| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/24/2009 | CN100505273C Planar substrate with blended orientations and its forming method |
| 06/24/2009 | CN100505267C Nonvolatile semiconductor memory device having coupled strap region and fabricating method thereof |
| 06/24/2009 | CN100505265C Semiconductor device and method for manufacturing semiconductor device |
| 06/24/2009 | CN100505254C Semiconductor device and its manufactureing method |
| 06/24/2009 | CN100505240C Semiconductor device |
| 06/24/2009 | CN100505221C Semiconductor structure of liquid crystal display and producing method thereof |
| 06/24/2009 | CN100505220C Methods of forming flash memory device |
| 06/24/2009 | CN100505219C Method for the manufacture of a non-volatile memory device and memory device thus obtained |
| 06/24/2009 | CN100505218C Semiconductor structure and its manufacture method |
| 06/24/2009 | CN100505217C Methods of forming dual gate of semiconductor device |
| 06/24/2009 | CN100505216C Manufacturing method of IC and method for reducing corrosion of fuse structure |
| 06/24/2009 | CN100505215C Method for fabricating semiconductor device |
| 06/24/2009 | CN100505214C A canal step channel unit transistor and its manufacture method |
| 06/24/2009 | CN100505213C Semiconductor device, power supply apparatus using the same, and electronic device |
| 06/24/2009 | CN100505212C Standard cell, semiconductor integrated circuit device and layout design method for semiconductor integrated circuit device |
| 06/24/2009 | CN100505211C Semiconductor chip and wafer production method |
| 06/24/2009 | CN100505210C Method for fabricating storage node contact hole of semiconductor device |
| 06/24/2009 | CN100505209C Method for increasing joining point strength between suspending film joining pin and substrate |
| 06/24/2009 | CN100505208C Method of manufacturing a semiconductor device and semiconductor device obtained by means of said method |
| 06/24/2009 | CN100505207C Multipurpose platform in substrate check-up device |
| 06/24/2009 | CN100505206C Static cupule for vacuum processing device, vacuum processing device with the same, and its manufacturing method |
| 06/24/2009 | CN100505205C Semiconductor wafer positioning method, and apparatus using the same |
| 06/24/2009 | CN100505204C Orientation equipment |
| 06/24/2009 | CN100505203C Silicon wafer high speed transport method and system capable of implementing multi-position processing |
| 06/24/2009 | CN100505202C Transfer apparatus for target object |
| 06/24/2009 | CN100505201C Tester for optical device |
| 06/24/2009 | CN100505200C Chip for measuring Ohm contact deterioration failure of semicondutor device and its measuring method |
| 06/24/2009 | CN100505199C Contactor block and apparatus for electrical connection |
| 06/24/2009 | CN100505198C An automatic operation system of inner leading bonding device of semiconductor device |
| 06/24/2009 | CN100505197C Method and system for injecting conductive material to multiple hollow cavity in non-rectangular mould |
| 06/24/2009 | CN100505196C Chip electric connection structure and its manufacturing method |
| 06/24/2009 | CN100505195C Method for forming solid conductive via hole of integrated circuit packaging base plate |
| 06/24/2009 | CN100505194C Non adhesive tape adhesive crystal type integrated circuit packaging method |
| 06/24/2009 | CN100505193C Organic electro-luminescence display device and method for fabricating the same |
| 06/24/2009 | CN100505192C Method of making electronic device with welding seal and welding sealing apparatus |
| 06/24/2009 | CN100505191C Method for manufacturing device having optical semiconductor element |
| 06/24/2009 | CN100505190C Integrated circuit package and its forming mehtod |
| 06/24/2009 | CN100505189C Method for handling electroplating lead layout of IC packaging base plate and electroplating lead structure |
| 06/24/2009 | CN100505188C Method for forming FET |
| 06/24/2009 | CN100505187C Self-forming metal silicide gate for CMOS devices |
| 06/24/2009 | CN100505186C Process for preparing vertical thin-film transistor |
| 06/24/2009 | CN100505185C Method of manufacturing a semiconductor device |
| 06/24/2009 | CN100505184C Selective ion implantation pre-decrystallizatoin method for metal silicide production |
| 06/24/2009 | CN100505183C Narrow-body damascene tri-gate FINFET having thinned body |
| 06/24/2009 | CN100505182C Method for planarizing gate material to improve gate critical dimension in semiconductor devices |
| 06/24/2009 | CN100505181C A phosphor adulterated and impurity absorption method |
| 06/24/2009 | CN100505180C Method of improving the quality of defective semiconductor material |
| 06/24/2009 | CN100505179C Manufacturing method of metal layer direct pattern of semiconductor element |
| 06/24/2009 | CN100505178C Through substrate and interposer, and method for manufacturing through substrate |
| 06/24/2009 | CN100505177C Method and system for etching a high-k dielectric material |
| 06/24/2009 | CN100505176C Method and apparatus for detecting endpoint during plasma etching of thin films |
| 06/24/2009 | CN100505175C Gas processing apparatus and film-forming apparatus |
| 06/24/2009 | CN100505174C Apparatus and methods of cleaning substrates |
| 06/24/2009 | CN100505173C Mechanochemical grinding process and method for increasing grinding end point accuracy |
| 06/24/2009 | CN100505172C Polishing composition and its stock solution, and polishing method using same |
| 06/24/2009 | CN100505171C 抛光垫 Polishing pad |
| 06/24/2009 | CN100505170C Proximity head heating method and apparatus |
| 06/24/2009 | CN100505169C Dielectric and composition and method for forming same |
| 06/24/2009 | CN100505168C Uni-directional diffusion of metal silicide in semiconductor devices |
| 06/24/2009 | CN100505167C Thermal treating apparatus |
| 06/24/2009 | CN100505166C Method for manufactruing high quality GaN monocrystal thick film on heterogeneous substrate |
| 06/24/2009 | CN100505165C A method for preparing the gallium nitride monocrystal substrate |
| 06/24/2009 | CN100505164C Fabrication process of nitride semiconductor substrate and composite material substrate |
| 06/24/2009 | CN100505163C Method of fabricating a silicon semiconductor substrate on strain insulator |
| 06/24/2009 | CN100505162C Method for manufacturing wire of semiconductor component |
| 06/24/2009 | CN100505161C Method for forming inductor in semiconductor device |
| 06/24/2009 | CN100505160C Semiconductor structure and its making method |
| 06/24/2009 | CN100505159C Method for minute graphic representation of metal with non-plane surface |
| 06/24/2009 | CN100505158C Furnace body for controllablly heating blends at variable temperature |
| 06/24/2009 | CN100505157C Substrate processing apparatus |
| 06/24/2009 | CN100505156C Substrate processing apparatus and substrate processing method |
| 06/24/2009 | CN100505155C Substrate cooling device |
| 06/24/2009 | CN100505154C Substrate drying device and method, and substrate producing method |
| 06/24/2009 | CN100505153C Protective tape cutting method and apparatus using the same |
| 06/24/2009 | CN100505152C Method for forming micro pattern in semiconductor device |
| 06/24/2009 | CN100505151C Method for extending use life of reaction cavity in plasma etching system |
| 06/24/2009 | CN100505150C Stackable tray for integrated circuit chips |
| 06/24/2009 | CN100505149C Method of thermal adherend release and apparatus for thermal adherend release |
| 06/24/2009 | CN100505148C Method for realizing a hosting structure of nanometric elements |
| 06/24/2009 | CN100505147C Pressure equalizing device for micro nano transfer printing |
| 06/24/2009 | CN100505145C Tunable radiation source providing a vaccum ultroviolet wavelength planar illumination pattern for semiconductor wafers |
| 06/24/2009 | CN100505140C Ion implanting apparatus and ion implanting method |
| 06/24/2009 | CN100505126C Fusing circuit and display driving circuit |
| 06/24/2009 | CN100505124C Film capacitor, built-in high-density assembled substrate thereof and method for making said film capacitor |
| 06/24/2009 | CN100505093C Semiconductor device |
| 06/24/2009 | CN100505085C Film magnet storage device of multi-storage unit shared access element |
| 06/24/2009 | CN100504994C Electro-optical device and driving method therefore, electronic device and projection type display device |
| 06/24/2009 | CN100504919C Integrated circuit, semiconductor device and ID chip |
| 06/24/2009 | CN100504621C Thinner composition and method of removing photoresist using the same |
| 06/24/2009 | CN100504620C Etching solution for forming bimetallic mosaic structure and base plate treatment method |
| 06/24/2009 | CN100504610C Lithographic apparatus and device manufacturing method |
| 06/24/2009 | CN100504609C Adaptive thermal control of lithographic chemical processes |
| 06/24/2009 | CN100504608C Optimized calibration method of thermal deformation of a wafer in a lithographic process |
| 06/24/2009 | CN100504607C Lithographic apparatus and device manufacturing method |
| 06/24/2009 | CN100504606C Lithographic apparatus and device manufacturing method |
| 06/24/2009 | CN100504605C Laser produced plasma radiation system with foil capturing |
| 06/24/2009 | CN100504604C Mask and device manufacturing methods |
| 06/24/2009 | CN100504603C Detecting assembly and photoetching projector, detection, calibration, determination and retaining method |
| 06/24/2009 | CN100504599C Manufacture method of display element |
| 06/24/2009 | CN100504598C High-resolution overlay alignment methods and systems for imprint lithography |