Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/18/2009WO2009075694A1 Hybrid microscale-nanoscale neuromorphic integrated circuit
06/18/2009WO2009075651A1 Fabrication of semiconductor devices
06/18/2009WO2009075650A1 A method of doping and apparatus for doping
06/18/2009WO2009075585A1 Method of depositing a doped zinc oxide film, a conductive zinc oxide film and use of the doped zinc oxide film
06/18/2009WO2009075544A2 A liner for semiconductor chamber
06/18/2009WO2009075411A1 Method for arranging a plurality of connecting elements
06/18/2009WO2009075393A1 Plasma damage free sputter gun, sputter, plasma process apparatus and film-forming method
06/18/2009WO2009075370A1 Non-volatile semiconductor storage device and method of manufacturing the same
06/18/2009WO2009075321A1 MULTILAYER SUBSTRATE INCLUDING GaN LAYER, METHOD FOR MANUFACTURING THE MULTILAYER SUBSTRATE INCLUDING GAN LAYER, AND DEVICE
06/18/2009WO2009075308A1 Cyclic compound, photoresist base, photoresist composition, microfabrication process, and semiconductor device
06/18/2009WO2009075307A1 Cyclic compound, photoresist base, photoresist composition, microfabrication process, and semiconductor device
06/18/2009WO2009075288A1 Silicon substrate and method for manufacturing the same
06/18/2009WO2009075265A1 Composition for resist underlayer film formation and method for resist pattern formation
06/18/2009WO2009075261A1 Substrate transfer apparatus, substrate transfer method and vacuum processing apparatus
06/18/2009WO2009075257A1 Silicon substrate and method for manufacturing the same
06/18/2009WO2009075233A1 Alkali-developable curable composition, insulating thin film using the same, and thin film transistor
06/18/2009WO2009075200A1 Semiconductor device and method of manufacturing the device, and method of manufacturing trench gate
06/18/2009WO2009075196A1 Two-sided adhesive tape for semiconductor processing and tape for semiconductor processing
06/18/2009WO2009075164A1 Apparatus and method for mounting electronic component
06/18/2009WO2009075161A1 Patterned crystalline semiconductor thin film, process for producing thin-film transistor and field effect transistor
06/18/2009WO2009075160A1 Method and apparatus for mounting electric component
06/18/2009WO2009075159A1 Method and apparatus for mounting electric component
06/18/2009WO2009075153A1 Expand ring
06/18/2009WO2009075150A1 Tape for processing wafer
06/18/2009WO2009075149A1 Semiconductor device
06/18/2009WO2009075124A1 Semiconductor device manufacturing method and semiconductor device
06/18/2009WO2009075103A1 Moving body device, exposure device, pattern formation device, and device manufacturing method
06/18/2009WO2009075062A1 Method for cutting work by wire saw and wire saw
06/18/2009WO2009075060A1 Substrate processing method
06/18/2009WO2009075052A1 Semiconductor device and method for manufacturing the same
06/18/2009WO2009075031A1 Semiconductor device
06/18/2009WO2009074755A2 Method of fastening lamellae of a lamellar material to a suitable substrate
06/18/2009WO2009074601A1 Method and arrangement for tempering sic wafers
06/18/2009WO2009074021A1 Plasma processing apparatus and shield ring
06/18/2009WO2009058245A3 Improved substrate compositions and methods for forming semiconductor on insulator devices
06/18/2009WO2009058235A3 High lifetime consumable silicon nitride-silicon dioxide plasma processing components
06/18/2009WO2009058181A3 Compounds for photoresist stripping
06/18/2009WO2009057968A3 Sawing apparatus
06/18/2009WO2009051836A9 Rhombohedral cubic semiconductor materials on trigonal substrate with single crystal properties and devices based on such materials
06/18/2009WO2009048517A3 Apparatus for measuring dielectric properties of parts
06/18/2009WO2009045102A3 An electronic circuit element with profiled photopatternable dielectric layer
06/18/2009WO2009018371A3 Nanomembrane structures having mixed crystalline orientations and compositions
06/18/2009WO2007001865A3 Plasma confinement rings including rf absorbing material for reducing polymer deposition
06/18/2009WO2005029546A3 Method and system for providing a continuous motion sequential lateral solidification for reducing or eliminating artifacts, and a mask for facilitating such artifact reduction/elimination
06/18/2009WO2005026671A3 Focal plane arrays in type-ii superlattices
06/18/2009WO2004010167A3 Holographic surface mask etching and optical structures
06/18/2009US20090158236 Semiconductor device fabrication method and fabrication apparatus using a stencil mask
06/18/2009US20090158103 Test apparatus and test method
06/18/2009US20090157953 Data line disturbance free memory block divided flash memory and microcomputer having flash memory therein
06/18/2009US20090157214 Maintenance system, substrate processing apparatus, remote operation unit and communication method
06/18/2009US20090156913 Ceramic emitter substrate
06/18/2009US20090156852 such as di-tert-butyl germane; for use as vapor phase deposition precursors for Group IV metal-containing films; useful in the manufacture of electronic devices
06/18/2009US20090156101 Polishing apparatus, polishing head and polishing method
06/18/2009US20090156019 Substrate processing apparatus and method
06/18/2009US20090156018 Laser mask and crystallization method using the same
06/18/2009US20090156017 Method for forming dielectric film using siloxane-silazane mixture
06/18/2009US20090156016 Method for transfer of a thin layer
06/18/2009US20090156015 Deposition apparatus
06/18/2009US20090156014 Method for manufacturing semiconductor device
06/18/2009US20090156013 Method and apparatus for removing polymer from the wafer backside and edge
06/18/2009US20090156012 Method for fabricating low k dielectric dual damascene structures
06/18/2009US20090156011 Method of controlling CD bias and CD microloading by changing the ceiling-to-wafer gap in a plasma reactor
06/18/2009US20090156010 Thin film etching method and semiconductor device fabrication using same
06/18/2009US20090156009 Method for manufacturing semiconductor device
06/18/2009US20090156008 Polishing Composition and Polishing Method Using The Same
06/18/2009US20090156007 Polishing slurry and polishing method
06/18/2009US20090156006 Compositions and methods for cmp of semiconductor materials
06/18/2009US20090156005 Cleaning liquid used in process for forming dual damascene structure and a process for treating substrate therewith
06/18/2009US20090156004 Method for forming tungsten materials during vapor deposition processes
06/18/2009US20090156003 Method for depositing tungsten-containing layers by vapor deposition techniques
06/18/2009US20090156002 Manufacturing method for semiconductor device and manufacturing apparatus for semiconductor device
06/18/2009US20090156001 Structure for reducing stress for vias and fabricating method thereof
06/18/2009US20090156000 Method of manufacturing semiconductor device
06/18/2009US20090155999 Method for fabricating metal silicide
06/18/2009US20090155998 Atomic layer deposited tantalum containing adhesion layer
06/18/2009US20090155997 METHOD FOR FORMING Ta-Ru LINER LAYER FOR Cu WIRING
06/18/2009US20090155996 Plating seed layer including an oxygen/nitrogen transition region for barrier enhancement
06/18/2009US20090155995 Self-aligned contact formation utilizing sacrificial polysilicon
06/18/2009US20090155994 Forming thin film transistors using ablative films with pre-patterned conductors
06/18/2009US20090155993 Terminal pad structures and methods of fabricating same
06/18/2009US20090155992 High k stack for non-volatile memory
06/18/2009US20090155991 Methods of fabricating a semiconductor device
06/18/2009US20090155990 Manufacturing method of a semiconductor device and method for creating a layout thereof
06/18/2009US20090155989 Nitride semiconductor substrate and method of producing same
06/18/2009US20090155988 Element of low temperature poly-silicon thin film and method of making poly-silicon thin film by direct deposition at low temperature and inductively-coupled plasma chemical vapor deposition equipment therefor
06/18/2009US20090155987 Method of fabricating gallium nitride substrate
06/18/2009US20090155986 Method for manufacturing gallium nitride single crystalline substrate using self-split
06/18/2009US20090155985 Inhibition of Metal Diffusion Arising from Laser Dicing
06/18/2009US20090155984 Backside protection film, method of forming the same and method of manufacturing a semiconductor package using the same
06/18/2009US20090155983 Inhibition of metal diffusion arising from laser dicing
06/18/2009US20090155982 Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes
06/18/2009US20090155981 Method and apparatus for singulating integrated circuit chips
06/18/2009US20090155980 Methods of Forming Trench Isolation and Methods of Forming Floating Gate Transistors
06/18/2009US20090155979 Method of manufacturing a semiconductor device
06/18/2009US20090155978 Recessed Shallow Trench Isolation
06/18/2009US20090155977 Methods for Forming a Gate and a Shallow Trench Isolation Region and for Planarizating an Etched Surface of Silicon Substrate
06/18/2009US20090155976 Atomic layer deposition of dy-doped hfo2 films as gate dielectrics
06/18/2009US20090155975 Method for manufacturing metal-insulator-metal capacitor of semiconductor device
06/18/2009US20090155974 Method of manufacturing a semiconductor device having a channel extending vertically
06/18/2009US20090155973 Semiconductor device having mosfet with offset-spacer, and manufacturing method thereof
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