Patents for H01L 21 - Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof (658,974) |
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07/02/2009 | US20090170336 Method for forming pattern of semiconductor device |
07/02/2009 | US20090170335 Plasma etching method, plasma etching apparatus, control program and computer-readable storage medium |
07/02/2009 | US20090170334 Copper Discoloration Prevention Following Bevel Etch Process |
07/02/2009 | US20090170333 Shallow trench isolation etch process |
07/02/2009 | US20090170332 Processing gas supplying system and processing gas supplying method |
07/02/2009 | US20090170331 Method of forming a bottle-shaped trench by ion implantation |
07/02/2009 | US20090170330 Method of forming a micro pattern of a semiconductor device |
07/02/2009 | US20090170329 Photo mask |
07/02/2009 | US20090170328 Method for manufacturing semiconductor device and substrate processing method |
07/02/2009 | US20090170327 Method of manufacturing a semiconductor device |
07/02/2009 | US20090170326 Method of forming micro pattern of semiconductor device |
07/02/2009 | US20090170325 Method of forming a semiconductor device pattern |
07/02/2009 | US20090170324 Reducing adherence in a MEMS device |
07/02/2009 | US20090170323 Chemical mechanical polishing method and chemical mechanical polishing device |
07/02/2009 | US20090170322 Method for Manufacturing Semiconductor Device Including Vertical Transistor |
07/02/2009 | US20090170321 Method of Forming Isolation Layer of Semiconductor Memory Device |
07/02/2009 | US20090170320 Cmp system and method using individually controlled temperature zones |
07/02/2009 | US20090170319 Method of forming an interlayer dielectric material having different removal rates during cmp |
07/02/2009 | US20090170318 Method for forming pattern of semiconductor device |
07/02/2009 | US20090170317 Cmp process for processing sti on two distinct silicon planes |
07/02/2009 | US20090170316 Double patterning with single hard mask |
07/02/2009 | US20090170315 Method for Forming Tungsten Plug |
07/02/2009 | US20090170314 Method for manufacturing a semiconductor device |
07/02/2009 | US20090170313 Method for Manufacturing Semiconductor Device |
07/02/2009 | US20090170312 Method for producing a micromechanical and/or nanomechanical device with anti-bonding stops |
07/02/2009 | US20090170311 Method for fabricating contact in semiconductor device |
07/02/2009 | US20090170310 Method of forming a metal line of a semiconductor device |
07/02/2009 | US20090170309 Barrier process/structure for transistor trench contact applications |
07/02/2009 | US20090170308 Method for forming metal line of semiconductor device |
07/02/2009 | US20090170307 Method of manufacturing semiconductor device |
07/02/2009 | US20090170306 Process for filling recessed features in a dielectric substrate |
07/02/2009 | US20090170305 Method for improving electromigration lifetime for cu interconnect systems |
07/02/2009 | US20090170304 Method of manufacturing semiconductor device |
07/02/2009 | US20090170303 Methods for forming quantum dots and forming gate using the quantum dots |
07/02/2009 | US20090170302 Method for manufacturing semiconductor device having vertical transistor |
07/02/2009 | US20090170301 Method for fabricating semiconductor device |
07/02/2009 | US20090170300 Semiconductor element and manufacturing method thereof |
07/02/2009 | US20090170299 Forming a metal contact in a semiconductor device |
07/02/2009 | US20090170298 Crystal Film Fabrication |
07/02/2009 | US20090170297 Method of Fabricating Semiconductor Device Having Gate Spacer Layer With Uniform Thickness |
07/02/2009 | US20090170296 Method and apparatus for activating compound semiconductor |
07/02/2009 | US20090170295 MANUFACTURING METHOD FOR A SEMI-CONDUCTOR ON INSULATOR SUBSTRATE COMPRISING A LOCALISED Ge ENRICHED STEP |
07/02/2009 | US20090170294 Method for film depositing group iii nitride such as gallium nitride |
07/02/2009 | US20090170293 Method for manufacturing semiconductor device |
07/02/2009 | US20090170292 Method for producing semiconductor substrate and semiconductor substrate |
07/02/2009 | US20090170291 Method of fabricating an organic thin film transistor |
07/02/2009 | US20090170290 Semiconductor manufacturing method of die pick-up from wafer |
07/02/2009 | US20090170289 Wafer dividing method |
07/02/2009 | US20090170288 Method of manufacturing semiconductor device |
07/02/2009 | US20090170287 Method for manufacturing soi substrate |
07/02/2009 | US20090170286 Method for manufacturing semiconductor substrate and method for manufacturing semiconductor device |
07/02/2009 | US20090170285 Method for manufacturing bonded wafer |
07/02/2009 | US20090170284 Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device |
07/02/2009 | US20090170283 Method of Fabricating Non-Volatile Memory Device |
07/02/2009 | US20090170282 Method of Forming Isolation Layer in Semiconductor Device |
07/02/2009 | US20090170281 Method of forming isolation layer of semiconductor |
07/02/2009 | US20090170280 Method of Forming Isolation Layer of Semiconductor Device |
07/02/2009 | US20090170279 Method of preparing active silicon regions for cmos or other devices |
07/02/2009 | US20090170278 Method for fabricating semiconductor device |
07/02/2009 | US20090170277 Implant damage of layer for easy removal and reduced silicon recess |
07/02/2009 | US20090170276 Method of Forming Trench of Semiconductor Device |
07/02/2009 | US20090170275 Method for Manufacturing a Semiconductor Device |
07/02/2009 | US20090170274 Method of forming metal trench pattern in thin-film device |
07/02/2009 | US20090170273 Dual layer hard mask for block salicide poly resistor (BSR) patterning |
07/02/2009 | US20090170272 Semiconductor device and method of forming the same |
07/02/2009 | US20090170271 Transistor and method of forming the same |
07/02/2009 | US20090170270 Integration schemes to avoid faceted sige |
07/02/2009 | US20090170269 High voltage mosfet devices containing tip compensation implant |
07/02/2009 | US20090170268 Process for fabricating a semiconductor device having embedded epitaxial regions |
07/02/2009 | US20090170267 Tri-gate patterning using dual layer gate stack |
07/02/2009 | US20090170266 Method for simultaneously manufacturing semiconductor devices |
07/02/2009 | US20090170265 Method of Fabricating a Recess Gate Type Transistor |
07/02/2009 | US20090170264 Method of producing semiconductor device |
07/02/2009 | US20090170263 Method of manufacturing flash memory device |
07/02/2009 | US20090170262 Virtual ground memory array and method therefor |
07/02/2009 | US20090170261 Method for manufacturing semiconductor device having 4f2 transistor |
07/02/2009 | US20090170260 Non-Volatile Memory Cell Circuit With Programming Through Band-To-Band Tunneling And Impact Ionization Gate Current |
07/02/2009 | US20090170259 Angled implants with different characteristics on different axes |
07/02/2009 | US20090170258 Methods for full gate silicidation of metal gate structures |
07/02/2009 | US20090170257 Method of manufacturing mos transistor |
07/02/2009 | US20090170256 Annealing method for sige process |
07/02/2009 | US20090170255 Integrated circuit modification using well implants |
07/02/2009 | US20090170254 Method of Manufacturing a Semiconductor Device |
07/02/2009 | US20090170253 Method of manufacturing semiconductor device |
07/02/2009 | US20090170252 Formation method of metallic compound layer, manufacturing method of semiconductor device, and formation apparatus for metallic compound layer |
07/02/2009 | US20090170251 Fabrication of germanium nanowire transistors |
07/02/2009 | US20090170250 Transistor of semiconductor device and method of fabricating the same |
07/02/2009 | US20090170249 Compound semiconductor device and method for fabricating the same |
07/02/2009 | US20090170248 Method for manufacturing thin film transistor |
07/02/2009 | US20090170247 Magnetic particles for low temperature cure of underfill |
07/02/2009 | US20090170246 Forming a 3-d semiconductor die structure with an intermetallic formation |
07/02/2009 | US20090170245 Electronic apparatus manufacturing method |
07/02/2009 | US20090170244 Method for manufacturing a flip chip package |
07/02/2009 | US20090170243 Stacked Integrated Circuit Module |
07/02/2009 | US20090170242 System-in-Package Having Integrated Passive Devices and Method Therefor |
07/02/2009 | US20090170241 Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier |
07/02/2009 | US20090170240 Optimized Circuit Design Layout for High Performance Ball Grid Array Packages |
07/02/2009 | US20090170239 Utilizing aperture with phase shift feature in forming microvias |
07/02/2009 | US20090170236 Manufacturing method of image sensor |
07/02/2009 | US20090170233 Method for fabricating cmos image sensor |