| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/16/2009 | US7547610 Method of making a semiconductor device comprising isolation trenches inducing different types of strain |
| 06/16/2009 | US7547609 Method and structure for implanting bonded substrates for electrical conductivity |
| 06/16/2009 | US7547608 Polysilicon hard mask for enhanced alignment signal |
| 06/16/2009 | US7547607 Methods of fabricating integrated circuit capacitors using a dry etching process |
| 06/16/2009 | US7547606 Semiconductor device and method of manufacturing the same |
| 06/16/2009 | US7547605 Microelectronic device and a method for its manufacture |
| 06/16/2009 | US7547604 Method of forming a recessed gate structure on a substrate having insulating columns and removing said insulating columns after forming a conductive region of the gate structure |
| 06/16/2009 | US7547603 Non-planar non-volatile memory cell with an erase gate, an array therefor, and a method of making same |
| 06/16/2009 | US7547602 Semiconductor integrated circuit device and its manufacturing method |
| 06/16/2009 | US7547601 Low power electrically alterable nonvolatile memory cells and arrays |
| 06/16/2009 | US7547600 Five channel fin transistor and method for fabricating the same |
| 06/16/2009 | US7547599 Multi-state memory cell |
| 06/16/2009 | US7547598 Method for fabricating capacitor in semiconductor device |
| 06/16/2009 | US7547597 Direct alignment scheme between multiple lithography layers |
| 06/16/2009 | US7547596 Method of enhancing drive current in a transistor |
| 06/16/2009 | US7547595 Integration scheme method and structure for transistors using strained silicon |
| 06/16/2009 | US7547594 Metal-oxide-semiconductor transistor and method of forming the same |
| 06/16/2009 | US7547593 Method of fabricating semiconductor device |
| 06/16/2009 | US7547591 Semiconductor device |
| 06/16/2009 | US7547590 Method for forming an array substrate including forming a transparent conductive layer on a photoresist and laser ablating |
| 06/16/2009 | US7547589 Method for fabricating semiconductor device, and electro-optical device, integrated circuit and electronic apparatus including the semiconductor device |
| 06/16/2009 | US7547588 Thin film transistor array panel |
| 06/16/2009 | US7547587 Method for manufacturing semiconductor light emitting device |
| 06/16/2009 | US7547586 Method of making a self aligned ion implanted gate and guard ring structure for use in a sit |
| 06/16/2009 | US7547585 P channel Rad Hard MOSFET with enhancement implant |
| 06/16/2009 | US7547584 Method of reducing charging damage to integrated circuits during semiconductor manufacturing |
| 06/16/2009 | US7547583 Light emitting diode package with direct leadframe heat dissipation |
| 06/16/2009 | US7547582 Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies |
| 06/16/2009 | US7547581 Manufacturing method of a semiconductor device to suppress generation of whiskers |
| 06/16/2009 | US7547580 Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region |
| 06/16/2009 | US7547579 Underfill process |
| 06/16/2009 | US7547578 Methods of processing semiconductor wafers having silicon carbide power devices thereon |
| 06/16/2009 | US7547577 Method of making circuitized substrate with solder paste connections |
| 06/16/2009 | US7547576 Solder wall structure in flip-chip technologies |
| 06/16/2009 | US7547575 Two-stage die-bonding method for simultaneous die-bonding of multiple dies |
| 06/16/2009 | US7547573 Image sensor and method of manufacturing the same |
| 06/16/2009 | US7547572 Method of protecting semiconductor chips from mechanical and ESD damage during handling |
| 06/16/2009 | US7547571 Packaging method of a light-sensing semiconductor device and packaging structure thereof |
| 06/16/2009 | US7547570 Method for forming thin film photovoltaic interconnects using self-aligned process |
| 06/16/2009 | US7547569 Method for patterning Mo layer in a photovoltaic device comprising CIGS material using an etch process |
| 06/16/2009 | US7547568 Electrical conditioning of MEMS device and insulating layer thereof |
| 06/16/2009 | US7547567 Method of forming film pattern, device, method of manufacturing device, electro-optical device, and electronic apparatus |
| 06/16/2009 | US7547566 Organic electroluminescent device and method of manufacturing the same |
| 06/16/2009 | US7547565 Method of manufacturing optical interference color display |
| 06/16/2009 | US7547564 Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same |
| 06/16/2009 | US7547563 Method of manufacturing a light emitting device |
| 06/16/2009 | US7547562 Light emitting device and method for manufacturing same |
| 06/16/2009 | US7547561 Advanced process control model incorporating a target offset term |
| 06/16/2009 | US7547560 Defect identification system and method for repairing killer defects in semiconductor devices |
| 06/16/2009 | US7547559 Method for forming MRAM bit having a bottom sense layer utilizing electroless plating |
| 06/16/2009 | US7547558 Method for manufacturing semiconductor device |
| 06/16/2009 | US7547503 Low-defect microparticle pattern, dot array pattern, or hole array pattern with less processing steps (no rinsing of by-products) using a silane having a secondary amino group protected by an o-nitrobenzyloxycarbonyl group; quantum dot laser; photonic crystal optical devices; single-electron devices |
| 06/16/2009 | US7547502 Exposure method |
| 06/16/2009 | US7547465 Multi-station deposition apparatus and method |
| 06/16/2009 | US7547412 Heat sink for semiconductor; copper molybdenum composite; low cost, high thermoconductivity, thermal expansion coefficient can be matched with silicon and gallium arsenide (GaAs) |
| 06/16/2009 | US7547407 Improvement in evenness of the metallic member which is a heater, an electrostatic chuck, or a susceptor; forming the metallic member by printing a printing paste on the alumina sintered body allows little shrinkage due to densification of the alumina compact |
| 06/16/2009 | US7547335 Metal polishing composition and method of polishing using the same |
| 06/16/2009 | US7547245 Substrate production apparatus for producing a substrate for a display device |
| 06/16/2009 | US7547209 Vertical heat treatment system and automatic teaching method for transfer mechanism |
| 06/16/2009 | US7547181 Substrate position correcting method and apparatus using either substrate radius or center of rotation correction adjustment sum |
| 06/16/2009 | US7547175 Transfer device for substrate and storing device and hand therein, and substrate handled by the device |
| 06/16/2009 | US7547053 Substrate gripping apparatus, substrate gripping method and substrate releasing method |
| 06/16/2009 | US7546840 Method for cleaning reaction container and film deposition system |
| 06/11/2009 | WO2009073865A1 System and method for dual-sided sputter etch of substrates |
| 06/11/2009 | WO2009073773A1 Method for fabricating a power semiconductor device having a voltage sustaining layer with a terraced trench facilitating formation of floating islands |
| 06/11/2009 | WO2009073750A1 Forming metal-semiconductor films having different thicknesses within different regions of an electronic device |
| 06/11/2009 | WO2009073706A1 Through-wafer interconnections in electrostatic transducer and array |
| 06/11/2009 | WO2009073640A1 Low-noise pecl output driver |
| 06/11/2009 | WO2009073589A1 Fluoride-free photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction |
| 06/11/2009 | WO2009073588A1 Fluoride-containing photoresist stripper or residue removing cleaning compositions containing conjugate oligomeric or polymeric material of alpha-hydroxycarbonyl compound/amine or ammonia reaction |
| 06/11/2009 | WO2009073491A2 Apparatus and method for depositing electrically conductive pasting material |
| 06/11/2009 | WO2009073485A1 Defect classification utilizing data from a non-vibrating contact potential difference sensor |
| 06/11/2009 | WO2009073417A1 Apparatus and method for testing image sensor wafers to identify pixel defects |
| 06/11/2009 | WO2009073371A2 Systems and methods for link processing with ultrafast and nanosecond laser pulses |
| 06/11/2009 | WO2009073367A1 Methods for forming interconnects in microelectronic workpieces and microelectronic workpieces formed using such methods |
| 06/11/2009 | WO2009073361A1 Pulsed bias plasma process to control microloading |
| 06/11/2009 | WO2009073359A1 Interconnect structure for a microelectronic device, method of manfacturing same, and microelectronic structure containing same |
| 06/11/2009 | WO2009073326A1 High power accufet and method of manufacture |
| 06/11/2009 | WO2009073308A1 Methods of etching trenches into silicon of a semiconductor subtrate, methods of forming trench isolation in silicon of a semiconductor substrate, and methods of forming a plurality of diodes |
| 06/11/2009 | WO2009073206A1 Spatial phase feature location |
| 06/11/2009 | WO2009073188A2 Active material devices with containment layer |
| 06/11/2009 | WO2009073087A2 A semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding |
| 06/11/2009 | WO2009072984A1 A silicon-germanium nanowire structure and a method of forming the same |
| 06/11/2009 | WO2009072983A1 Memory cell and methods of manufacturing thereof |
| 06/11/2009 | WO2009072861A2 Packaging method for micromechanical device |
| 06/11/2009 | WO2009072860A2 Insulation method for micromechanical device |
| 06/11/2009 | WO2009072717A2 Method for forming semiconductor p-n junction layer by using aqueous phosphoric acid and device for applying the same |
| 06/11/2009 | WO2009072659A1 Chip mounting system |
| 06/11/2009 | WO2009072631A1 Method for manufacturing nitride semiconductor element, and nitride semiconductor element |
| 06/11/2009 | WO2009072616A1 Nonvolatile semiconductor memory element and nonvolatile semiconductor memory device |
| 06/11/2009 | WO2009072611A1 Metal electrode and semiconductor element using the same |
| 06/11/2009 | WO2009072544A1 Electrode structure, method for manufacturing the electrode structure, and circuit board and semiconductor module |
| 06/11/2009 | WO2009072538A1 Protective film for laser processing and processing method using the same |
| 06/11/2009 | WO2009072529A1 Method and solution for washing substrate for semiconductor device |
| 06/11/2009 | WO2009072526A1 Light emitting element and method for manufacturing the same |
| 06/11/2009 | WO2009072525A1 Bonding wire for semiconductor devices |
| 06/11/2009 | WO2009072519A1 Semiconductor device |
| 06/11/2009 | WO2009072498A1 Bonding wire for semiconductor devices |
| 06/11/2009 | WO2009072497A1 Circuit member connecting adhesive and semiconductor device |
| 06/11/2009 | WO2009072493A1 Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor device |