer and coating/developing method |
| 04/29/2009 | CN100483623C Multilayer semiconductor integrated circuit, light shield used therefor and manufacturing method thereof |
| 04/29/2009 | CN100483622C Method for controlling tantalumoxide embedded film resistor precision for anode oxidation process |
| 04/29/2009 | CN100483621C Substrate processing apparatus and substrate processing method |
| 04/29/2009 | CN100483620C Plasma processing device |
| 04/29/2009 | CN100483619C Transfer substrate, transfer method, and organic electroluminescent device manufacturing method |
| 04/29/2009 | CN100483618C Base plate processing device |
| 04/29/2009 | CN100483617C Base plate processing device and base plate processing method |
| 04/29/2009 | CN100483616C Forming method for thin film coated layer |
| 04/29/2009 | CN100483615C Substrate processing device and substrate processing system |
| 04/29/2009 | CN100483614C Apparatus for manufacturing substrate |
| 04/29/2009 | CN100483613C Quantum point making method |
| 04/29/2009 | CN100483612C Method of fabricating vertical structure compound semiconductor devices |
| 04/29/2009 | CN100483611C Device and method for applying semiconductor chips to carriers |
| 04/29/2009 | CN100483610C Conductive etch stop for etching a sacrificial layer |
| 04/29/2009 | CN100483609C Method of manufacturing an active matrix substrate and an image display device using the same |
| 04/29/2009 | CN100483566C Ferroelectric film, semiconductor device, ferroelectric film manufacturing method, and ferroelectric film manufacturing apparatus |
| 04/29/2009 | CN100483558C Memory independent on testing group function and system for replacing fault stored word |
| 04/29/2009 | CN100483544C Magnetic random access memory having a vertical write line |
| 04/29/2009 | CN100483542C Nonvolatile memory cell and non-volatile semiconductor memory device |
| 04/29/2009 | CN100483487C Image display apparatus using thin-film transistors |
| 04/29/2009 | CN100483334C Method for executing model-based optical proximity correction |
| 04/29/2009 | CN100483261C Method of forming photoresist pattern |
| 04/29/2009 | CN100483258C Exposure pattern forming method |
| 04/29/2009 | CN100483257C Method and system for imaging interference photoetching adopting white laser |
| 04/29/2009 | CN100483254C Method for correcting exposure metering device by exposure critical energy value |
| 04/29/2009 | CN100483251C Optical component keeper of exposure equipment |
| 04/29/2009 | CN100483240C Process for manufacturing pixel structure of liquid crystal display |
| 04/29/2009 | CN100483238C Manufacturing method for reflection mirror of silicon-based LCD device |
| 04/29/2009 | CN100483237C Array substrate for ips-mode LCD device and method of fabricating the same |
| 04/29/2009 | CN100483233C Pixel structure of panel display device and method for fabricating same |
| 04/29/2009 | CN100483232C TFT LCD array substrate structure and its production method |