Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
07/2009
07/02/2009US20090166682 Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography
07/02/2009US20090166680 Unity beta ratio tri-gate transistor static radom access memory (SRAM)
07/02/2009US20090166679 Integrated circuit and manufacturing process facilitating selective configuration for electromagnetic compatibility
07/02/2009US20090166678 Semiconductor device and method of manufacturing the same
07/02/2009US20090166677 Semiconductor device and manufacturing method thereof
07/02/2009US20090166675 Strain engineering in semiconductor components
07/02/2009US20090166673 Lateral Bipolar Transistor With Compensated Well Regions
07/02/2009US20090166672 Sawtooth electric field drift region structure for power semiconductor devices
07/02/2009US20090166669 Nitride semiconductor light emitting device and method of manufacturing the same
07/02/2009US20090166664 High power light emitting diode package and manufacturing method thereof
07/02/2009US20090166663 Nitride semiconductor light-emitting device and method of manufacturing the same
07/02/2009US20090166657 Light emitting device
07/02/2009US20090166653 Incorporating reflective layers into led systems and/or components
07/02/2009US20090166651 Light-emitting device with inorganic housing
07/02/2009US20090166650 Light-emitting device of group iii nitride-based semiconductor and manufacturing method thereof
07/02/2009US20090166649 Nitride Semiconductor Light Emitting Device and Fabrication Method Thereof
07/02/2009US20090166645 Light emitting diode having a thermal conductive substrate and method of fabricating the same
07/02/2009US20090166642 Compound semiconductor epitaxial substrate and method for producing the same
07/02/2009US20090166641 Thin film transistor, method of fabricating a thin film transistor and flat panel display device having the same
07/02/2009US20090166637 Display apparatus with storage electrodes having concavo-convex features
07/02/2009US20090166636 Thin film transistor, method of fabricating the same, and organic light emitting diode display device having the tft
07/02/2009US20090166635 Array substrate and method of manufacturing the same
07/02/2009US20090166634 Pixel structure and manufacturing method thereof
07/02/2009US20090166633 Array substrate and method for manufacturing the same
07/02/2009US20090166629 Reducing gate cd bias in cmos processing
07/02/2009US20090166627 Image sensor and method for manufacturing the same
07/02/2009US20090166626 Producing method for crystalline thin film
07/02/2009US20090166625 Mos device structure
07/02/2009US20090166624 Crystallization apparatus, crystallization method, phase modulation element, device and display apparatus
07/02/2009US20090166623 Semiconductor device and method of manufacturing the semiconductor device
07/02/2009US20090166619 Test pattern of semiconductor device and manufacturing method thereof
07/02/2009US20090166618 Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
07/02/2009US20090166616 Oxide semiconductor device and surface treatment method of oxide semiconductor
07/02/2009US20090166612 Techniques for Device Fabrication with Self-Aligned Electrodes
07/02/2009US20090166610 Memory cell with planarized carbon nanotube layer and methods of forming the same
07/02/2009US20090166603 Method of forming a small contact in phase-change memory
07/02/2009US20090166602 Phase-change memory device capable of improving contact resistance and reset current and method of manufacturing the same
07/02/2009US20090166600 Integrated circuit devices having a stress buffer spacer and methods of fabricating the same
07/02/2009US20090166516 Photoelectric conversion device manufacturing method, semiconductor device manufacturing method, photoelectric conversion device, and image sensing system
07/02/2009US20090166431 Electronic component and manufacturing method thereof
07/02/2009US20090166351 Substrate heating device and substrate heating method
07/02/2009US20090166330 Method of Etching a device using a hard mask and etch stop layer
07/02/2009US20090166324 Full-wafer backside marking process
07/02/2009US20090166318 Method of Fabricating an Integrated Circuit
07/02/2009US20090165956 Electrostatic chuck and apparatus for treating substrate including the same
07/02/2009US20090165954 Electrically enhancing the confinement of plasma
07/02/2009US20090165953 Plasma Reactor
07/02/2009US20090165952 Vacuum processing apparatus
07/02/2009US20090165950 Apparatus for treating substrate and method for transferring substrate using the same
07/02/2009US20090165888 Gas filling apparatus
07/02/2009US20090165861 Organic Thin Film Solar Cell and Fabrication method of Same
07/02/2009US20090165831 System for megasonic processing of an article
07/02/2009US20090165828 Substrate treatment method and substrate treatment apparatus
07/02/2009US20090165816 Highly doped iii-nitride semiconductors
07/02/2009US20090165720 Substrate treating apparatus
07/02/2009US20090165557 Angular velocity sensor, method of manufacturing the same, and electronic device using the angular velocity sensor
07/02/2009US20090165296 Patterns of conductive objects on a substrate and method of producing thereof
07/02/2009DE4444686B4 Halbleiterbauelement mit MOS-Transistor und Verfahren zu seiner Herstellung A semiconductor device comprising MOS transistor and method for its preparation
07/02/2009DE19943053B4 Plasmaanlage, insbesondere zur Herstellung von Halbleiterbauelementen A plasma plant, in particular for the production of semiconductor devices
07/02/2009DE19755676B4 Verfahren zur Herstellung einer Schutzring-Anordnung einer Halbleitereinrichtung und Halbleitereinrichtung mit einer derartigen Schutzring-Anordnung A method for producing a protective ring arrangement of a semiconductor device and semiconductor device having such a protective ring arrangement
07/02/2009DE19649412B4 Vorrichtung und Verfahren zum Bewegen eines Substrats Apparatus and method for moving a substrate
07/02/2009DE19521150B4 Verdrahtungsstruktur eines Halbleiterbaulementes und Verfahren zu ihrer Herstellung Wiring structure of a semiconductor component Mentes and processes for their preparation
07/02/2009DE112007002066T5 Polierkissen Polishing pad
07/02/2009DE112007002004T5 Verfahren zur Wärmebehandlung eines Siliziumwafers A method for heat treating a silicon wafer
07/02/2009DE112006001705B4 Verfahren zur Herstellung eines Integrierten Komplementär-Metalloxid-Halbleiter-Schaltkreises unter Verwendung eines erhöhten Source-Drains und eines Ersatz-Metall-Gates A method for manufacturing an integrated complementary metal oxide semiconductor circuit using an increased source-drains and a replacement metal gates
07/02/2009DE102008063912A1 Waferteilungsverfahren Wafer dividing method
07/02/2009DE102008063128A1 SiC-Halbleitervorrichtung mit einer Bodenschicht und Verfahren zu ihrer Herstellung SiC semiconductor device having a bottom layer and processes for their preparation
07/02/2009DE102008062609A1 Verfahren zur Herstellung eines Transistors A method of manufacturing a transistor
07/02/2009DE102008060245A1 Halbleiteranordnung, Verfahren zum Herstellen der Halbleiteranordnung und computerlesbares Medium A semiconductor device, method for manufacturing the semiconductor device and computer readable medium
07/02/2009DE102008051443A1 Halbleiter-Bauelement Semiconductor component
07/02/2009DE102008046028A1 Bildsensor und Verfahren zu seiner Herstellung Image sensor and method for its preparation
07/02/2009DE102008044307A1 Verfahren zum Ätzen eines Bauelements unter Verwendung einer Hartmaske und einer Ätzstoppschicht A method for etching a device using a hard mask and an etch stop layer
07/02/2009DE102008028008A1 System zur Chargenfertigung von amorpher Siliziumfolie System for batch production of amorphous silicon film
07/02/2009DE102007063272A1 Dielektrisches Zwischenschichtmaterial in einem Halbleiterbauelement mit verspannten Schichten mit einem Zwischenpuffermaterial Interlayer dielectric material in a semiconductor device with strained layers with an intermediate buffer material
07/02/2009DE102007063271A1 Verfahren zur Herstellung eines dielektrischen Zwischenschichtmaterials mit unterschiedlichen Abtragsraten während eines CMP-Prozesses A process for producing an interlayer dielectric material having different removal rates during a CMP process,
07/02/2009DE102007063270A1 Verringerung der Erzeugung von Ladungseinfangstellen in Gatedielektrika in MOS-Transistoren durch Ausführen einer Wasserstoffbehandlung Reducing the production of Ladungseinfangstellen in gate dielectrics in the MOS transistors by performing a hydrogen treatment
07/02/2009DE102007063231A1 RAM-Zelle mit einem Transistor mit frei einstellbarem Körperpotential zur Informationsspeicherung mit asymmetrischen Drain/Source-Erweiterungsgebieten RAM cell with a transistor with freely adjustable body potential for information storage with asymmetrical drain / source extension regions
07/02/2009DE102007063229A1 Teststruktur zur Überwachung von Prozesseigenschaften für die Herstellung eingebetteter Halbleiterlegierungen in Drain/Source-Gebieten Test structure for monitoring process suitable for the manufacture of embedded semiconductor alloys in drain / source regions
07/02/2009DE102007062711A1 Halbleiterwafer mit einer Vielzahl von Sensorelementen und Verfahren zum Vermessen von Sensorelementen auf einem Halbleiterwafer Semiconductor wafer having a plurality of sensor elements and methods for measurement of sensor elements on a semiconductor wafer
07/02/2009DE102005046737B4 Nutzen zur Herstellung eines elektronischen Bauteils, Bauteil mit Chip-Durchkontakten und Verfahren Use for the manufacture of an electronic component, chip component with vias and methods
07/02/2009DE102005020453B4 Halbleiterbauteil mit einer Flachleiterstruktur und Verfahren zur Herstellung einer Flachleiterstruktur und Verfahren zur Herstellung eines Halbleiterbauteils A semiconductor device comprising a flat conductor structure and method of manufacturing a flat conductor structure and method of manufacturing a semiconductor device
07/02/2009DE102004041088B4 Halbleiterbauteil in Flachleitertechnik mit einem Halbleiterchip und Verfahren zu seiner Herstellung A semiconductor device in flat conductor technique with a semiconductor chip and method for its preparation
07/02/2009DE10141948B4 Halbleiterspeichervorrichtung und Herstellungsverfahren dafür A semiconductor memory device and manufacturing method thereof
07/02/2009DE10020259B4 Verfahren zur Herstellung floatender Gates in einem Halbleiterbauelement A process for producing floating gates in a semiconductor device
07/01/2009EP2075856A2 Power Light Emitting Die Package With Reflecting Lens And The Method Of Making The Same
07/01/2009EP2075850A2 Photoelectric conversion device and manufacturing method thereof
07/01/2009EP2075847A1 Silicon carbide semiconductor device and method for fabricating the same
07/01/2009EP2075840A2 Protection layer for wafer dicing and corresponding
07/01/2009EP2075839A1 Method for evaluating semiconductor wafer
07/01/2009EP2075836A1 Microstructure and method of manufacturing the same
07/01/2009EP2075835A2 Diode with stress reducing means
07/01/2009EP2075832A1 method for aligning and bonding elements and a device comprising aligned and bonded elements
07/01/2009EP2075831A2 Semiconductor device with shared contact hole for gate electrode and drain region
07/01/2009EP2075830A2 Method for producing bonded wafer
07/01/2009EP2075829A1 A method and device for aligning components
07/01/2009EP2075828A1 Semiconductor device and a method for aligining and bonding a first and second element for the fabrication of a semiconductor device
07/01/2009EP2075827A1 Method of manufacturing metal balls by plasma from a layer comprising several elements
07/01/2009EP2075826A2 Method of manufacturing a semiconductor-on-insulant substrate comprising a step with localised Ge enrichment
07/01/2009EP2075825A1 semiconductor device comprising conductive structures and a planarized surface
07/01/2009EP2075824A1 Polishing composition