Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/25/2009US20090163040 Substrate Processing Apparatus and Manufacturing Method of Semiconductor Device
06/25/2009US20090163039 Composition for forming insulating film and method for fabricating semiconductor device
06/25/2009US20090163038 Heat treatment method, heat treatment apparatus and substrate processing apparatus
06/25/2009US20090163037 Manufacturing method of semiconductor device and substrate processing apparatus
06/25/2009US20090163036 Substrate Treating Method
06/25/2009US20090163035 Etch with high etch rate resist mask
06/25/2009US20090163034 Composite showerhead electrode assembly for a plasma processing apparatus
06/25/2009US20090163033 Methods for extending chamber component life time
06/25/2009US20090163032 Method of forming a dual damascene pattern of a semiconductor device
06/25/2009US20090163031 Method for Manufacturing Semiconductor Device
06/25/2009US20090163030 Semiconductor device manufacturing method
06/25/2009US20090163029 Method of manufacturing semiconductor device
06/25/2009US20090163028 Method for fabricating semiconductor device
06/25/2009US20090163027 Method for fabricating vertical channel transistor in semiconductor device
06/25/2009US20090163026 Immersion lithography wafer edge bead removal for wafer and scanner defect prevention
06/25/2009US20090163025 Methods for forming all tungsten contacts and lines
06/25/2009US20090163024 Methods of depositing a ruthenium film
06/25/2009US20090163023 Phase change memory and method of fabricating the same
06/25/2009US20090163022 Tft array panel
06/25/2009US20090163021 Method of Fabricating Semiconductor Device
06/25/2009US20090163020 Method for Manufacturing Semiconductor Device
06/25/2009US20090163019 Forming robust solder interconnect structures by reducing effects of seed layer underetching
06/25/2009US20090163018 Method to prevent alloy formation when forming layered metal oxides by metal oxidation
06/25/2009US20090163017 Method for fabricating semiconductor device with vertical channel transistor
06/25/2009US20090163016 Method of fabricating a semiconductor device including metal gate electrode and electronic fuse
06/25/2009US20090163015 Method of Fabricating Flash Memory Device
06/25/2009US20090163014 Method for Fabricating Non-Volatile Memory Device with Charge Trapping Layer
06/25/2009US20090163013 Method for Forming Gate of Non-Volatile Memory Device
06/25/2009US20090163012 Method of forming high-dielectric constant films for semiconductor devices
06/25/2009US20090163011 Mask layout and method for forming vertical channel transistor in semiconductor device using the same
06/25/2009US20090163010 Method for fabricating semiconductor device
06/25/2009US20090163009 Composite Charge Storage Structure Formation In Non-Volatile Memory Using Etch Stop Technologies
06/25/2009US20090163008 Lithographically Space-Defined Charge Storage Regions In Non-Volatile Memory
06/25/2009US20090163007 Method for manufacturing semiconductor device
06/25/2009US20090163006 Method for fabricating vertical channel transistor
06/25/2009US20090163005 Schottky barrier source/drain N-MOSFET using ytterbium silicide
06/25/2009US20090163004 Method of Fabricating Semiconductor Device
06/25/2009US20090163003 Manufacturing method of self-separation layer
06/25/2009US20090163002 Method of forming p-type compound semiconductor layer
06/25/2009US20090163001 Separate injection of reactive species in selective formation of films
06/25/2009US20090163000 Method for fabricating vertical channel transistor in a semiconductor device
06/25/2009US20090162999 Method of Growing Nitride Semiconductor material
06/25/2009US20090162998 Methods of Manufacturing Memory Units, and Methods of Manufacturing Semiconductor Devices
06/25/2009US20090162997 Thin diamond like coating for semiconductor processing equipment
06/25/2009US20090162996 Removal of surface dopants from a substrate
06/25/2009US20090162995 Semiconductor Device Manufacturing Method and Semiconductor Manufacturing Apparatus
06/25/2009US20090162994 Laser processing method
06/25/2009US20090162993 Method for fabricating semiconductor device
06/25/2009US20090162992 Method for manufacturing semiconductor device
06/25/2009US20090162991 Process for assembling substrates with low-temperature heat treatments
06/25/2009US20090162990 Method for manufacturing a semiconductor device capable of preventing the decrease of the width of an active region
06/25/2009US20090162989 Methods of manufacturing a semiconductor device using a layer suspended across a trench
06/25/2009US20090162988 Method of forming low capacitance esd device and structure therefor
06/25/2009US20090162987 Method for fabricating mim structure capacitor
06/25/2009US20090162986 Copolymers, polymer resin composition for buffer layer method of forming a pattern using the same and method of manufacturing a capacitor using the same
06/25/2009US20090162985 Method of Fabricating Semiconductor Device
06/25/2009US20090162984 Method for manufacturing semiconductor device
06/25/2009US20090162983 Method of fabricating schottky barrier transistor
06/25/2009US20090162982 Array substrate, display device having the same and method of manufacturing the same
06/25/2009US20090162981 Thin film transistor and method of manufacturing the same
06/25/2009US20090162980 Method of manufacturing semiconductor device
06/25/2009US20090162979 Thyristor device with carbon lifetime adjustment implant and its method of fabrication
06/25/2009US20090162978 Method of Forming a SiGe DIAC ESD Protection Structure
06/25/2009US20090162977 Non-Volatile Memory Fabrication And Isolation For Composite Charge Storage Structures
06/25/2009US20090162976 Method of manufacturing pins of miniaturization chip module
06/25/2009US20090162975 Method of forming a wafer level package
06/25/2009US20090162974 Semiconductor package board using a metal base
06/25/2009US20090162973 Germanium precursors for gst film deposition
06/25/2009US20090162972 Metallization contact structures and methods for forming multiple-layer electrode structures for silicon solar cells
06/25/2009US20090162971 Photo diode and related method for fabrication
06/25/2009US20090162965 Optical Die-Down Quad Flat Non-Leaded Package
06/25/2009US20090162964 Methods of forming double pinned photodiodes
06/25/2009US20090162962 Method of manufacturing nitride semiconductor laser
06/25/2009US20090162961 Active matrix device with photo sensor
06/25/2009US20090162960 Method for manufacturing high efficiency light-emitting diodes
06/25/2009US20090162958 Array substrate, method of manufacturing the same and liquid crystal display apparatus having the same
06/25/2009US20090162955 Led device with improved life performance
06/25/2009US20090162954 AC Impedance Spectroscopy Testing of Electrical Parametric Structures
06/25/2009US20090162953 Predicting dose repeatability in an ion implantation
06/25/2009US20090162952 Apparatus and method for controlling edge performance in an inductively coupled plasma chamber
06/25/2009US20090162951 Enhanced Endpoint Detection In Non-Volatile Memory Fabrication Processes
06/25/2009US20090162950 Dry etching equipment and method for producing semiconductor device
06/25/2009US20090162949 Method of manufacturing organic light-emitting device
06/25/2009US20090162948 Method for eliminating defects from semiconductor materials
06/25/2009US20090162947 Aerodynamic shapes for wafer structures to reduce damage caused by cleaning processes
06/25/2009US20090162794 Method for fabricating semiconductor device
06/25/2009US20090162792 Method for manufacturing a semiconductor device
06/25/2009US20090162791 Protective caps residing at an interface between metal lines and dielectric diffusion barrier (or etch stop) layers; formed by depositing a first layer of aluminum-containing material over an exposed copper line by treating an oxide-free copper surface with an organoaluminum compound; integrated circuit
06/25/2009US20090162790 Photoresist double patterning
06/25/2009US20090162759 substrate processing method, substrate processing program, and computer readable storage medium storing the program, for forming a predetermined pattern on a substrate by a photolithography technique
06/25/2009US20090162758 Photomask having code pattern formed by coding data conversion process information, photomask formation method, and semiconductor device fabrication method
06/25/2009US20090162172 Substrate treating apparatus, and a substrate transporting method therefor
06/25/2009US20090162170 Tandem type semiconductor-processing apparatus
06/25/2009US20090162004 Optical printed circuit board and manufacturing method
06/25/2009US20090161714 Optimizing vcsel mirrors for improving temperature response
06/25/2009US20090161709 Multichip package, methods of manufacture thereof and articles comprising the same
06/25/2009US20090161438 Methods of forming and programming floating-gate memory cells having carbon nanotubes
06/25/2009US20090161422 Magnetic Tunnel Junction Device with Separate Read and Write Paths
06/25/2009US20090161420 Field-emitter-based memory array with phase-change storage devices
06/25/2009US20090161409 Charge mapping memory array formed of materials with mutable electrical characteristics
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