Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
04/2009
04/30/2009US20090108339 High voltage tmos semiconductor device with low gate charge structure and method of making
04/30/2009US20090108338 Trench MOSFET with implanted drift region
04/30/2009US20090108337 Method of and circuit for protecting a transistor formed on a die
04/30/2009US20090108336 Method for adjusting the height of a gate electrode in a semiconductor device
04/30/2009US20090108335 Stress transfer by sequentially providing a highly stressed etch stop material and an interlayer dielectric in a contact layer stack of a semiconductor device
04/30/2009US20090108334 Charge Trap Device and Method for Fabricating the Same
04/30/2009US20090108333 Non-volatile semiconductor storage device and method of manufacturing the same
04/30/2009US20090108332 Non-volatile memory device with charge trapping layer and method for fabricating the same
04/30/2009US20090108331 Memory and manufacturing method thereof
04/30/2009US20090108330 Split charge storage node outer spacer process
04/30/2009US20090108329 Non-volatile semiconductor device and method of fabricating the same
04/30/2009US20090108326 Semiconductor device and method of manufacturing the same
04/30/2009US20090108325 Split gate device and method for forming
04/30/2009US20090108324 Semiconductor fin based nonvolatile memory device and method for fabrication thereof
04/30/2009US20090108323 Method of forming nonvolatile memory device having floating gate and related device
04/30/2009US20090108319 Dram stack capacitor and fabrication method thereof
04/30/2009US20090108317 Semiconductor device and method of fabricating the same
04/30/2009US20090108314 Embedded DRAM Integrated Circuits With Extremely Thin Silicon-On-Insulator Pass Transistors
04/30/2009US20090108313 Reducing short channel effects in transistors
04/30/2009US20090108312 Image sensor and method of stabilizing a black level in an image sensor
04/30/2009US20090108310 CMOS image sensor and fabricating method thereof
04/30/2009US20090108309 Cmos image sensor and method for manufacturing the same
04/30/2009US20090108308 Transistor and method of fabricating the same
04/30/2009US20090108306 Uniform recess of a material in a trench independent of incoming topography
04/30/2009US20090108305 Semiconductor having a corner compensation feature and method
04/30/2009US20090108304 Protecting semiconducting oxides
04/30/2009US20090108303 Semiconductor component and method
04/30/2009US20090108302 Multiple crystallographic orientation semiconductor structures
04/30/2009US20090108301 Hybrid orientation semiconductor structure with reduced boundary defects and method of forming same
04/30/2009US20090108299 High electron mobility transistor semiconductor device having field mitigating plate and fabrication method thereof
04/30/2009US20090108297 Semi-insulating nitride semiconductor substrate and method of manufacturing the same, nitride semiconductor epitaxial substrate, and field-effect transistor
04/30/2009US20090108296 Semiconductor devices with different dielectric thicknesses
04/30/2009US20090108295 Dopant profile tuning for mos devices by adapting a spacer width prior to implantation
04/30/2009US20090108294 Scalable high-k dielectric gate stack
04/30/2009US20090108293 Method for Suppressing Lattice Defects in a Semiconductor Substrate
04/30/2009US20090108292 Floating Body Field-Effect Transistors, and Methods of Forming Floating Body Field-Effect Transistors
04/30/2009US20090108291 Semiconductor device and method for fabricating the same
04/30/2009US20090108288 Semiconductor device and method of manufacturing the same
04/30/2009US20090108280 Pixel structure and fabrication method thereof
04/30/2009US20090108279 Light emitting device and method for manufacturing the same
04/30/2009US20090108276 High Efficiency Dilute Nitride Light Emitting Diodes
04/30/2009US20090108265 Thin film transistor, method of fabricating the same, and display apparatus having the same
04/30/2009US20090108264 Laminated conductive film, electro-optical display device and production method of same
04/30/2009US20090108263 Semiconductor device and manufacturing method thereof
04/30/2009US20090108261 Array substrate and method of manufacturing the same
04/30/2009US20090108260 Pixel structure and method for manufacturing the same
04/30/2009US20090108259 Pixel Structure and Method for Manufacturing the Same
04/30/2009US20090108258 Semiconductor Device And Method for Fabricating The Same
04/30/2009US20090108257 Critical dimension for trench and vias
04/30/2009US20090108256 Thin-film transistor substrate and method of manufacturing the same
04/30/2009US20090108252 Lateral two-terminal nanotube devices and method for their formation
04/30/2009US20090108251 Controlled growth of a nanostructure on a substrate
04/30/2009US20090108248 Integrated circuit including doped semiconductor line having conductive cladding
04/30/2009US20090108215 Mask and method for forming a semiconductor device using the same
04/30/2009US20090107952 Sacrificial Compositions And Methods Of Fabricating A Structure Using Sacrificial Compositions
04/30/2009US20090107851 Electrolytic polishing method of substrate
04/30/2009US20090107846 Method and apparatus to prewet wafer surface for metallization from electrolyte solutions
04/30/2009US20090107635 Corrosion-resistant multilayer ceramic member
04/30/2009US20090107548 Stress-induced bandgap-shifted semiconductor photoelectrolytic/photocatalytic/photovoltaic surface and method for making same
04/30/2009US20090107545 Template for pyramidal three-dimensional thin-film solar cell manufacturing and methods of use
04/30/2009US20090107544 Lead-free conductive compositions and processes for use in the manufacture of semiconductor devices: flux materials
04/30/2009US20090107522 Substrate treatment method and substrate treatment apparatus
04/30/2009US20090107250 Apparatus amd method for measuring chuck attachment force
04/30/2009US20090106968 Method for manufacturing workpieces and apparatus
04/30/2009US20090106959 Group III nitride semiconductor manufacturing system
04/30/2009DE202009002891U1 Verpackung für scheibenförmige Produkte, insbesondere Wafer, Solarzellen o.dgl. Packaging for disc-shaped products, in particular wafers, solar cells or the like.
04/30/2009DE19638816B4 Tester für Halbleiteranordnungen mit einer mehrere voneinander isolierte Teile aufweisenden Spannvorrichtung Tester for semiconductor devices with a plurality of mutually isolated portions having clamping device
04/30/2009DE112007000662T5 Epitaktische Silizium-Germanium für einen reduzierten Übergangswiderstand bei Feldeffekt-Transistoren Epitaxial silicon-germanium for a reduced contact resistance in field-effect transistors
04/30/2009DE102008052595A1 High-Electron-Mobility-Transistorhalbleiterbauelement mit feldabschwächender Platte und Fabrikationsverfahren zu dessen Herstellung High-Electron Mobility Transistor Semiconductor component with field weakening plate and manufacturing process for its preparation
04/30/2009DE102008039561A1 Integrierte Schaltkreise, Verfahren zum Herstellen eines integrierten Schaltkreises und Speichermodule Integrated circuits, processes for manufacturing an integrated circuit and memory modules
04/30/2009DE102008007648A1 Method for the production of integrated switching circuit having a field-effect transistor, comprises forming layers, carrying out a temperature process after formation of the layers and structuring the layers
04/30/2009DE102007051943A1 Wafer surfaces characterization method, involves receiving image from portion of wafer surface, and measuring assigned parameter with respect to layer and surface of layer provided at position of critical region by measuring system
04/30/2009DE102007051533A1 Verfahren zur Herstellung einer integrierten Schaltung A method of fabricating an integrated circuit
04/30/2009DE102007051444A1 Strip-shaped substrate etching method, involves producing magnetic field in such manner that electrical flux lines run in closed area perpendicular to operating direction in plasma area close to edge in substrate area
04/30/2009DE102007051318A1 Herstellungsverfahren für einen Radarsensor Preparation method for a radar sensor
04/30/2009DE102007051277A1 Verfahren und Vorrichtung zur indirekten Kühlung von dünnen Bauteilen Method and apparatus for indirect cooling of thin components
04/30/2009DE102007051182A1 Elektronikindustrieanlage und Verfahren zum Betreiben einer Elektronikindustrieanlage Electronics industry plant and method for operating an electronic industrial plant
04/30/2009DE102007050806A1 Verfahren zur Umkontaktierung in keramischen Bauelementen Method for recontacting in ceramic components
04/30/2009DE102007050608A1 Gehäuse für einen Halbleiter-Chip A housing for a semiconductor chip
04/30/2009CA2703250A1 Method and device for coating a carrier for thin-film solar cells
04/30/2009CA2702781A1 Semiconductor component comprising a polycrystalline semiconductor layer
04/30/2009CA2643553A1 Method and system for manufacturing wafer-like slices from a substrate material
04/29/2009EP2053746A1 Semiconductor integrated circuit, semiconductor integrated circuit control method, and terminal system
04/29/2009EP2053665A2 Process testers and testing methodology for thin-film photovoltaic devices
04/29/2009EP2053664A2 Photovoltaic fabrication process monitoring and control using diagnostic devices
04/29/2009EP2053663A1 Hover cushion transport for webs in a web coating process
04/29/2009EP2053657A2 Semiconductor devices
04/29/2009EP2053655A2 Chip scale package using large ductile solder balls
04/29/2009EP2053653A1 Dual work function semiconductor device and method for manufacturing the same
04/29/2009EP2053652A1 Process for manufacturing field effect transistors
04/29/2009EP2053651A2 Method for producing substrate
04/29/2009EP2053650A2 Method for producing semiconductor substrate
04/29/2009EP2053649A2 Vacuum continuous line to process substrates
04/29/2009EP2053648A1 Substrate conveyance device and vertical heat treatment equipment
04/29/2009EP2053647A2 Semiconductor chip mounting method, semiconductor mounting wiring board producing method and semiconductor mounting wiring board
04/29/2009EP2053646A1 Method for vertical interconnection inside 3D electronic modules using vias
04/29/2009EP2053645A2 Method for manufacturing semiconductor substrate
04/29/2009EP2053644A1 Oxidation method and oxidation apparatus
04/29/2009EP2053643A1 Film-forming method and film-forming apparatus
04/29/2009EP2053642A1 Film-forming method and film-forming apparatus