Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/01/2009CN100508113C Method for on-line fault diagnosis of etching equipment
07/01/2009CN100508112C Method for manufacturing semiconductor device
07/01/2009CN100508111C Packaging device and forming method thereof
07/01/2009CN100508110C Thermal processing equipment calibration method
07/01/2009CN100508109C Three-dimensional capacitor and producing method thereof
07/01/2009CN100508108C Small volume process chamber with hot inner surfaces
07/01/2009CN100508103C Method and apparatus for an improved bellows shield in a plasma processing system
07/01/2009CN100508071C Memory having shielding effect
07/01/2009CN100508069C Method to improve cache capacity of soi and bulk
07/01/2009CN100508068C Semiconductor storage device
07/01/2009CN100507991C Plasma display apparatus
07/01/2009CN100507925C Esd test array and corresponding method
07/01/2009CN100507923C Block based design methodology with programmable components
07/01/2009CN100507720C Patterning apparatus and method for fabricating continuous patterns using the same
07/01/2009CN100507719C Exposure apparatus and device manufacturing method
07/01/2009CN100507718C Projection system and method of use thereof
07/01/2009CN100507717C Object-exposing equipment and method
07/01/2009CN100507716C Chemical amplification type positive resist composition, resist laminated material, resist pattern forming method and method of manufacturing semiconductor device
07/01/2009CN100507714C Laser mask and crystallization method using the same and manufacture method of displayer
07/01/2009CN100507713C Photomask, photomask manufacturing method and semiconductor device manufacturing method using photomask
07/01/2009CN100507684C Method for inhibiting electricity-leakage in image-collection
07/01/2009CN100507437C Method and apparatus for measuring film thickness by means of coupled eddy sensors
07/01/2009CN100507092C Electrolytic processing apparatus and electrolytic processing method
07/01/2009CN100507073C Receptor system
07/01/2009CN100507068C Aluminum alloy thin film, wiring circuit having the thin film and target material depositing the thin film
07/01/2009CN100506675C Method and device for sticking tape
07/01/2009CN100506485C Chemical mechanical grinding device and its control system and regulating method of grinding pad profile
07/01/2009CN100506343C Method of fabricating a semiconductor device
06/2009
06/30/2009US7555738 Integrated structure layout and layout of interconnections for an instruction execution unit of an integrated circuit chip
06/30/2009US7555406 Method of maintaining and automatically inspecting processing apparatus
06/30/2009US7555358 Process and method for continuous, non lot-based integrated circuit manufacturing
06/30/2009US7554848 Operating techniques for reducing program and read disturbs of a non-volatile memory
06/30/2009US7554806 Interface module-mounted LSI package
06/30/2009US7554788 Capacitor for a semiconductor device
06/30/2009US7554787 Wall crawling devices
06/30/2009US7554777 Power supply control apparatus including control circuit chip with reverse-connected battery protection
06/30/2009US7554774 Magnetic resistance device and method of manufacturing the same
06/30/2009US7554616 Electro-optical device and method of driving the same
06/30/2009US7554537 Booster circuit, semiconductor device, and display device
06/30/2009US7554322 Probe station
06/30/2009US7554321 Counter balanced vertical docking motion in a driven vertical axis test head manipulator
06/30/2009US7554211 Semiconductor wafer and manufacturing process for semiconductor device
06/30/2009US7554209 Semiconductor device having a metal plate conductor
06/30/2009US7554207 Method of forming a lamination film pattern and improved lamination film pattern
06/30/2009US7554206 Microelectronic packages and methods therefor
06/30/2009US7554205 Flip-chip type semiconductor device
06/30/2009US7554202 Semiconductor integrated circuit device
06/30/2009US7554200 Semiconductor devices including porous insulators
06/30/2009US7554182 Semiconductor device and package, and method of manufacturer therefor
06/30/2009US7554181 Semiconductor device with non-overlapping chip mounting sections
06/30/2009US7554180 Package having exposed integrated circuit device
06/30/2009US7554179 Multi-leadframe semiconductor package and method of manufacture
06/30/2009US7554177 Attachment system incorporating a recess in a structure
06/30/2009US7554176 Integrated circuits having a multi-layer structure with a seal ring
06/30/2009US7554175 Gallium nitride substrate, and gallium-nitride-substrate testing and manufacturing methods
06/30/2009US7554171 Semiconductor constructions
06/30/2009US7554169 Semiconductor device and method of manufacturing the same
06/30/2009US7554166 Airdome enclosure for components
06/30/2009US7554164 Semiconductor device having a gap between a gate electrode and a dummy gate electrode
06/30/2009US7554161 HfAlO3 films for gate dielectrics
06/30/2009US7554159 Electrostatic discharge protection device and method of manufacturing the same
06/30/2009US7554150 Non-volatile memory device and method of manufacturing the same
06/30/2009US7554142 Ultrashallow photodiode using indium
06/30/2009US7554139 Semiconductor manufacturing method and semiconductor device
06/30/2009US7554138 Method of manufacturing a strained semiconductor layer, method of manufacturing a semiconductor device and semiconductor substrate suitable for use in such a method including having a thin delta profile layer of germanium close to the bottom of the strained layer
06/30/2009US7554134 Integrated CMOS porous sensor
06/30/2009US7554132 Electronic device containing group-III element based nitride semiconductors
06/30/2009US7554131 Chip embedded package structure and fabrication method thereof
06/30/2009US7554128 Light-emitting apparatus
06/30/2009US7554121 Organic semiconductor device
06/30/2009US7554119 Active matrix substrate and its manufacturing method
06/30/2009US7554118 Thin film transistor, flat panel display having the same and a method of fabricating each
06/30/2009US7554117 Semiconductor device and manufacturing method thereof
06/30/2009US7554116 Display device
06/30/2009US7554113 Organic semiconductor device
06/30/2009US7554108 Forming a semiconductor device feature using acquired parameters
06/30/2009US7554105 Lithographic apparatus and device manufacturing method
06/30/2009US7554055 Method for making ohmic contact to silicon structures with low thermal loads
06/30/2009US7553890 interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components, a curing agent and a hydroxy resin with radical polymer
06/30/2009US7553778 Method for producing a semiconductor device including crystallizing an amphorous semiconductor film
06/30/2009US7553777 Silicon wafer laser processing method and laser beam processing machine
06/30/2009US7553776 Patterned functionalized silicon surfaces
06/30/2009US7553775 Method for coating semiconductor surface, process for production of semiconductor particles using said method, and optical element using said semiconductor particles
06/30/2009US7553774 Method of fabricating semiconductor optical device
06/30/2009US7553773 Pressure control method and processing device
06/30/2009US7553772 Process and apparatus for simultaneous light and radical surface treatment of integrated circuit structure
06/30/2009US7553771 Method of forming pattern of semiconductor device
06/30/2009US7553770 Reverse masking profile improvements in high aspect ratio etch
06/30/2009US7553769 Method for treating a dielectric film
06/30/2009US7553768 Substrate and a method for polishing a substrate
06/30/2009US7553767 Method for fabricating semiconductor device having taper type trench
06/30/2009US7553766 Method of fabricating semiconductor integrated circuit device
06/30/2009US7553765 Method of manufacturing thin-film electronic device having a through-hole extending through the base and in communicative connection with an opening in the electrically conductive layer
06/30/2009US7553764 Silicon wafer having through-wafer vias
06/30/2009US7553763 Salicide process utilizing a cluster ion implantation process
06/30/2009US7553762 Method for forming metal silicide layer
06/30/2009US7553761 Method of fabricating semiconductor device
06/30/2009US7553760 Sub-lithographic nano interconnect structures, and method for forming same
06/30/2009US7553759 Semiconductor device and method of manufacturing a semiconductor device
06/30/2009US7553758 Method of fabricating interconnections of microelectronic device using dual damascene process