Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/18/2009US20090155972 Method of producing semiconductor memory
06/18/2009US20090155971 Method of manufacturing a semiconductor device
06/18/2009US20090155970 Enhanced multi-bit non-volatile memory device with resonant tunnel barrier
06/18/2009US20090155969 Protection of sige during etch and clean operations
06/18/2009US20090155968 Method of forming a dielectric layer pattern and method of manufacturing a non-volatile memory device using the same
06/18/2009US20090155967 Method of forming memory with floating gates including self-aligned metal nanodots using a coupling layer
06/18/2009US20090155966 Dram with nanofin transistors
06/18/2009US20090155965 Method of fabricating a non-floating body device with enhanced performance
06/18/2009US20090155964 Methods for fabricating an electronic device
06/18/2009US20090155963 Forming thin film transistors using ablative films
06/18/2009US20090155962 Method for fabricating pitch-doubling pillar structures
06/18/2009US20090155961 Integrated circuit package system with package integration
06/18/2009US20090155959 Semiconductor Device and Method of Forming Integrated Passive Device Module
06/18/2009US20090155958 Robust die bonding process for led dies
06/18/2009US20090155957 Multi-Die Wafer Level Packaging
06/18/2009US20090155956 Semiconductor device
06/18/2009US20090155955 Thermal mechanical flip chip die bonding
06/18/2009US20090155954 Thermal enhanced low profile package structure and method for fabricating the same
06/18/2009US20090155952 Exponentially Doped Layers In Inverted Metamorphic Multijunction Solar Cells
06/18/2009US20090155948 Methods for manufacturing cmos compatible bio-sensors
06/18/2009US20090155947 Method of growing semi-polar nitride single crystal thin film and method of manufacturing nitride semiconductor light emitting diode using the same
06/18/2009US20090155946 Method of varying transmittance of transparent conductive layer, flat panel display device and manufacturing method thereof
06/18/2009US20090155945 Method of manufacturing substrate for forming device, and method of manufacturing nitride-based semiconductor laser diode
06/18/2009US20090155944 Surface Emitting Laser Device and Production Method
06/18/2009US20090155943 Luminescent Ceramic Element For A Light Emitting Device
06/18/2009US20090155942 Hybrid metal bonded vertical cavity surface emitting laser and fabricating method thereof
06/18/2009US20090155941 Light emitting device and method of manufacturing method thereof and thin film forming apparatus
06/18/2009US20090155940 Method of manufacturing thin film transistor and method of manufacturing organic light emitting display having thin film transistor
06/18/2009US20090155939 Method of isolating semiconductor laser diodes
06/18/2009US20090155938 Light emitting diode package with diffuser and method of manufacturing the same
06/18/2009US20090155936 Modular flow cell and adjustment system
06/18/2009US20090155935 Back side wafer dicing
06/18/2009US20090155934 Deposition apparatus and deposition method
06/18/2009US20090155933 Manufacturing Method of Display Device
06/18/2009US20090155932 Method of manufacturing magnetic field detector
06/18/2009US20090155931 Ferroelectric layer with domains stabilized by strain
06/18/2009US20090155491 Film-forming method for forming metal oxide on substrate surface
06/18/2009US20090155026 Method of Transferring a Substrate, Transfer System and Lithographic Projection Apparatus
06/18/2009US20090154871 Semiconductor integrated circuits including grating coupler for optical communication and methods of forming the same
06/18/2009US20090154734 Method for fabricating micro speaker and micro speaker fabricated by the same
06/18/2009US20090154503 All-fiber mode selection technique for multicore fiber laser devices
06/18/2009US20090154240 Nand flash memory devices having wiring with integrally-formed contact pads and dummy lines and methods of manufacturing the same
06/18/2009US20090154227 Integrated circuit including diode memory cells
06/18/2009US20090154225 Thin film magnetic memory device having a highly integrated memory array
06/18/2009US20090154219 Three-dimensional magnetic memory with multi-layer data storage layers
06/18/2009US20090154217 High speed otp sensing scheme
06/18/2009US20090154126 Semiconductor device and method for manufacturing the same
06/18/2009US20090154106 Double bonded heat dissipation
06/18/2009US20090153964 Methods for reducing polarization aberration in optical systems
06/18/2009US20090153848 Apparatus of inspecting defect in semiconductor and method of the same
06/18/2009US20090153788 Liquid crystal display panel having wide viewing angle
06/18/2009US20090153779 Liquid crystal display and method of manufacturing the same
06/18/2009US20090153776 Prism sheet, method for making the same and liquid crystal display device using the same
06/18/2009US20090153763 Method for fabricating liquid crystal display device
06/18/2009US20090153600 System and method for detecting fluid ejection volume
06/18/2009US20090153237 Compensation capacitor network for divided diffused resistors for a voltage divider
06/18/2009US20090153168 Hi-fix board, test tray, test handler, and method for manufacturing packaged chips
06/18/2009US20090153130 Field effect transistor-based biosensor with inorganic film, method of manufacturing the biosensor, and method of detecting biomolecule using the biosensor
06/18/2009US20090153056 Pixel structure, display panel, eletro-optical apparatus, and method thererof
06/18/2009US20090153043 Organic electroluminescent device, method for producing organic electroluminescent device, and electronic apparatus
06/18/2009US20090152998 Microresonator
06/18/2009US20090152980 Electrostatic Comb Driver Actuator/Transducer and Fabrication of the Same
06/18/2009US20090152745 Method and system for manufacturing integrated molded concentrator photovoltaic device
06/18/2009US20090152743 Routing layer for a microelectronic device, microelectronic package containing same, and method of forming a multi-thickness conductor in same for a microelectronic device
06/18/2009US20090152742 Method of manufacturing semiconductor package and semiconductor plastic package using the same
06/18/2009US20090152741 Chip structure and fabrication process thereof and flip chip package structure and fabrication process thereof
06/18/2009US20090152739 Method and system for filters embedded in an integrated circuit package
06/18/2009US20090152738 Integrated circuit package having bottom-side stiffener
06/18/2009US20090152736 Semiconductor device and method of fabricating the same
06/18/2009US20090152735 Metal Interconnection and Method for Manufacturing the Same in a Semiconductor Device
06/18/2009US20090152734 Super-Self-Aligned Contacts and Method for Making the Same
06/18/2009US20090152733 Deep contacts of integrated electronic devices based on regions implanted through trenches
06/18/2009US20090152732 Semiconductor device and method of manufacturing the same
06/18/2009US20090152729 Semiconductor device
06/18/2009US20090152727 Bonding pad for anti-peeling property and method for fabricating the same
06/18/2009US20090152726 Metal line of semiconductor device and method for fabricating the same
06/18/2009US20090152724 Ic interconnect for high current
06/18/2009US20090152723 Interconnect structure and method of making same
06/18/2009US20090152722 Synergy Effect of Alloying Materials in Interconnect Structures
06/18/2009US20090152721 Semiconductor package and method for making the same
06/18/2009US20090152720 Multilayer chip scale package
06/18/2009US20090152719 Methods of fluxless micro-piercing of solder balls, and resulting devices
06/18/2009US20090152717 Method of forming stacked die package
06/18/2009US20090152715 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-applied Protective Layer
06/18/2009US20090152714 Semiconductor device and method for manufacturing the same
06/18/2009US20090152712 Packaging apparatus for optical-electronic semiconductors and a packaging method therefor
06/18/2009US20090152707 Methods and systems for packaging integrated circuits
06/18/2009US20090152706 Integrated circuit package system with interconnect lock
06/18/2009US20090152705 Micromechanical Component and Method for Fabricating a Micromechanical Component
06/18/2009US20090152704 Integrated circuit packaging system with interposer
06/18/2009US20090152702 Coupling wire to semiconductor region
06/18/2009US20090152701 Integrated circuit package system with package integration
06/18/2009US20090152700 Mountable integrated circuit package system with mountable integrated circuit die
06/18/2009US20090152697 Semiconductor device and manufacturing method of the same
06/18/2009US20090152696 Semiconductor device
06/18/2009US20090152694 Electronic device
06/18/2009US20090152691 Leadframe having die attach pad with delamination and crack-arresting features
06/18/2009US20090152690 Semiconductor Chip Substrate with Multi-Capacitor Footprint
06/18/2009US20090152688 Integrated circuit package system for shielding electromagnetic interference
06/18/2009US20090152687 Method of opening pad in semiconductor device
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