Patents
Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974)
06/2009
06/25/2009US20090159936 Device with asymmetric spacers
06/25/2009US20090159934 Field effect device with reduced thickness gate
06/25/2009US20090159933 Integration scheme for changing crystal orientation in hybrid orientation technology (hot) using direct silicon bonded (dsb) substrates
06/25/2009US20090159932 Integration scheme for reducing border region morpphology in hybrid orientation technology (hot) using direct silicon bonded (dsb) substrates
06/25/2009US20090159930 High electron mobility transistor having self-aligned miniature field mitigating plate and protective dielectric layer and fabrication method thereof
06/25/2009US20090159929 Heterostructure device and associated method
06/25/2009US20090159927 Integrated circuit device and method for its production
06/25/2009US20090159926 Semiconductor device and method of manufacturing the same
06/25/2009US20090159923 Nitride semiconductor light emitting device, method of manufacturing nitride semiconductor light emitting device, and nitride semiconductor transistor device
06/25/2009US20090159922 Nitride semiconductor light emitting device and method of manufacturing the same
06/25/2009US20090159921 Nitride semiconductor light emitting element, nitride semiconductor light emitting device and method for manufacturing such nitride semiconductor light emitting device
06/25/2009US20090159918 Semiconductor light emitting devices and submounts and methods for forming the same
06/25/2009US20090159914 White light emitting diode (wled) and packing method thereof
06/25/2009US20090159910 Light emitting diode structure and method for fabricating the same
06/25/2009US20090159904 Light source device, light source module, and method of making the light source device
06/25/2009US20090159900 Infrared Proximity Sensor Package with Reduced Crosstalk
06/25/2009US20090159898 Semiconductor device and method of manufacturing thereof
06/25/2009US20090159897 Method for treating semiconductor processing components and components formed thereby
06/25/2009US20090159896 Silicon carbide mosfet devices and methods of making
06/25/2009US20090159894 Semiconductor device and display device
06/25/2009US20090159892 Array substrate for liquid crystal display device and method of fabricating the same
06/25/2009US20090159891 Modifying a surface in a printed transistor process
06/25/2009US20090159889 Tft substrate, display panel including the tft substrate, display device including the tft substrate, and method for manufacturing the tft substrate
06/25/2009US20090159888 Display panel and method for manufacturing the same
06/25/2009US20090159887 Thin film transistor and method of manufacturing the same
06/25/2009US20090159886 Printed tft array
06/25/2009US20090159884 Thin-film transistor, method of manufacturing the same, and display device
06/25/2009US20090159883 Test pattern for semiconductor device and method for forming the test pattern
06/25/2009US20090159882 Test Pattern of Semiconductor Device and Manufacturing Method Thereof
06/25/2009US20090159881 Semiconductor apparatus and method for manufacturing the same
06/25/2009US20090159880 Electronic device and method of manufacturing the same
06/25/2009US20090159879 Thin film transistor, method of fabricating a thin film transistor and flat panel display device having the same
06/25/2009US20090159869 Solid State Light Emitting Device
06/25/2009US20090159866 Integrated Circuits With Phase Change Devices
06/25/2009US20090159854 Suppression of non-radiative recombination in materials with deep centres
06/25/2009US20090159845 Polishing slurry, method of treating surface of gaxin1-xasyp1-y crystal and gaxin1-xasyp1-y crystal substrate
06/25/2009US20090159566 Method and apparatus for controlling temperature of a substrate
06/25/2009US20090159561 Integrated device technology using a buried power buss for major device and circuit advantages
06/25/2009US20090159440 Batch-Type Remote Plasma Processing Apparatus
06/25/2009US20090159423 Asymmetrical RF Drive for Electrode of Plasma Chamber
06/25/2009US20090159214 Microwave plasma source and plasma processing apparatus
06/25/2009US20090159122 Leadframe Receiver Package
06/25/2009US20090159116 Interconnector, solar cell string using the interconnector and method of manufacturing thereof, and a solar cell module using the solar cell string
06/25/2009US20090159005 Coatings for semiconductor processing equipment
06/25/2009US20090158564 Electronic component manufacturing apparatus
06/25/2009DE60320191T2 Ferromagnetischer Raumtemperatur-Halbleiter und Plasma unterstützte Molekularstrahlepitaxie wie Verfahren zu seiner Herstellung Room temperature ferromagnetic semiconductor and plasma-assisted molecular beam epitaxy as method for its preparation
06/25/2009DE212007000078U1 Züchtungsmanipulator Breeding manipulator
06/25/2009DE19954351B4 Halbleiterbauelement Semiconductor device
06/25/2009DE10212371B4 Verfahren zur Herstellung eines Halbleiterbauelementes A process for producing a semiconductor device
06/25/2009DE102008063716A1 Wafer-Schleifmaschine und Wafer-Schleifverfahren Wafer grinding and wafer grinding process
06/25/2009DE102008062699A1 Substratbearbeitungsvorrichtung; Substrate processing apparatus; Substratbearbeitungsverfahren und Speichermedium Substrate processing method and storage medium
06/25/2009DE102008061479A1 Sensormodul und Verfahren zum Herstellen eines Sensormoduls Sensor module and method of manufacturing a sensor module
06/25/2009DE102008061068A1 Elektronikbauelement Electronic component
06/25/2009DE102008059846A1 Drain-Erweiterter Feldeffekttransistor Extended drain field effect transistor
06/25/2009DE102008059359A1 Vorrichtung zum Detektieren der Kanten eines Werkstückes sowie Laserstrahlbearbeitungsmaschine An apparatus for detecting the edge of a workpiece and laser beam processing machine
06/25/2009DE102008058895A1 Integrierte Schaltung, die einen Sensor mit Spritzgussmagnetmaterial umfasst Integrated circuit which comprises a sensor with injection molding magnetic material
06/25/2009DE102008058835A1 Elektronikbauelement Electronic component
06/25/2009DE102008057817A1 Vorrichtung und Verfahren mit einem Lötprozess Apparatus and method with a soldering process
06/25/2009DE102008056574A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
06/25/2009DE102008014121A1 Verfahren zur Herstellung von Halbleiterchips und Halbleiterchip A process for the production of semiconductor chips and semiconductor chip
06/25/2009DE102008011282A1 Housing arrangement for e.g. LED, in display device, has housing lower part with boundary layer that is partially formed such that mechanical holding strength is generated between filler particle and housing lower part
06/25/2009DE102007063588A1 Bondvorrichtung und Verfahren zur Herstellung elektrisch leitfähiger Verbindungen Bonding apparatus and method for producing electrically conductive connections
06/25/2009DE102007063202A1 Verfahren und Vorrichtung zur Behandlung von Silizium-Wafern Method and apparatus for treatment of silicon wafers
06/25/2009DE102007063169A1 Verfahren und Anlage zum Bearbeiten bzw. Reinigen von Si-Blöcken Method and apparatus for processing or cleaning of Si-blocks
06/25/2009DE102007063017A1 Substrate holder for gas diffusion furnaces, comprises guiding devices such as cross beams for the positioning and guidance of the substrate holder in the interior of the gas diffusion furnace, and substrate recesses
06/25/2009DE102007062572A1 Ceroxid und kolloidales Siliciumdioxid enthaltende Dispersion Cerium oxide and colloidal silica dispersion containing
06/25/2009DE102007062571A1 Ceroxid und Schichtsilikat enthaltende Dispersion Cerium oxide and silicate layer containing dispersion
06/25/2009DE102007061581A1 Device for cleaning substrates for microelectronic applications, has cleaning station arranged in rotary and successive manner, where cleaning liquid is subjected to roller pairs
06/25/2009DE102007061527A1 Integrated circuit manufacturing method, involves depositing silicon layer on metallic layer, performing structuring process to form electrodes on dielectric layer, performing temperature step, and siliciding part of metallic layer
06/25/2009DE102007061141B3 Wafer i.e. silicon-wafer, edge protecting method for manufacturing of integrated circuits of semiconductor chip, involves removing mask, and producing local oxide layer by local oxidation in area in which pad-nitride layer is removed
06/25/2009DE102007060355A1 Verfahren und Vorrichtung zur Verarbeitung der von mindestens einer Kamera aufgenommenen Bilddaten der Oberfläche eines Wafers Method and device for processing the captured by at least one camera image data of the surface of a wafer
06/25/2009DE102007060186A1 Unit cell for test mask for testing sensitivity of device e.g. photomask, has adjacent base body with angular base surface, where set of linear structures comprises ends extending from base body normal to boundary line of base surface
06/25/2009DE102007040826B4 Integrierter Schaltkreis mit einer Zelle mit einer Schicht veränderbarer Resistivität und Verfahren zur Herstellung An integrated circuit comprising a cell having a variable resistivity layer and processes for preparing
06/25/2009DE102006046788B4 Verfahren zur Herstellung einer Halbleiterschaltungsanordnung A method for fabricating a semiconductor circuit arrangement
06/25/2009DE102005041285B4 Grabenstrukturhalbleitereinrichtung und Verfahren zu deren Herstellung Grave structure semiconductor device and process for their preparation
06/25/2009DE102005041257B4 Feldelektroden-Trenchtransistorstruktur mit Spannungsteiler Field electrodes trench transistor structure with voltage divider
06/25/2009DE102005033691B4 Verfahren zur Herstellung einer Basisplatte für eine Schaltungsbaugruppe, Basisplatte für eine Schaltungsbaugruppe, und Verwendung der Basisplatte für eine Schaltungsbaugruppe A process for preparing a base plate for a circuit board, base plate for a circuit package, and use of base plate for a circuit package
06/25/2009DE10004824B4 Verfahren zur Herstellung von Substraten, Magnetronquelle, Sputterbeschichtungskammer und Verwendung des Verfahrens A process for the production of substrates, magnetron Sputterbeschichtungskammer and use of the method
06/25/2009CA2808570A1 Magnetic tunnel junction device with separate read and write paths
06/25/2009CA2709384A1 Method and device for treating silicon wafers
06/24/2009EP2073316A1 Anisotropic conductive adhesive composition, anisotropic conductive film, circuit member connecting structure and method for manufacturing coated particles
06/24/2009EP2073286A1 Magnetoresistive element manufacturing method, and multi-chamber apparatus for manufacturing the magnetoresistive element
06/24/2009EP2073273A1 Power diode with trench field ring structure
06/24/2009EP2073271A1 Reverse-conducting insulated gate bipolar transistor and method for manufacturing such a reverse-conducting insulated gate bipolar transistor
06/24/2009EP2073267A1 Method of fabricating multi-gate semiconductor devices and devices obtained
06/24/2009EP2073260A2 Thin film transfer method
06/24/2009EP2073259A2 Circuit carrier, method for manufacturing a circuit carrier and bonding method
06/24/2009EP2073258A2 Conductive ball mounting method and surplus ball removing apparatus
06/24/2009EP2073257A2 Printed TFT and TFT array with self-aligned gate
06/24/2009EP2073256A1 Method for fabricating a semiconductor device and the semiconductor device made thereof
06/24/2009EP2073255A2 Diode and display device comprising diode
06/24/2009EP2073254A1 Method of forming amorphous silica coating of low dielectric constant and amorphous silica coating of low dielectric constant obtained thereby
06/24/2009EP2073253A1 Method for manufacturing electronic device using plasma reactor processing system
06/24/2009EP2073252A2 Low cost high conductance chamber
06/24/2009EP2072994A1 Method for treating germanium surfaces and solutions to be employed therein
06/24/2009EP2072639A1 Method for adhesion promotion between the nickel and nickel alloy layer and another metal or a dielectric, such as in the manufacture of lead frames for semiconductor devices
06/24/2009EP2072458A1 Verfahren zum Bilden eines Katalysators zum Wachsen von Nanoröhrchen/Nanofasern und zum horizontalen Wachsen von Nanoröhrchen/Nanofasern
06/24/2009EP2072457A1 Method of producing an electric connection, based on nanotubes, between two opposing surfaces
06/24/2009EP2072167A2 Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus
06/24/2009EP1831925A4 Method for forming self-aligned dual fully silicided gates in cmos devices