Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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06/30/2009 | US7553757 Semiconductor device and method of manufacturing the same |
06/30/2009 | US7553756 Process for producing semiconductor integrated circuit device |
06/30/2009 | US7553755 Method for symmetric deposition of metal layer |
06/30/2009 | US7553754 Electronic device, method of manufacture of the same, and sputtering target |
06/30/2009 | US7553753 Method of forming crack arrest features in embedded device build-up package and package thereof |
06/30/2009 | US7553752 Method of making a wafer level integration package |
06/30/2009 | US7553751 Method of forming solder bump with reduced surface defects |
06/30/2009 | US7553750 Method for fabricating electrical conductive structure of circuit board |
06/30/2009 | US7553749 Method of hiding transparent electrodes on a transparent substrate |
06/30/2009 | US7553748 Semiconductor device and method of manufacturing the same |
06/30/2009 | US7553746 Method for manufacturing electrodes on a semiconducting material of type II-VI or on a compound of this material |
06/30/2009 | US7553745 Integrated circuit package, panel and methods of manufacturing the same |
06/30/2009 | US7553744 Method for low temperature bonding and bonded structure |
06/30/2009 | US7553743 Wafer bonding method of system in package |
06/30/2009 | US7553742 Method(s) of forming a thin layer |
06/30/2009 | US7553741 Manufacturing method of semiconductor device |
06/30/2009 | US7553740 Structure and method for forming a minimum pitch trench-gate FET with heavy body region |
06/30/2009 | US7553739 Integration control and reliability enhancement of interconnect air cavities |
06/30/2009 | US7553738 Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method |
06/30/2009 | US7553737 Method for fabricating recessed-gate MOS transistor device |
06/30/2009 | US7553736 Increasing dielectric constant in local regions for the formation of capacitors |
06/30/2009 | US7553735 Scalable high performance non-volatile memory cells using multi-mechanism carrier transport |
06/30/2009 | US7553734 Method for forming an avalanche photodiode |
06/30/2009 | US7553733 Isolated LDMOS IC technology |
06/30/2009 | US7553732 Integration scheme for constrained SEG growth on poly during raised S/D processing |
06/30/2009 | US7553731 Method of manufacturing semiconductor device |
06/30/2009 | US7553730 Methods of fabrication employing nanoscale mandrels |
06/30/2009 | US7553729 Method of manufacturing non-volatile memory device |
06/30/2009 | US7553728 Method of fabricating a non-volatile semiconductor memory |
06/30/2009 | US7553727 Using implanted poly-1 to improve charging protection in dual-poly process |
06/30/2009 | US7553726 Method of fabricating nonvolatile memory device |
06/30/2009 | US7553725 Nonvolatile memory devices and methods of fabricating the same |
06/30/2009 | US7553724 Method for manufacturing code address memory cell by which a stack insulating film of an oxide film and a nitride film used as a dielectric film in a flash memory is used as a gate oxide film |
06/30/2009 | US7553723 Manufacturing method of a memory device |
06/30/2009 | US7553722 Semiconductor device and method for manufacturing the same |
06/30/2009 | US7553721 Flash memory devices and methods of fabricating the same |
06/30/2009 | US7553720 Non-volatile memory device and fabrication method thereof |
06/30/2009 | US7553719 Flash memory device and method for fabricating the same |
06/30/2009 | US7553718 Methods, systems and structures for forming semiconductor structures incorporating high-temperature processing steps |
06/30/2009 | US7553717 Recess etch for epitaxial SiGe |
06/30/2009 | US7553716 Method for manufacturing a semiconductor thin film |
06/30/2009 | US7553715 Crystallization method and apparatus thereof |
06/30/2009 | US7553714 Method of manufacturing thin film transistor having polycrystalline silicon layer, thin film transistor manufactured using the method and flat panel display comprising the thin film transistor |
06/30/2009 | US7553713 Method of manufacturing semiconductor substrates and semiconductor devices |
06/30/2009 | US7553712 Method for manufacturing a bottom substrate of a liquid crystal display |
06/30/2009 | US7553711 Method for fabricating a thin film transistor for use with a flat panel display device |
06/30/2009 | US7553710 Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same |
06/30/2009 | US7553709 MOSFET with body contacts |
06/30/2009 | US7553708 Fabricating method for a liquid crystal display of horizontal electric field applying type |
06/30/2009 | US7553707 Method for manufacturing a Liquid crystal display device |
06/30/2009 | US7553706 TFT fabrication process |
06/30/2009 | US7553704 Antifuse element and method of manufacture |
06/30/2009 | US7553703 Methods of forming an interconnect structure |
06/30/2009 | US7553702 Integrating a heat spreader with an interface material having reduced void size |
06/30/2009 | US7553701 Semiconductor packaging method |
06/30/2009 | US7553700 Chemical-enhanced package singulation process |
06/30/2009 | US7553699 Method of fabricating microelectronic devices |
06/30/2009 | US7553698 Semiconductor package having semiconductor constructing body and method of manufacturing the same |
06/30/2009 | US7553697 Multiple chip semiconductor package |
06/30/2009 | US7553696 Method for implementing component placement suspended within grid array packages for enhanced electrical performance |
06/30/2009 | US7553695 Method of fabricating a package for a micro component |
06/30/2009 | US7553694 Methods of forming a high conductivity diamond film and structures formed thereby |
06/30/2009 | US7553693 Method for making a field effect transistor with diamond-like carbon channel and resulting transistor |
06/30/2009 | US7553692 Phase-change memory device and method of manufacturing the same |
06/30/2009 | US7553691 forming a triple-junction cells comprising germanium bottom cell, indium, aluminum, gallium arsenide and phosphide containing middle cell having a heterojunction base and emitter disposed over bottom cell, and homojunction top cell; photovoltaic solar cells; enhanced performance |
06/30/2009 | US7553690 Starved source diffusion for avalanche photodiode |
06/30/2009 | US7553689 Semiconductor device with micro-lens and method of making the same |
06/30/2009 | US7553688 Methods for packaging image sensitive electronic devices |
06/30/2009 | US7553687 Dual seed semiconductor photodetectors |
06/30/2009 | US7553686 Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices |
06/30/2009 | US7553685 Method of fabricating light-emitting device and light-emitting device |
06/30/2009 | US7553684 Method of fabricating interferometric devices using lift-off processing techniques |
06/30/2009 | US7553683 Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices |
06/30/2009 | US7553682 Method of manufacturing vertical nitride light emitting device |
06/30/2009 | US7553681 Carbon nanotube-based stress sensor |
06/30/2009 | US7553680 Methods to provide and expose a diagnostic connector on overmolded electronic packages |
06/30/2009 | US7553677 Method for manufacturing ferroelectric memory |
06/30/2009 | US7553610 Method of forming fine patterns |
06/30/2009 | US7553608 Photomask uniform control of optical near field intensity distribution |
06/30/2009 | US7553545 Passivation semiconductor particles using silicon, germanium compounds; photovoltaic cell |
06/30/2009 | US7553518 Substrate processing method |
06/30/2009 | US7553512 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase |
06/30/2009 | US7553457 Chemical processing apparatus for manufacturing circuit substrates |
06/30/2009 | US7553433 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase small particles for use in manufacturing electrically-conductive metallic films for electronic products; powder coatings for thick films |
06/30/2009 | US7553430 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer |
06/30/2009 | US7553427 in semiconductor using an aluminum source in the presence of a chlorine-containing gases, that are capable of anisotropic etching of high aspect ratio features in accordance with masking patterns |
06/30/2009 | US7553400 Plating apparatus and plating method |
06/30/2009 | US7553374 Coating treatment apparatus and coating treatment method |
06/30/2009 | US7553370 Crystal growth method for nitride semiconductor and formation method for semiconductor device |
06/30/2009 | US7553369 Method of altering the properties of a thin film and substrate implementing said method |
06/30/2009 | US7553368 Process for manufacturing a gallium rich gallium nitride film |
06/30/2009 | US7553366 Laser beam pattern mask and crystallization method using the same |
06/30/2009 | US7553214 Polishing article with integrated window stripe |
06/30/2009 | US7553208 Manufacturing method of organic electroluminescence display device |
06/30/2009 | US7553165 Spring interconnect structures |
06/30/2009 | US7552816 Break-away positioning conveyor mount for accommodating conveyor belt bends |
06/30/2009 | US7552601 Optical component of quartz glass, method for producing the optical component, and use thereof |
06/30/2009 | US7552534 Method of manufacturing an integrated orifice plate and electroformed charge plate |
06/30/2009 | US7552532 Method for hermetically encapsulating a component |
06/30/2009 | US7552531 Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit |