| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 06/18/2009 | DE19836953B4 MOSFET und Verfahren zu seiner Herstellung MOSFET and method for its preparation |
| 06/18/2009 | DE19743767B4 Verfahren zum Herstellen eines Halbleiterchip-Gehäuses mit einem Halbleiterchip für Oberflächenmontage sowie ein daraus hergestelltes Halbleiterchip-Gehäuse mit Halbleiterchip A method of manufacturing a semiconductor die package with a semiconductor chip for surface mounting as well as a product manufactured therefrom semiconductor chip package with the semiconductor chip |
| 06/18/2009 | DE19743766B4 In vertikaler und horizontaler Ebene stapelbare Halbleiterchip-Gehäuse und Verfahren zu deren Herstellung In vertical and horizontal plane stackable semiconductor chip package and method of manufacture |
| 06/18/2009 | DE19530510B4 Verfahren zur Herstellung eines Halbleitersensors mit aufgehängter bzw. beweglich gehaltener Mikrostruktur A process for producing a semiconductor sensor with movable held or suspended microstructure |
| 06/18/2009 | DE112007001605T5 Zinkoxiddünnfilm vom p-Typ und Verfahren zur Ausbildung desselben The same p-type zinc oxide thin film and method of forming |
| 06/18/2009 | DE112005001593B4 Verfahren zum Herstellen einer Halbleitervorrichtung mit einer High-K-Gate-Dielektrikumschicht und einer Metall-Gateelektrode A method of manufacturing a semiconductor device having a high-K gate dielectric layer and a metal gate electrode |
| 06/18/2009 | DE10329334B4 Reflektive Flüssigkristallanzeigevorrichtung und Verfahren zum Herstellen derselben Reflective liquid crystal display device and method of manufacturing the same |
| 06/18/2009 | DE10308928B4 Verfahren zum Herstellen freitragender Kontaktierungsstrukturen eines ungehäusten Bauelements A method for producing a self-supporting contacting structures unpackaged device |
| 06/18/2009 | DE10258094B4 Verfahren zur Ausbildung von 3-D Strukturen auf Wafern A method for forming 3-D structures on wafers |
| 06/18/2009 | DE10250902B4 Verfahren zur Entfernung von Strukturelementen unter Verwendung eines verbesserten Abtragungsprozess bei der Herstellung eines Halbleiterbauteils A process for the removal of structural elements using an improved removal process in the manufacture of a semiconductor device |
| 06/18/2009 | DE10214150B4 Siliziumkarbidhalbleitervorrichtung und Verfahren zur Herstellung derselben Silicon carbide semiconductor device and method of manufacturing the same |
| 06/18/2009 | DE10206150B4 Prozesslinieninterne Detektionsvorrichtung für Defekte in selbstjustierten Kontakten und Verfahren zur Herstellung derselben Internal process line detection device for Defects in self-aligned contacts, and processes for making them |
| 06/18/2009 | DE102008062040A1 Epitaxiewafer und Verfahren zu dessen Herstellung Epitaxial wafers and process for its preparation |
| 06/18/2009 | DE102008058837A1 Halbleitereinrichtungen und Verfahren zu deren Herstellung Semiconductor devices and processes for their preparation |
| 06/18/2009 | DE102008054564A1 Halbleitervorrichtung Semiconductor device |
| 06/18/2009 | DE102008052029A1 Halbleitermodul mit Schaltbauteilen und Treiberelektronik Semiconductor module with switching devices and drive electronics |
| 06/18/2009 | DE102007061410A1 Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel Method and apparatus for separating wafers from a wafer stack |
| 06/18/2009 | DE102007061191A1 Halbleiterbauelement mit einem Halbleiterkörper A semiconductor device comprising a semiconductor body |
| 06/18/2009 | DE102007060236A1 Verfahren zur Herstellung eines eine mindestens ZnO enthaltende Zweifach-Pufferschicht aufweisenden Heterokontaktes und Heterokontakt mit Zweifach-Pufferschicht A method for producing a ZnO containing at least one double buffer layer having hetero contact and hetero contact with dual buffer layer |
| 06/18/2009 | DE102007041191B4 Verfahren zur Herstellung eines MOSFET-Bauteils des Trench Gate-Typs sowie MOS-Feldeffekttransistor A method for producing a MOSFET device of the trench gate type, as well as MOS-field effect transistor |
| 06/18/2009 | DE102005014744B4 Trenchtransistor mit erhöhter Avalanchefestigkeit und Herstellungsverfahren Trench transistor with increased avalanche strength and manufacturing processes |
| 06/18/2009 | DE102005001260B4 Optische Halbleiterbauteile und Herstellverfahren für diese Optical semiconductor devices and manufacturing methods for these |
| 06/18/2009 | DE102004063991B4 Verfahren zur Herstellung von dotierten Halbleitergebieten in einem Halbleiterkörper eines lateralen Trenchtransistors A process for the production of doped semiconductor regions in a semiconductor body of a lateral trench transistor |
| 06/18/2009 | DE102004059657B4 Diamanthalbleitervorrichtung und Verfahren zu dessen Herstellung Diamond semiconductor device and process for its preparation |
| 06/18/2009 | DE102004027960B4 Elektrische Leistungs-Halbleitervorrichtung Electrical power semiconductor device |
| 06/18/2009 | CA2701523A1 Method of fastening lamellar of a lamellar material to a suitable substrate |
| 06/18/2009 | CA2677412A1 Semiconductor device manufacturing method and semiconductor device |
| 06/17/2009 | EP2071663A1 Phased array antenna embedded in an integrated circuit package |
| 06/17/2009 | EP2071639A1 Method of forming light emitter and metal mold |
| 06/17/2009 | EP2071630A1 Thin film transistor, method for manufacturing the same, and display |
| 06/17/2009 | EP2071627A2 Semiconductor device |
| 06/17/2009 | EP2071622A2 Package for semiconductor device and method of manufacturing the same |
| 06/17/2009 | EP2071618A2 Method of manufacturing flexible semiconductor assemblies |
| 06/17/2009 | EP2071617A2 Overhead buffer and transfer method of the same |
| 06/17/2009 | EP2071616A1 Composition for forming siliceous film and process for producing siliceous film from the same |
| 06/17/2009 | EP2071615A1 Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method for semiconductor device |
| 06/17/2009 | EP2071614A1 Mobile body driving method, mobile body driving system, pattern forming method and apparatus, exposure method and apparatus and device manufacturing method |
| 06/17/2009 | EP2071613A1 Mobile object driving method, mobile object driving system, pattern forming method and apparatus, exposure method and apparatus, device manufacturing method and calibration method |
| 06/17/2009 | EP2071612A1 Mobile body drive method and mobile body drive system, pattern formation method and apparatus, exposure method and apparatus, and device manufacturing method |
| 06/17/2009 | EP2071611A1 Mobile body drive system and mobile body drive method, pattern formation apparatus and method, exposure apparatus and method, device manufacturing method, and decision method |
| 06/17/2009 | EP2071610A2 Corrosion-resistant multilayer ceramic member |
| 06/17/2009 | EP2071555A1 Active matrix substrate |
| 06/17/2009 | EP2071549A2 Display device |
| 06/17/2009 | EP2071058A1 Crystallisation method |
| 06/17/2009 | EP2071052A2 Copper film vapor phase deposition apparatus |
| 06/17/2009 | EP2070653A1 Cutting method |
| 06/17/2009 | EP2070636A1 Laser processing method |
| 06/17/2009 | EP2070635A1 Laser processing method |
| 06/17/2009 | EP2070634A1 Laser processing device |
| 06/17/2009 | EP2070633A1 Laser working method |
| 06/17/2009 | EP2070632A1 Laser processing method |
| 06/17/2009 | EP2070400A1 Distortion-tolerant processing |
| 06/17/2009 | EP2070124A2 Flexible substrate with electronic devices and traces |
| 06/17/2009 | EP2070118A2 Semiconductor device with circuits formed with essentially uniform pattern density |
| 06/17/2009 | EP2070114A1 Flip-chip interconnection through chip vias |
| 06/17/2009 | EP2070112A2 A transistor having a locally provided metal silicide region in contact areas and a method of forming the transistor |
| 06/17/2009 | EP2070111A1 Process for making a gan substrate |
| 06/17/2009 | EP2070110A2 Field effect transistor with raised source/drain fin straps |
| 06/17/2009 | EP2070108A1 Power mosfet with recessed field plate |
| 06/17/2009 | EP2070107A1 Anti-reflective imaging layer for multiple patterning process |
| 06/17/2009 | EP2070106A1 Design rules for on-chip inductors |
| 06/17/2009 | EP2070105A2 Automatic dynamic baseline creation and adjustment |
| 06/17/2009 | EP2070019A1 Semiconductor device |
| 06/17/2009 | EP2069451A1 Gallium and chromium ions for oxide removal rate enhancement |
| 06/17/2009 | EP2069373A1 Organometallic precursor compounds |
| 06/17/2009 | EP1851795A4 Selective plasma re-oxidation process using pulsed rf source power |
| 06/17/2009 | EP1851788A4 Plasma gate oxidation process using pulsed rf source power |
| 06/17/2009 | EP1834350A4 Device having enhanced stress state and related methods |
| 06/17/2009 | EP1735823A4 The surface of treatment of nanoparticles to control interfacial properties and method of manufacture |
| 06/17/2009 | EP1711801B1 Surface inspection using a non-vibrating contact potential probe |
| 06/17/2009 | EP1687457A4 Metal carbide gate structure and method of fabrication |
| 06/17/2009 | EP1644426B1 Positive photoresist composition and method of forming resist pattern |
| 06/17/2009 | EP1595624B1 Centrifugal sintering system |
| 06/17/2009 | EP1565935B1 Method for producing a chalcogenide semiconductive layer with in-situ optical process control and device for carrying out said method |
| 06/17/2009 | EP1501916B1 Non-corrosive cleaning compositions for removing etch residues |
| 06/17/2009 | EP1382232B1 Protection of conductive connection by electrophoresis coating and structure formed therewith |
| 06/17/2009 | EP1287187B1 Chemical vapor deposition process |
| 06/17/2009 | EP1247069A4 Optical method for the determination of grain orientation in films |
| 06/17/2009 | EP1240553B1 Photoresist composition for deep uv radiation |
| 06/17/2009 | EP1230684B1 Method for the production of a semiconductor component |
| 06/17/2009 | EP1192665B1 Heterojunction III-V bipolar transistor |
| 06/17/2009 | EP1027723B1 Method of forming an electric capacitor |
| 06/17/2009 | EP0978016B1 Antireflective coating compositions for photoresist compositions and use thereof |
| 06/17/2009 | CN201259888Y Material conveyor apparatus |
| 06/17/2009 | CN201259887Y Detection device for chip loss |
| 06/17/2009 | CN201259886Y thimble module |
| 06/17/2009 | CN101461055A Producing SOI structure using high-purity ion shower |
| 06/17/2009 | CN101461054A Die level metal density gradient for improved flip chip package reliability |
| 06/17/2009 | CN101461053A Substrate position determining method, substrate position detecting method, and substrate collecting method |
| 06/17/2009 | CN101461052A Method and system for bringing in/out of substrate, and photosensitive laminate manufacturing apparatus |
| 06/17/2009 | CN101461051A Substrate transfer equipment and substrate processing system using the same |
| 06/17/2009 | CN101461050A Method of fabricating cantilever type probe and method of fabricating probe card using the same |
| 06/17/2009 | CN101461049A Device for mounting electronic part |
| 06/17/2009 | CN101461048A Thermocompression bonding head and mounting device using the same |
| 06/17/2009 | CN101461047A Semiconductor element, method for manufacturing the semiconductor element, electronic device and method for manufacturing the electronic device |
| 06/17/2009 | CN101461046A 半导体器件 Semiconductor devices |
| 06/17/2009 | CN101461045A Methods of performance improvement of HVMOS devices |
| 06/17/2009 | CN101461044A Residue free hardmask trim |
| 06/17/2009 | CN101461043A Semiconductor device and method for manufacturing the same |
| 06/17/2009 | CN101461042A Heat treatment method, heat treatment apparatus and substrate processing apparatus |