Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/25/2009US20090161406 Non-volatile memory and method for fabricating the same
06/25/2009US20090161405 Data storage medium and associated method
06/25/2009US20090161291 Capacitor for Semiconductor Device and Method of Manufacturing the Same
06/25/2009US20090161290 Polysilicon structures resistant to laser anneal lightpipe waveguide effects
06/25/2009US20090161286 Electrostatic chuck support assembly
06/25/2009US20090161285 Electrostatic chuck and method of forming
06/25/2009US20090161262 Three terminal magnetic sensing device having a track width defined in a localized region by a patterned insulator and methods of making the same
06/25/2009US20090161098 Photomask mounting/housing device and resist inspection method and resist inspection apparatus using same
06/25/2009US20090161053 Process of Producing Substrate for Liquid Crystal Display Device, Substrate for Liquid Crystal Display Device, and Liquid Crystal Display Device
06/25/2009US20090161050 Lcd device and method for manufacturing the same
06/25/2009US20090161006 Image sensor, method of manufacturing the same, and camera module having the same
06/25/2009US20090160753 Display device
06/25/2009US20090160741 Electro-optic device, and tft substrate for current control and method for manufacturing the same
06/25/2009US20090160595 Compact Power Semiconductor Package and Method with Stacked Inductor and Integrated Circuit Die
06/25/2009US20090160482 Formation of a hybrid integrated circuit device
06/25/2009US20090160470 Semiconductor and method
06/25/2009US20090160431 Measuring Method, Arrangement and Software Product
06/25/2009US20090160071 Die rearrangement package structure using layout process to form a compliant configuration
06/25/2009US20090160070 Metal line in a semiconductor device
06/25/2009US20090160069 Leadless alignment of a semiconductor chip
06/25/2009US20090160068 Flip-chip package and method of forming thereof
06/25/2009US20090160065 Reconstituted Wafer Level Stacking
06/25/2009US20090160064 Semiconductor device and method for manufacturing the device
06/25/2009US20090160062 Semiconductor Devices and Methods of Manufacturing Thereof
06/25/2009US20090160060 Method of manufacturing semiconductor device
06/25/2009US20090160059 Semiconductor Device Having Improved Adhesion and Reduced Blistering Between Etch Stop Layer and Dielectric Layer
06/25/2009US20090160057 Semiconductor device and method of manufacturing the same
06/25/2009US20090160056 Semiconductor device and method for manufacturing the same
06/25/2009US20090160055 IC solder reflow method and materials
06/25/2009US20090160054 Nitride semiconductor device and method of manufacturing the same
06/25/2009US20090160053 Method of manufacturing a semiconducotor device
06/25/2009US20090160051 Semiconductor Chip, Method of Fabricating the Same and Semiconductor Chip Stack Package
06/25/2009US20090160050 Semiconductor device manufacturing method, semiconductor device and wafer
06/25/2009US20090160047 Downhole tool
06/25/2009US20090160046 Electronic device and method
06/25/2009US20090160045 Wafer level chip scale packaging
06/25/2009US20090160043 Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration
06/25/2009US20090160040 Low temperature ceramic microelectromechanical structures
06/25/2009US20090160039 Method and leadframe for packaging integrated circuits
06/25/2009US20090160037 Method of packaging integrated circuits
06/25/2009US20090160036 Package with multiple dies
06/25/2009US20090160035 Mesa semiconductor device and method of manufacturing the same
06/25/2009US20090160034 Mesa semiconductor device and method of manufacturing the same
06/25/2009US20090160031 Semiconductor Device and Method for Fabricating the Same
06/25/2009US20090160030 Methods for forming through wafer interconnects and structures resulting therefrom
06/25/2009US20090160028 Method for forming gaps in micromechanical device and micromechanical device
06/25/2009US20090160027 Methods of Manufacturing Semiconductor Devices and Optical Proximity Correction
06/25/2009US20090160026 Nitride semiconductor free-standing substrate and method for making same
06/25/2009US20090160023 Semiconductor device and manufacturing method thereof
06/25/2009US20090160022 Method of fabricating mim structure capacitor
06/25/2009US20090160021 Corona prevention in high power MMICs
06/25/2009US20090160020 Moisture Barrier Capacitors in Semiconductor Components
06/25/2009US20090160018 Inductor and manufacturing method threof
06/25/2009US20090160017 Semiconductor device having capacitor, transistor and diffusion resistor and manufacturing method thereof
06/25/2009US20090160015 Semiconductor device and method of forming a semiconductor device
06/25/2009US20090160014 Semiconductor device and method for manufacturing the same
06/25/2009US20090160013 Semiconductor device heat dissipation structure
06/25/2009US20090160012 Semiconductor device and method for fabricating the same
06/25/2009US20090160011 Isolator and method of manufacturing the same
06/25/2009US20090160010 Semiconductor device and method for manufacturing the device
06/25/2009US20090160009 Semiconductor array and method for manufacturing a semiconductor array
06/25/2009US20090160008 Semiconductor device and method of manufacturing the same
06/25/2009US20090160004 Semiconductor device and method for manufacturing the device
06/25/2009US20090159997 Wafer level package structure and production method therefor
06/25/2009US20090159996 Method Of Producing Microsprings Having Nanowire Tip Structures
06/25/2009US20090159995 Method to deposit particles on charge storage apparatus with charge patterns and forming method for charge patterns
06/25/2009US20090159994 Semiconductor device and method of manufacturing the same
06/25/2009US20090159993 Semiconductor device and method for fabricating the same
06/25/2009US20090159992 Semiconductor device having a polysilicon electrode
06/25/2009US20090159991 Cmos devices with different metals in gate electrodes using spin on low-k material as hard mask
06/25/2009US20090159990 Semiconductor device and method of manufacturing the same
06/25/2009US20090159989 Semiconductor Device and Method of Fabricating the Same
06/25/2009US20090159988 Semiconductor device and method for manufacturing the same
06/25/2009US20090159987 Semiconductor device for reducing interference between adjoining gates and method for manufacturing the same
06/25/2009US20090159985 Integrated circuit system with contact integration
06/25/2009US20090159984 Semiconductor Device and Method for Manufacturing the Same
06/25/2009US20090159983 Non-Destructive Inline Epi Pattern Shift Monitor Using Selective Epi
06/25/2009US20090159982 Bi-CMOS Semiconductor Device and Method of Manufacturing the Same
06/25/2009US20090159981 STRAIN MODULATION IN ACTIVE AREAS BY CONTROLLED INCORPORATION OF NITROGEN AT Si-SiO2 INTERFACE
06/25/2009US20090159980 Semiconductor Device and Method of Fabricating the Same
06/25/2009US20090159978 Semiconductor device and process for manufacturing same
06/25/2009US20090159976 Integrated circuit and method for making an integrated circuit
06/25/2009US20090159972 Method of fabricating multi-gate semiconductor devices with improved carrier mobility
06/25/2009US20090159971 Printed tft and tft array with self-aligned gate
06/25/2009US20090159970 Semiconductor device and its manufacturing method
06/25/2009US20090159969 Process for manufacturing a semiconductor power device comprising charge-balance column structures and respective device
06/25/2009US20090159968 BVDII Enhancement with a Cascode DMOS
06/25/2009US20090159966 High voltage semiconductor device, method of fabricating the same, and method of fabricating the same and a low voltage semiconductor device together on a substrate
06/25/2009US20090159965 Semiconductor device and method for fabricating the same
06/25/2009US20090159964 Vertical channel transistor and method of fabricating the same
06/25/2009US20090159961 Semiconductor memory device with stacked gate including charge storage layer and control gate and method of manufacturing the same
06/25/2009US20090159958 Electronic device including a silicon nitride layer and a process of forming the same
06/25/2009US20090159957 Nonvolatile memories with laterally recessed charge-trapping dielectric
06/25/2009US20090159956 Nor flash memory and method of manufacturing the same
06/25/2009US20090159953 Method for manufacturing flash memory device
06/25/2009US20090159950 Semiconductor Device and manufacturing Method of Semiconductor Device
06/25/2009US20090159943 Image Sensor and Method for Manufacturing the Same
06/25/2009US20090159942 Image Sensor and Method for Manufacturing the Same
06/25/2009US20090159938 Method of manufacturing a semiconductor device and semiconductor device obtained with such a method
06/25/2009US20090159937 Simple Scatterometry Structure for Si Recess Etch Control