Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/30/2009US7552528 Wafer expanding device, component feeder, and expanding method for wafer sheet
06/30/2009US7552521 Method and apparatus for improved baffle plate
06/30/2009US7552503 Apparatus and method for cleaning a surface with high pressure air
06/30/2009CA2302957C Circuit chip connector and method of connecting a circuit chip
06/30/2009CA2279786C A composition and method for selectively etching a silicon nitride film
06/25/2009WO2009079657A2 High yield and high throughput method for the manufacture of integrated circuit devices of improved integrity, performance and reliability
06/25/2009WO2009079651A2 Electronic device package and method of formation
06/25/2009WO2009079586A1 Vented combinatorial processing cell
06/25/2009WO2009079565A2 Multiple chuck scanning stage
06/25/2009WO2009079517A2 Methods for isolating portions of a loop of pitch-multiplied material and related structures
06/25/2009WO2009079485A1 Phosphorus containing si epitaxial layers in n-type source/drain junctions
06/25/2009WO2009079484A1 Heterostructure variable-silicon-richness nitride for multi-level storage flash memory device
06/25/2009WO2009079473A1 Structure and method for forming trench gate transistors with low gate resistance
06/25/2009WO2009079422A1 Method and apparatus for removing contaminants from substrate
06/25/2009WO2009079398A1 Structure and method for forming hybrid substrate
06/25/2009WO2009079306A1 Method for forming trenches with wide upper portion and narrow lower portion
06/25/2009WO2009079284A1 Method and system for reducing line edge roughness during pattern etching
06/25/2009WO2009079159A2 Systems and methods to increase uniaxial compressive stress in tri-gate transistors
06/25/2009WO2009079129A1 Swapped-body ram architecture
06/25/2009WO2009079114A2 Thermal mechanical flip chip die bonding
06/25/2009WO2009079040A1 Adhesive applications using alkali silicate glass for electronics
06/25/2009WO2009078980A2 Electrode tuning method and apparatus for a layered heater structure
06/25/2009WO2009078975A2 Materials for particle removal by single-phase and two-phase media
06/25/2009WO2009078969A1 Apparatus for particle removal by single-phase and two-phase media
06/25/2009WO2009078968A1 Methods for particle removal by single-phase and two-phase media
06/25/2009WO2009078949A2 Method for using an rc circuit to model trapped charge in an electrostatic chuck
06/25/2009WO2009078921A1 Plasma reactor gas distribution plate with path splitting manifold
06/25/2009WO2009078896A1 Method for fabricating pitch-doubling pillar structures
06/25/2009WO2009078881A1 Imprint lithography apparatus and method
06/25/2009WO2009078816A1 3d integrated circuit package and method of fabrication thereof
06/25/2009WO2009078815A1 A nanostructured material loaded with noble metal particles
06/25/2009WO2009078605A2 SIC MATERIAL COMPRISING COMBINATION OF α-SIC AND β-SIC AND TWO-PART PLASMA CHAMBER CATHODE MANUFACTURED USING THE SAME
06/25/2009WO2009078503A1 Auto plasma continuous treatment apparatus of pcb
06/25/2009WO2009078502A1 Film substrate formed with fine circuit thereon and manufacturing method thereof
06/25/2009WO2009078448A1 Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solution
06/25/2009WO2009078443A1 Exposure apparatus, exposure method and device manufacturing method
06/25/2009WO2009078440A1 Adhesive sheet for bonding wafer and wafer processing method
06/25/2009WO2009078434A1 Exposure apparatus, exposure method and device manufacturing method
06/25/2009WO2009078422A1 Stage apparatus, exposure apparatus and device manufacturing method
06/25/2009WO2009078354A1 Processing method and semiconductor device manufacturing method
06/25/2009WO2009078335A1 Novel sulfonate and radiation-sensitive resin composition
06/25/2009WO2009078322A1 Composition for formation of top antireflective film, and pattern formation method using the composition
06/25/2009WO2009078310A1 Heat treatment apparatus, and method for controlling the same
06/25/2009WO2009078293A1 Liquid material vaporization apparatus
06/25/2009WO2009078289A2 Cooling fin and manufacturing method of the cooling fin
06/25/2009WO2009078275A1 Semiconductor device
06/25/2009WO2009078274A1 Integrated circuit, and semiconductor device
06/25/2009WO2009078255A1 Substrate and method for manufacturing the same
06/25/2009WO2009078254A1 Substrate and method for manufacturing the same
06/25/2009WO2009078244A1 Magnetic random access memory and magnetic random access memory initialization method
06/25/2009WO2009078231A1 Laser dicing apparatus and dicing method
06/25/2009WO2009078229A1 Semiconductor device and method for manufacturing the same
06/25/2009WO2009078225A1 Method for fabricating thin-film laminated capacitor
06/25/2009WO2009078224A1 Illumination optical system, exposure apparatus, and device manufacturing method
06/25/2009WO2009078223A1 Spatial light modulating unit, illumination optical system, aligner, and device manufacturing method
06/25/2009WO2009078221A1 Dicing sheet, method for manufacturing dicing sheet and method for manufacturing electronic component
06/25/2009WO2009078215A1 Semiconductor device manufacturing method and semiconductor device
06/25/2009WO2009078209A1 Thin-film solar cell manufacturing system and common substrate storage rack
06/25/2009WO2009078207A1 Method for pattern formation
06/25/2009WO2009078203A1 Multilayered pressure-sensitive adhesive sheet and process for producing electronic part with multilayered pressure-sensitive adhesive sheet
06/25/2009WO2009078202A1 Magnetic memory element, method for driving the magnetic memory element, and nonvolatile storage device
06/25/2009WO2009078190A1 Pattern forming method and pattern formed body
06/25/2009WO2009078154A1 Moving body system, pattern forming device, exposure apparatus, measuring instrument, and device manufacturing method
06/25/2009WO2009078149A1 Carrier concentration measuring device and carrier concentration measuring method
06/25/2009WO2009078130A1 Method for cutting work by wire saw and wire saw
06/25/2009WO2009078124A1 Epitaxial growth method
06/25/2009WO2009078123A1 Cleaning agent and cleaning method for electronic material
06/25/2009WO2009078121A1 Semiconductor substrate supporting jig and method for manufacturing the same
06/25/2009WO2009078112A1 Arithmetic amplifier and pipeline type ad converter
06/25/2009WO2009078094A1 Plasma processor
06/25/2009WO2009078069A1 Semiconductor device
06/25/2009WO2009078047A1 Testing device to test plates for electronic circuits and relative method
06/25/2009WO2009077986A1 Embedded structure for passivation integrity testing
06/25/2009WO2009077588A1 Reverse-conducting semiconductor device and method for manufacturing such a reverse-conducting semiconductor device
06/25/2009WO2009077583A1 Reverse-conducting semiconductor device and method for manufacturing such a reverse-conducting semiconductor device
06/25/2009WO2009077538A2 Process of assembly with buried marks
06/25/2009WO2009077201A2 Method and device for treating silicon wafers
06/25/2009WO2009061886A3 Tensile strained ge for electronic and optoelectronic applications
06/25/2009WO2009061353A3 Production of free-standing solid state layers by thermal processing of substrates with a polymer
06/25/2009WO2009053334A3 Method and apparatus for indirectly cooling thin components
06/25/2009WO2009052453A3 Plasma doping system with charge control
06/25/2009WO2009050675A3 Displacement device with precision position measurement
06/25/2009WO2009042636A3 Method of preparing cross-linked organic glasses for air-gap sacrificial layers
06/25/2009WO2009040707A3 Method of manufacturing a finfet
06/25/2009WO2009037108A3 Pick and place system for a semiconductor assembly device
06/25/2009WO2009036950A3 Method for fabricating a mixed orientation substrate
06/25/2009WO2009035727A9 Tem grids for determination of structure-property relationships in nanotechnology
06/25/2009WO2009032021A3 Electroplating on roll-to-roll flexible solar cell substrates
06/25/2009WO2009030662A3 Process for obtaining a hybrid substrate comprising at least one layer of a nitrided material
06/25/2009WO2008024171A8 Dram transistor with recessed gates and methods of fabricating the same
06/25/2009WO2006130721A3 Printable semiconductor structures and related methods of making and assembling
06/25/2009WO2006023753A3 System for thinning a semiconductor workpiece
06/25/2009WO2005084231A3 Germanium deposition
06/25/2009US20090164960 Semiconductor integrated circuit design system, semiconductor integrated circuit design method, and computer readable medium
06/25/2009US20090164146 Reflow Process Evaluation Device and Reflow Process Evaluation Method
06/25/2009US20090164040 Method of processing semiconductor substrate and processing apparatus
06/25/2009US20090163161 Scalable radio receiver architecture providing three-dimensional packaging of multiple receivers
06/25/2009US20090163120 Wafer grinding machine and wafer grinding method
06/25/2009US20090163042 Thermal reactor with improved gas flow distribution
06/25/2009US20090163041 Low wet etch rate silicon nitride film
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