Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/30/2009US7553757 Semiconductor device and method of manufacturing the same
06/30/2009US7553756 Process for producing semiconductor integrated circuit device
06/30/2009US7553755 Method for symmetric deposition of metal layer
06/30/2009US7553754 Electronic device, method of manufacture of the same, and sputtering target
06/30/2009US7553753 Method of forming crack arrest features in embedded device build-up package and package thereof
06/30/2009US7553752 Method of making a wafer level integration package
06/30/2009US7553751 Method of forming solder bump with reduced surface defects
06/30/2009US7553750 Method for fabricating electrical conductive structure of circuit board
06/30/2009US7553749 Method of hiding transparent electrodes on a transparent substrate
06/30/2009US7553748 Semiconductor device and method of manufacturing the same
06/30/2009US7553746 Method for manufacturing electrodes on a semiconducting material of type II-VI or on a compound of this material
06/30/2009US7553745 Integrated circuit package, panel and methods of manufacturing the same
06/30/2009US7553744 Method for low temperature bonding and bonded structure
06/30/2009US7553743 Wafer bonding method of system in package
06/30/2009US7553742 Method(s) of forming a thin layer
06/30/2009US7553741 Manufacturing method of semiconductor device
06/30/2009US7553740 Structure and method for forming a minimum pitch trench-gate FET with heavy body region
06/30/2009US7553739 Integration control and reliability enhancement of interconnect air cavities
06/30/2009US7553738 Method of fabricating a microelectronic device including embedded thin film capacitor by over-etching thin film capacitor bottom electrode and microelectronic device made according to the method
06/30/2009US7553737 Method for fabricating recessed-gate MOS transistor device
06/30/2009US7553736 Increasing dielectric constant in local regions for the formation of capacitors
06/30/2009US7553735 Scalable high performance non-volatile memory cells using multi-mechanism carrier transport
06/30/2009US7553734 Method for forming an avalanche photodiode
06/30/2009US7553733 Isolated LDMOS IC technology
06/30/2009US7553732 Integration scheme for constrained SEG growth on poly during raised S/D processing
06/30/2009US7553731 Method of manufacturing semiconductor device
06/30/2009US7553730 Methods of fabrication employing nanoscale mandrels
06/30/2009US7553729 Method of manufacturing non-volatile memory device
06/30/2009US7553728 Method of fabricating a non-volatile semiconductor memory
06/30/2009US7553727 Using implanted poly-1 to improve charging protection in dual-poly process
06/30/2009US7553726 Method of fabricating nonvolatile memory device
06/30/2009US7553725 Nonvolatile memory devices and methods of fabricating the same
06/30/2009US7553724 Method for manufacturing code address memory cell by which a stack insulating film of an oxide film and a nitride film used as a dielectric film in a flash memory is used as a gate oxide film
06/30/2009US7553723 Manufacturing method of a memory device
06/30/2009US7553722 Semiconductor device and method for manufacturing the same
06/30/2009US7553721 Flash memory devices and methods of fabricating the same
06/30/2009US7553720 Non-volatile memory device and fabrication method thereof
06/30/2009US7553719 Flash memory device and method for fabricating the same
06/30/2009US7553718 Methods, systems and structures for forming semiconductor structures incorporating high-temperature processing steps
06/30/2009US7553717 Recess etch for epitaxial SiGe
06/30/2009US7553716 Method for manufacturing a semiconductor thin film
06/30/2009US7553715 Crystallization method and apparatus thereof
06/30/2009US7553714 Method of manufacturing thin film transistor having polycrystalline silicon layer, thin film transistor manufactured using the method and flat panel display comprising the thin film transistor
06/30/2009US7553713 Method of manufacturing semiconductor substrates and semiconductor devices
06/30/2009US7553712 Method for manufacturing a bottom substrate of a liquid crystal display
06/30/2009US7553711 Method for fabricating a thin film transistor for use with a flat panel display device
06/30/2009US7553710 Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same
06/30/2009US7553709 MOSFET with body contacts
06/30/2009US7553708 Fabricating method for a liquid crystal display of horizontal electric field applying type
06/30/2009US7553707 Method for manufacturing a Liquid crystal display device
06/30/2009US7553706 TFT fabrication process
06/30/2009US7553704 Antifuse element and method of manufacture
06/30/2009US7553703 Methods of forming an interconnect structure
06/30/2009US7553702 Integrating a heat spreader with an interface material having reduced void size
06/30/2009US7553701 Semiconductor packaging method
06/30/2009US7553700 Chemical-enhanced package singulation process
06/30/2009US7553699 Method of fabricating microelectronic devices
06/30/2009US7553698 Semiconductor package having semiconductor constructing body and method of manufacturing the same
06/30/2009US7553697 Multiple chip semiconductor package
06/30/2009US7553696 Method for implementing component placement suspended within grid array packages for enhanced electrical performance
06/30/2009US7553695 Method of fabricating a package for a micro component
06/30/2009US7553694 Methods of forming a high conductivity diamond film and structures formed thereby
06/30/2009US7553693 Method for making a field effect transistor with diamond-like carbon channel and resulting transistor
06/30/2009US7553692 Phase-change memory device and method of manufacturing the same
06/30/2009US7553691 forming a triple-junction cells comprising germanium bottom cell, indium, aluminum, gallium arsenide and phosphide containing middle cell having a heterojunction base and emitter disposed over bottom cell, and homojunction top cell; photovoltaic solar cells; enhanced performance
06/30/2009US7553690 Starved source diffusion for avalanche photodiode
06/30/2009US7553689 Semiconductor device with micro-lens and method of making the same
06/30/2009US7553688 Methods for packaging image sensitive electronic devices
06/30/2009US7553687 Dual seed semiconductor photodetectors
06/30/2009US7553686 Al2O3 atomic layer deposition to enhance the deposition of hydrophobic or hydrophilic coatings on micro-electromechanical devices
06/30/2009US7553685 Method of fabricating light-emitting device and light-emitting device
06/30/2009US7553684 Method of fabricating interferometric devices using lift-off processing techniques
06/30/2009US7553683 Method of forming pre-fabricated wavelength converting elements for semiconductor light emitting devices
06/30/2009US7553682 Method of manufacturing vertical nitride light emitting device
06/30/2009US7553681 Carbon nanotube-based stress sensor
06/30/2009US7553680 Methods to provide and expose a diagnostic connector on overmolded electronic packages
06/30/2009US7553677 Method for manufacturing ferroelectric memory
06/30/2009US7553610 Method of forming fine patterns
06/30/2009US7553608 Photomask uniform control of optical near field intensity distribution
06/30/2009US7553545 Passivation semiconductor particles using silicon, germanium compounds; photovoltaic cell
06/30/2009US7553518 Substrate processing method
06/30/2009US7553512 Applying flowable precursor composition to organic substrate wherein precursor comprises molecular precursor to conductive phase and powder of insulating material, heating substrate to convert molecular precursor to conductive phase
06/30/2009US7553457 Chemical processing apparatus for manufacturing circuit substrates
06/30/2009US7553433 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase small particles for use in manufacturing electrically-conductive metallic films for electronic products; powder coatings for thick films
06/30/2009US7553430 using an aqueous slurry comprising dissolved ammonium dimolybdate and ammonium octamolybdate in water and an oxidizing agent; apply aqueous slurry between the copper and a polishing pad; apply a low pressure with high polish rates on the surface of semiconductor wafer
06/30/2009US7553427 in semiconductor using an aluminum source in the presence of a chlorine-containing gases, that are capable of anisotropic etching of high aspect ratio features in accordance with masking patterns
06/30/2009US7553400 Plating apparatus and plating method
06/30/2009US7553374 Coating treatment apparatus and coating treatment method
06/30/2009US7553370 Crystal growth method for nitride semiconductor and formation method for semiconductor device
06/30/2009US7553369 Method of altering the properties of a thin film and substrate implementing said method
06/30/2009US7553368 Process for manufacturing a gallium rich gallium nitride film
06/30/2009US7553366 Laser beam pattern mask and crystallization method using the same
06/30/2009US7553214 Polishing article with integrated window stripe
06/30/2009US7553208 Manufacturing method of organic electroluminescence display device
06/30/2009US7553165 Spring interconnect structures
06/30/2009US7552816 Break-away positioning conveyor mount for accommodating conveyor belt bends
06/30/2009US7552601 Optical component of quartz glass, method for producing the optical component, and use thereof
06/30/2009US7552534 Method of manufacturing an integrated orifice plate and electroformed charge plate
06/30/2009US7552532 Method for hermetically encapsulating a component
06/30/2009US7552531 Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit