| Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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| 07/02/2009 | US20090170232 Method for manufacturing iamge sensor |
| 07/02/2009 | US20090170231 Method of producing mechanical components of mems or nems structures made of monocrystalline silicon |
| 07/02/2009 | US20090170230 Manufacturing method of display apparatus and manufacturing apparatus |
| 07/02/2009 | US20090170229 Method for producing a modulated grating for an optimal reflection spectrum |
| 07/02/2009 | US20090170228 Method of forming pattern having step difference and method of making thin film transistor and liquid crystal display using the same |
| 07/02/2009 | US20090170227 Mask and container and manufacturing |
| 07/02/2009 | US20090170226 Package for a Semiconductor Light Emitting Device |
| 07/02/2009 | US20090170225 Method for manufacturing semiconductor light emitting device |
| 07/02/2009 | US20090170223 Methods for calibrating a process for growing an epitaxial silicon film and methods for growing an epitaxial silicon film |
| 07/02/2009 | US20090170222 Control of implant critical dimensions using an sti step height based dose offset |
| 07/02/2009 | US20090170221 Etch residue reduction by ash methodology |
| 07/02/2009 | US20090170035 Method for fabricating semiconductor device |
| 07/02/2009 | US20090170034 Method for manufacturing semiconductor device |
| 07/02/2009 | US20090170014 Mask, exposure apparatus and device manufacturing method |
| 07/02/2009 | US20090169919 Device with graphene layers |
| 07/02/2009 | US20090169814 Method for manufacturing diamond monocrystal having a thin film, and diamond monocrystal having a thin film |
| 07/02/2009 | US20090169726 Body having a junction and method of manufacturing the same |
| 07/02/2009 | US20090169346 Semiconductor wafer carrier blade |
| 07/02/2009 | US20090169344 Substrate processing apparatus and substrate processing method |
| 07/02/2009 | US20090169343 Drive Apparatus of Substrate Carrying Robot Including Cooling Circulation Path |
| 07/02/2009 | US20090169342 Load port |
| 07/02/2009 | US20090169190 Heating system and method for microfluidic and micromechanical applications |
| 07/02/2009 | US20090169093 Pattern inspection method and its apparatus |
| 07/02/2009 | US20090169035 Single Die MEMS Acoustic Transducer and Manufacturing Method |
| 07/02/2009 | US20090168827 Nitride semiconductor laser chip and method of fabricating same |
| 07/02/2009 | US20090168825 Light-emitting element assembly and method for manufacturing the same |
| 07/02/2009 | US20090168824 Semiconductor Laser Light Emitting Device and Method for Manufacturing Same |
| 07/02/2009 | US20090168529 Nonvolatile semiconductor memory device, method for manufacturing the same, and nonvolatile memory array |
| 07/02/2009 | US20090168498 Spacer patterned augmentation of tri-gate transistor gate length |
| 07/02/2009 | US20090168493 Semiconductor memory device with stacked memory cell and method of manufacturing the stacked memory cell |
| 07/02/2009 | US20090168492 Two terminal nonvolatile memory using gate controlled diode elements |
| 07/02/2009 | US20090168491 Memory cell that employs a selectively fabricated carbon nano-tube reversible resistance-switching element and methods of forming the same |
| 07/02/2009 | US20090168480 Three dimensional hexagonal matrix memory array |
| 07/02/2009 | US20090168390 Directing the flow of underfill materials using magnetic particles |
| 07/02/2009 | US20090168386 Electronic apparatus and substrate mounting method |
| 07/02/2009 | US20090168293 Pad in Semicondcutor Device and Fabricating Method Thereof |
| 07/02/2009 | US20090168292 Electrostatic chuck and substrate temperature adjusting-fixing device |
| 07/02/2009 | US20090168291 Electrostatic chuck and substrate temperature adjusting-fixing device |
| 07/02/2009 | US20090168136 Solid-state optical modulator |
| 07/02/2009 | US20090168048 Evaluation Method and Manufacturing Method of Light-Emitting Element Material, Manufacturing Method of Light-Emitting Element, and Light-Emitting Device And Electric Appliance Having Light-Emitting Element |
| 07/02/2009 | US20090168044 Lithography apparatus and lithography method |
| 07/02/2009 | US20090167975 Liquid Crystal Display Unit Structure and Manufacturing Method Thereof |
| 07/02/2009 | US20090167974 Display substrate, display device including the display substrate and method of fabricating the display substrate |
| 07/02/2009 | US20090167343 Minimizing leakage in logic designs |
| 07/02/2009 | US20090167169 Organic light emitting diode and method for manufacturing the same |
| 07/02/2009 | US20090167163 Fabrication Method For Organic Light Emitting Device And Organic Light Emitting Device Fabricated By The Same Method |
| 07/02/2009 | US20090166899 Method of Creating an Alignment Mark on a Substrate and Substrate |
| 07/02/2009 | US20090166898 Method of increasing reliability of packaged semiconductor integrated circuit dice |
| 07/02/2009 | US20090166897 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same |
| 07/02/2009 | US20090166896 Semiconductor device and method of manufacturing semiconductor device |
| 07/02/2009 | US20090166895 Circuit substrate, circuit device and manufacturing process thereof |
| 07/02/2009 | US20090166891 Cutting and molding in small windows to fabricate semiconductor packages |
| 07/02/2009 | US20090166890 Flip-chip package |
| 07/02/2009 | US20090166889 Packaged integrated circuits having surface mount devices and methods to form packaged integrated circuits |
| 07/02/2009 | US20090166888 3-d semiconductor die structure with containing feature and method |
| 07/02/2009 | US20090166887 Semiconductor package including flip chip controller at bottom of die stack |
| 07/02/2009 | US20090166886 Mountable integrated circuit package system with intra-stack encapsulation |
| 07/02/2009 | US20090166885 Integrated circuit package with improved connections |
| 07/02/2009 | US20090166882 Method for forming metal line in semiconductor device |
| 07/02/2009 | US20090166881 Air-gap ild with unlanded vias |
| 07/02/2009 | US20090166880 Electrical bonding pad |
| 07/02/2009 | US20090166878 Semiconductor Device and Method of Fabricating the Same |
| 07/02/2009 | US20090166877 electro-optic device and a method for producing the same |
| 07/02/2009 | US20090166875 Methods for preparing and devices with treated dummy moats |
| 07/02/2009 | US20090166874 Semiconductor Device and Method of Fabricating the Same |
| 07/02/2009 | US20090166873 Inter-connecting structure for semiconductor device package and method of the same |
| 07/02/2009 | US20090166872 Memory Word lines with Interlaced Metal Layers |
| 07/02/2009 | US20090166871 Metal line of semiconductor device without production of high resistance compound due to metal diffusion and method for forming the same |
| 07/02/2009 | US20090166870 Metal line of semiconductor device and method for forming the same |
| 07/02/2009 | US20090166869 Semiconductor device and method of forming metal interconnection layer thereof |
| 07/02/2009 | US20090166868 Semiconductor devices including metal interconnections and methods of fabricating the same |
| 07/02/2009 | US20090166867 Metal interconnect structures for semiconductor devices |
| 07/02/2009 | US20090166866 Contact metallization for semiconductor devices |
| 07/02/2009 | US20090166865 Manufacturable reliable diffusion-barrier |
| 07/02/2009 | US20090166864 Method to prevent copper migration in a semiconductor package |
| 07/02/2009 | US20090166863 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166862 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166861 Wire bonding of aluminum-free metallization layers by surface conditioning |
| 07/02/2009 | US20090166859 Semiconductor device and method of manufacturing the same |
| 07/02/2009 | US20090166858 Lga substrate and method of making same |
| 07/02/2009 | US20090166857 Method and System for Providing an Aligned Semiconductor Assembly |
| 07/02/2009 | US20090166854 Thermal Interface with Non-Tacky Surface |
| 07/02/2009 | US20090166852 Semiconductor packages with thermal interface materials |
| 07/02/2009 | US20090166850 High-Power Semiconductor Die Packages With Integrated Heat-Sink Capability and Methods of Manufacturing the Same |
| 07/02/2009 | US20090166849 Semiconductor chip |
| 07/02/2009 | US20090166848 Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device |
| 07/02/2009 | US20090166846 Pass-through 3d interconnect for microelectronic dies and associated systems and methods |
| 07/02/2009 | US20090166845 Integrated circuit package system with extended corner leads |
| 07/02/2009 | US20090166844 Metal cover on flip-chip matrix-array (fcmx) substrate for low cost cpu assembly |
| 07/02/2009 | US20090166839 Semiconductor stack device and mounting method |
| 07/02/2009 | US20090166835 Integrated circuit package system with interposer |
| 07/02/2009 | US20090166834 Mountable integrated circuit package system with stacking interposer |
| 07/02/2009 | US20090166833 Semiconductor unit which includes multiple chip packages integrated together |
| 07/02/2009 | US20090166831 Sensor semiconductor package and method for fabricating the same |
| 07/02/2009 | US20090166828 Etched surface mount islands in a leadframe package |
| 07/02/2009 | US20090166827 Mechanical isolation for mems devices |
| 07/02/2009 | US20090166826 Lead frame die attach paddles with sloped walls and backside grooves suitable for leadless packages |
| 07/02/2009 | US20090166825 System and Apparatus for Wafer Level Integration of Components |
| 07/02/2009 | US20090166824 Leadless package system having external contacts |
| 07/02/2009 | US20090166823 Integrated circuit package system with lead locking structure |